Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with device embedded substrate technology;
4) inclusion of 113 synonymous terms;
5) removal of identification codes for terms and annexes.

Conception, fabrication et assemblage de cartes imprimées - Vocabulaire - Partie 1: Usage commun des techniques d’assemblage des composants électroniques et des cartes imprimées

L’IEC 60194-1:2021 spécifie les termes et définitions étroitement associés à la technique du TC 91.
Le présent document, ainsi que l’IEC 60194-2:2017, annulent et remplacent l’IEC 60194:2015. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
1) exclusion de 32 termes généraux convenant mieux à d’autres comités techniques;
2) exclusion de 47 termes qui ne sont plus utilisés dans le secteur de l’assemblage de composants électroniques;
3) inclusion de 14 nouveaux termes liés à la technique pour les substrats avec appareils intégrés;
4) inclusion de 113 termes synonymes;
5) suppression des codes d’identification des termes et des annexes.

General Information

Status
Published
Publication Date
08-Feb-2021
Current Stage
PPUB - Publication issued
Completion Date
09-Feb-2021
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IEC 60194-1
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed boards design, manufacture and assembly – Vocabulary –
Part 1: Common usage in printed board and electronic assembly technologies
Conception, fabrication et assemblage de cartes imprimées – Vocabulaire –
Partie 1: Usage commun des techniques d’assemblage des composants
électroniques et des cartes imprimées
IEC 60194-1:2021-02(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60194-1
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed boards design, manufacture and assembly – Vocabulary –
Part 1: Common usage in printed board and electronic assembly technologies
Conception, fabrication et assemblage de cartes imprimées – Vocabulaire –
Partie 1: Usage commun des techniques d’assemblage des composants
électroniques et des cartes imprimées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9353-9

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60194-1:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 5

INTRODUCTION ..................................................................................................................... 7

1 Scope .............................................................................................................................. 8

2 Normative references ...................................................................................................... 8

3 Terms and definitions ...................................................................................................... 8

3.1 A ............................................................................................................................. 8

3.2 B ........................................................................................................................... 20

3.3 C .......................................................................................................................... 35

3.4 D .......................................................................................................................... 59

3.5 E ........................................................................................................................... 69

3.6 F ........................................................................................................................... 78

3.7 G .......................................................................................................................... 89

3.8 H .......................................................................................................................... 92

3.9 I ............................................................................................................................ 99

3.10 J ......................................................................................................................... 104

3.11 K ......................................................................................................................... 105

3.12 L ......................................................................................................................... 106

3.13 M ........................................................................................................................ 113

3.14 N ........................................................................................................................ 121

3.15 O ........................................................................................................................ 125

3.16 P ......................................................................................................................... 130

3.17 Q ........................................................................................................................ 146

3.18 R ........................................................................................................................ 147

3.19 S ......................................................................................................................... 157

3.20 T ......................................................................................................................... 179

3.21 U ........................................................................................................................ 190

3.22 V ......................................................................................................................... 192

3.23 W ........................................................................................................................ 196

3.24 X ......................................................................................................................... 201

3.25 Y ......................................................................................................................... 201

3.26 Z ......................................................................................................................... 201

Figure 1 – Access hole ........................................................................................................... 9

Figure 2 – Alignment mark .................................................................................................... 12

Figure 3 – Lands with anchoring spurs .................................................................................. 14

Figure 4 – Annular ring (annular width) ................................................................................. 15

Figure 5 – Area array ............................................................................................................ 16

Figure 6 – Simplified flow chart of printed board design/fabrication sequence ....................... 17

Figure 7 – Aspect ratio (hole) ................................................................................................ 18

Figure 8 – Asymmetric stripline ............................................................................................. 19

Figure 9 – Axial lead ............................................................................................................. 20

Figure 10 – Back bonding ..................................................................................................... 20

Figure 11 – Back-bared land ................................................................................................. 20

Figure 12 – Barrel crack ........................................................................................................ 22

Figure 13 – Example of feature location using baseline dimensions ...................................... 23

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IEC 60194-1:2021 © IEC 2021 – 3 –

Figure 14 – Bathtub curve ..................................................................................................... 24

Figure 15 – Beam-lead device .............................................................................................. 25

Figure 16 – Bifurcated solder terminal................................................................................... 26

Figure 17 – Buried via and blind via ...................................................................................... 27

Figure 18 – Bow .................................................................................................................... 30

Figure 19 – Breakaway ......................................................................................................... 31

Figure 20 – But plating joint (wrap plating) ............................................................................ 34

Figure 21 – Button plating ..................................................................................................... 35

Figure 22 – Castellation ........................................................................................................ 37

Figure 23 – Centre-to-centre spacing (pitch) ......................................................................... 38

Figure 24 – Typical characteristic curve ................................................................................ 39

Figure 25 – Clearance hole ................................................................................................... 41

Figure 26 – Clinched-wire through connection....................................................................... 42

Figure 27 – Comb pattern ..................................................................................................... 44

Figure 28 – Conductor Base Spacing .................................................................................... 47

Figure 29 – Conductor spacing ............................................................................................. 48

Figure 30 – Contact angle (soldering) ................................................................................... 50

Figure 31 – Crosshatching .................................................................................................... 57

Figure 32 – Cup solder terminal ............................................................................................ 58

Figure 33 – Dewetting ........................................................................................................... 63

Figure 34 – Example of an embedded component ................................................................. 72

Figure 35 – Embedded passive component (device) ............................................................. 73

Figure 36 – Etch factor ......................................................................................................... 75

Figure 37 – Etchback ............................................................................................................ 76

Figure 38 – Etching indicator ................................................................................................ 76

Figure 39 – Fillet, adhesive ................................................................................................... 82

Figure 40 – Flag ................................................................................................................... 84

Figure 41 – Flare .................................................................................................................. 84

Figure 42 – Ground plane clearance ..................................................................................... 91

Figure 43 – Head on pillow ................................................................................................... 93

Figure 44 – Heel fillet ............................................................................................................ 94

Figure 45 – Knee hole ........................................................................................................... 95

Figure 46 – Hole breakout ..................................................................................................... 96

Figure 47 – Hole void ............................................................................................................ 97

Figure 48 – Hook .................................................................................................................. 97

Figure 49 – Hook solder terminal .......................................................................................... 98

Figure 50 – Icicle .................................................................................................................. 99

Figure 51 – Layer-to-layer spacing ...................................................................................... 109

Figure 52 – Magnification power parameters ....................................................................... 113

Figure 53 – Meniscus .......................................................................................................... 115

Figure 54 – Microstrip ......................................................................................................... 117

Figure 55 – Mirrored pattern ............................................................................................... 118

Figure 56 – Nail heading ..................................................................................................... 121

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– 4 – IEC 60194-1:2021 © IEC 2021

Figure 57 – Negative etchback ............................................................................................ 122

Figure 58 – Nonfunctional interfacial connection ................................................................. 123

Figure 59 – Nonwetting ....................................................................................................... 124

Figure 60 – Normal distribution ........................................................................................... 125

Figure 61 – Open point ....................................................................................................... 127

Figure 62 – Outgrowth, overhang and undercut................................................................... 128

Figure 63 – Outgrowth, overhang and undercut................................................................... 129

Figure 64 – Overlap ............................................................................................................ 129

Figure 65 – Perforated (pierced) solder terminal ................................................................. 133

Figure 66 – Plated through-hole (PTH) ................................................................................ 137

Figure 67 – Primary flare .................................................................................................... 143

Figure 68 – Primary taper ................................................................................................... 143

Figure 69 – Resin recession ............................................................................................... 151

Figure 70 – Printed board viewing orientations.................................................................... 155

Figure 71 – Shadowing ....................................................................................................... 161

Figure 72 – Tape automated bonding .................................................................................. 180

Figure 73 – Tombstoned component ................................................................................... 186

Figure 74 – Turret Solder Terminal ..................................................................................... 190

Figure 75 – Via planarization .............................................................................................. 195

Figure 76 – Wrap Plating .................................................................................................... 201

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IEC 60194-1:2021 © IEC 2021 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS DESIGN, MANUFACTURE AND ASSEMBLY –
VOCABULARY –
Part 1: Common usage in printed board
and electronic assembly technologies
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

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indispensable for the correct application of this publication.

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rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60194-1 has been prepared by IEC technical committee 91:

Electronics assembly technology.

This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This

edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronic assembly industry;
c) inclusion of 14 new terms related with device embedded substrate technology;
d) inclusion of 113 synonymous terms;
e) removal of identification codes for terms and annexes.
---------------------- Page: 7 ----------------------
– 6 – IEC 60194-1:2021 © IEC 2021
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1688/FDIS 91/1705/RVD

Full information on the voting for the approval of this International Standard can be found in the

report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60194 series, published under the general title Printed boards design,

manufacture and assembly – Vocabulary, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 8 ----------------------
IEC 60194-1:2021 © IEC 2021 – 7 –
INTRODUCTION

The committee decided to split the revision of IEC 60194:2015 into two separate documents:

IEC 60194-1 and IEC 60194-2. This document is the first part of the revision (IEC 60194-1). It

is composed of terms and definitions closely related with TC 91 technology.
---------------------- Page: 9 ----------------------
– 8 – IEC 60194-1:2021 © IEC 2021
PRINTED BOARDS DESIGN, MANUFACTURE AND ASSEMBLY –
VOCABULARY –
Part 1: Common usage in printed board
and electronic assembly technologies
1 Scope

This part of IEC 60194 covers terms and definitions closely related with TC 91 technology.

2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary
3 Terms and definitions

For the purposes of electronics assembly technology, the following terms and definitions apply.

3.1 A
3.1.1
abrasion resistance
ability of a material to withstand surface wear
3.1.2
absorption coefficient

for a parallel beam of specified radiation in a given substance, the quantity μ describes the

abs
fraction of energy absorbed in passing through a thin layer of thickness Δx
Note 1 to entry: The absorption coefficient is primarily energy dependent.

Note 2 to entry: According to whether the thickness Δx is expressed in terms of length, mass per unit area, moles

per unit area or atoms per unit area, it is called the linear, mass, molar or atomic absorption coefficient.

Note 3 to entry: This entry was numbered 393-14-46 in IEC 60050-393:2003.
[SOURCE: IEC 60050-395:2014, 395-01-26]
3.1.3
absorptivity

ratio (or percentage) of the amount of energy absorbed by a substrate as compared

with the total amount of incident energy
3.1.4
accelerated equivalent soak

environmental soak of a component at a higher temperature for a shorter time (compared to the

standard soak) to provide roughly the same amount of moisture absorption
---------------------- Page: 10 ----------------------
IEC 60194-1:2021 © IEC 2021 – 9 –
Note 1 to entry: See also "soak"
3.1.5
accelerated test

test to check the life expectancy of an electronic component or electronic assembly in a short

period of time by applying physically severe condition(s) to the unit under test
3.1.6
access hole

series of holes in successive layers of a multilayer board, each set having their centres on the

same axis
SEE: Figure 1
Figure 1 – Access hole

Note 1 to entry: These holes provide access to the surface of the land on one of the layers of the board.

3.1.7
access protocol

protocol, used at the user-network interface, to enable the user to employ the services and/or

facilities of a telecommunication network
[SOURCE: IEC 60050-716:1995, 716-04-18]
3.1.8
accordion contact

type of connector contact that consists of a flat spring formed into a "Z" shape in order to permit

high deflection without overstress
3.1.9
acid flux
solution of an acid and an inorganic, organic, or water-soluble organic flux

Note 1 to entry: See also "inorganic flux", "organic flux", and "water-soluble flux".

3.1.10
acid number
acid value

number of milligrams of potassium hydroxide (KOH) required to neutralize the acid components

present in one gram of a liquid, under standardized conditions

[SOURCE: IEC 60050-212:2010, 212-18-15, modified – The term "acid value" has been used

instead of the term "neutralization value".]
---------------------- Page: 11 ----------------------
– 10 – IEC 60194-1:2021 © IEC 2021
3.1.11
acid-core solder
wire solder with a self-contained acid flux
3.1.12
acoustic microscope

equipment that creates an image using ultrasound to view a specimen's surface or subsurface

features, including defec
...

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