IEC TR 62258-8:2008

Semiconductor die products - Part 8: EXPRESS model schema for data exchange

IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

General Information

• Status: Published
• Publication Date: 13-May-2008
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 3 - TC 47/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 15-Sep-2008
• Completion Date: 14-May-2008

Standards Content (Sample)

IEC/TR 62258-8
Edition 1.0 2008-05
TECHNICAL
REPORT
Semiconductor die products –
Part 8: EXPRESS model schema for data exchange

IEC/TR 62258-8:2008(E)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: [e-mail]
Tel.: [phone]
Fax: [phone]
IEC/TR 62258-8
Edition 1.0 2008-05
TECHNICAL
REPORT
Semiconductor die products –
Part 8: EXPRESS model schema for data exchange

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.080.99 ISBN 2-8318-9779-3

– 2 – TR 62258-8 © IEC:2008(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references.6
3 Terms and definitions .7
4 General .7
5 Data exchange .7
Annex A (normative) EXPRESS model schema .8
Annex B (informative) STEP physical file example .25

TR 62258-8 © IEC:2008(E) – 3–
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 8: EXPRESS model schema for data exchange

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-8, which is a technical report, has been prepared by subcommittee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1927/DTR 47/1952/RVC
Full information on the voting for the approval of this technical report can be found in the report
on voting indicated in the above table.

– 4 – TR 62258-8 © IEC:2008(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62258 series, under the general title Semiconductor die products,
can be found on the IEC website. Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until the

maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

TR 62258-8 © IEC:2008(E) – 5–
INTRODUCTION
th
This technical report is based on the work carried out in the ESPRIT 4 Framework project
GOODDIE which resulted in the publication of the ES 59008 series of European specifications.
Organisations that helped prepare this document included the ESPRIT ENCAST project, the
Die Products Consortium, JEITA, JEDEC and ZVEI.

– 6 – TR 62258-8 © IEC:2008(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 8: EXPRESS model schema for data exchange

1 Scope
This part of IEC 62258, which is a technical report, has been developed to facilitate the
production, supply and use of semiconductor die products, including
• wafers,
• singulated bare die,
• die and wafers with attached connection structures,
• minimally or partially encapsulated die and wafers.
This Technical Report contains an EXPRESS model schema that describes the elements
needed for data exchange and that will allow the implementation of the requirements of the
IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange
structure that is complementary to those defined in IEC 62258-2. It is also complementary to
and compatible with the questionnaire in IEC 62258-4.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 62258-1, Semiconductor die products – Part 1: Requirements for procurement and use
IEC 62258-2, Semiconductor die products – Part 2: Exchange data formats
IEC/TR 62258-4, Semiconductor die products – Part 4: Questionnaire for die users and
suppliers
IEC 62258-5, Semiconductor die products – Part 5: Requirements for information concerning
electrical simulation
IEC 62258-6, Semiconductor die products – Part 6: Requirements for information concerning
thermal simulation
ISO 10303-11:2004, Industrial automation systems and integration – Product data
representation and exchange – Part 11: Description methods: The EXPRESS language
reference manual
ISO 10303-21:2002, Industrial automation systems and integration – Product data
representation and exchange – Part 21: Implementation methods: Clear text encoding of the
exchange structure
TR 62258-8 © IEC:2008(E) – 7–
3 Terms and definitions
For the purposes of this document, relevant terms, which are defined in IEC 60050 together
with additional terms and acronyms as given in IEC 62258-1 apply.
4 General
The EXPRESS model schema given in this Technical Report complies with ISO 10303-11 and
allows for exchange of data on die devices using the STEP Physical File format (SPF) as
defined in ISO 10303-21.
To comply with IEC 62258-1, that standard requires that suppliers of die devices shall furnish
information that is necessary and sufficient for users of die devices at all stages of design,
procurement, manufacture and test of products containing them. The EXPRESS model schema
at Annex A defines an exchange mechanism for structuring such information using a
representation that complies with the schema and as such is intended as an aid to compliance
with the standard.
Whilst it is expected that much of the information supplied will be in the public domain and
available from such sources as manufacturers’ data sheets, neither the standard nor the
schema places an obligation on a supplier to make information public. Any information that a
supplier considers to be proprietary or commercially sensitive may be supplied under the terms
of a non-disclosure agreement.
5 Data exchange
The EXPRESS model schema at Annex A implements all the entities as defined by
IEC 62258-2 for the DDX format. In addition, it includes additional entities extending the range
of that data as follows:
• Expansion of data on organisations (manufacturer, supplier etc.) to include addresses and
contacts
• Sub-division of some entities to make their values clearer.
Annex B contains an example of a STEP Physical File based on the model schema using a
fictitious example similar to that employed in IEC 62258-2, extended to cover additional data
requirements. It is possible that software may be available for conversion of data produced
using the spreadsheet associated with IEC 62258-4 into this format. In any case, a wide range
of tools is available commercially for handling and processing STEP files.
The electronic form of the schema contained in this Technical Report may be downloaded from
the IEC website. The copyright conditions applying to the use of the electronic file are those
that apply to IEC database standards, which permit the use of such information in electronic
form for bona-fide e-commerce but do not permit its sale to third parties or other commercial
use.
– 8 – TR 62258-8 © IEC:2008(E)
Annex A
(normative)
EXPRESS model schema
A.1 General
This Annex contains the full EXPRESS listing of the schema, annotated with comments and
explanatory text. The order of text in this clause is determined primarily by the order imposed
by the EXPRESS language, secondarily by importance.
*)
SCHEMA ddx_schema_version_2_0;
(*
A.2 Type definitions
This clause contains definitions for the types used within this EXPRESS model.
*)
TYPE date_type = STRING(10) FIXED;
END_TYPE;
TYPE text_type = STRING(255);
END_TYPE;
TYPE geometric_unit_type
= ENUMERATION OF (micron, metre, millimetre, inch, mil);
END_TYPE;
TYPE geometric_view_value
= ENUMERATION OF (top,bottom);
END_TYPE;
(*
** A distance in the corresponding "geometric_unit".
*)
TYPE geometric_value = REAL;
END_TYPE;
TYPE integer_value = INTEGER;
WHERE
non_negative: SELF >= 0;
END_TYPE;
(*
Formal propositions:
non_negative: The integer is non-negative.
*)
TYPE angle_value
= INTEGER;
WHERE
valid_value:
...