IEC 63287-2:2023

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile

IEC 63287-2:2023 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.

Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification de la fiabilité - Partie 2: Concept de profil de mission

L’IEC 63287-2:2023 fournit des lignes directrices pour l'élaboration de plans de qualification de la fiabilité à l’aide du concept de profil de mission, sur la base des conditions environnementales et de l’utilisation prévue du produit. Le présent document n’est pas destiné aux applications militaires et spatiales.

General Information

• Status: Published
• Publication Date: 28-Mar-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 28-Apr-2023
• Completion Date: 29-Mar-2023

Standards Content (Sample)

IEC 63287-2 ®
Edition 1.0 2023-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Guidelines for reliability qualification plans –
Part 2: Concept of mission profile

Dispositifs à semiconducteurs – Lignes directrices concernant les plans de
qualification de la fiabilité –
Partie 2: Concept de profil de mission
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IEC 63287-2 ®
Edition 1.0 2023-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Guidelines for reliability qualification plans –

Part 2: Concept of mission profile

Dispositifs à semiconducteurs – Lignes directrices concernant les plans de

qualification de la fiabilité –

Partie 2: Concept de profil de mission

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01  ISBN 978-2-8322-6708-0

– 2 – IEC 63287-2:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Mission profile . 5
4.1 Concept of mission profile . 5
4.2 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (1) . 6
4.3 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (2) . 8
4.4 Example of reliability test plan considering the mission profile of automotive
cabin peripherals application . 9
5 Calculation examples of mission profiles (Calculation of sample and test time of
life tests) . 10
Bibliography . 15

Figure 1 – Example of mission profile for automotive application . 6

Table 1 – Trial calculation example of equivalent time under operating life test based
on consideration of the mission profile (automotive application in the engine
peripheral) . 7
Table 2 – Trial calculation example of number of samples/test time of operating life
test with consideration of the mission profile (Automotive application in the engine
peripheral) . 7
Table 3 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the engine peripheral) . 8
Table 4 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (Automotive application in the engine peripheral) . 9
Table 5 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the cabin peripheral) . 9
Table 6 – Trial calculation example of number of samples/test time of high temperature
operating life test with consideration of the mission profile (Automotive application in
the cabin peripheral) . 10
Table 7 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 11
Table 8 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
GUIDELINES FOR RELIABILITY QUALIFICATION PLANS –

Part 2: Concept of mission profile

FOREWORD
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IEC 63287 Part 2 has been prepared by IEC technical committee 47: Semiconductor devices.
It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2796/FDIS 47/2803/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 63287-2:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
This International Standard is to be read in conjunction with IEC 63287-1.
A list of all parts in the IEC 63287 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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