IEC PAS 62161:2000
(Main)Steady state temperature humidity bias life test
Steady state temperature humidity bias life test
Aims at evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. Employs conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it.
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Standards Content (Sample)
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Edition 1.0
2000-08
Steady state temperature humidity
bias life test
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62161
C O MMI S S I O N
Copyright © 1997, JEDEC; 2000, IEC
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
STEADY STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62161 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1461/PAS 47/1494/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
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determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
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3) The documents produced have the form of recommendations for international use and are published in the form of
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transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1997, JEDEC; 2000, IEC
JEDEC Standard No. 22-A101-B
Page 1
Test Method A101-B Steady State Temperature Humidity Bias Life Test
(From JEDEC Council Ballot JCB-96-64, formulated under the cognizance of JC-14.1
Committee on Reliability Test Methods for Packaged Devices.)
1 Purpose
The Steady-State Temperature Humidity Bias Life Test is peformed for the purpose of
evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. It
employs conditions of temperature, humidity, and bias which accelerate the penetration of
moisture through the external protective material (encapsulant or seal) or along the inteface
between the external protective material and the metallic conductors which pass through it.
2 Apparatus
The test requires a temperature-humidity test chamber capable of maintaining a specified
temperature and relative humidity continuously, while providing electrical connections to the
devices under test in a specified biasing configuration.
2.1 Temperature and relative humidity
The chamber must be capable of providing controlled conditions of temperature and relative
humidity during ramp-up to, and ramp-down from the specified test conditions.
2.2 Devices under stress
Devices under stress must be physically located to minimize temperature gradients.
2.3 Minimize release of contamination
Care must be exercised in the choice of board and socket materials, to minimize release of
contamination, and to minimize degradation due to corrosion and other mechanisms.
2.4 Ionic contamination
Ionic contamination of the test apparatus (card cage, test boards, sockets, wiring, storage
containers, etc.) shall be controlled to avoid test artifacts.
2.5 Deionized water
Deionized water with a minimum resistivity of 1 megohm-cm at room temperature shall be used.
Copyright © 1997, JEDEC; 2000, IEC
JEDEC Standard No. 22-A101-B
Page 2
3 Test Conditions
Test conditions consist of a temperature, relative humidity, and duration used in conjunction with
an electrical bias configuration specific to the device.
3.1 Temperature, Relative Humidity and Duration
NOTES
1 Tolerances apply to the entire useable test area.
2 For information only.
3 The test conditions are to be applied continuously except during
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