IEC 60749-11:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 11: Variations rapides de température - Méthode des deux bains

General Information

• Status: Published
• Publication Date: 29-Jan-2003
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Current Stage: PPUB - Publication issued
• Start Date: 28-Feb-2003
• Completion Date: 30-Jan-2003

Relations

• Corrects: IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
• Effective Date: 05-Sep-2023
• Corrected By: IEC 60749-11:2002/COR2:2003 - Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
• Effective Date: 05-Sep-2023

Standards Content (Sample)

CEI 60749-11 IEC 60749-11
(Première édition – 2002) (First edition – 2002)
Dispositifs à semiconducteurs – Semiconductor devices –
Méthodes d’essais mécaniques et climatiques – Mechanical and climatic test methods –
Partie 11: Variations rapides de température – Part 11: Rapid change of temperature –
Méthode des deux bains Two-fluid-bath method
CORRIGENDUM 1
Page 10 Page 11
Tableau 1 – Tolérances de tempé
...