WG 5 - TC 91/WG 5

IEC 60194-2:2025 covers terms and definitions related to circuit board and electronic assembly technologies as well as other electronic technologies.
The terms have been classified according to the decimal classification code (DCC) and this DCC number appears just below the defined term. The DCC numbering is fully explained in Annex A.
A list of terms in alphabetical order with code number is provided in Annex B.
This edition includes the following significant technical changes with respect to the previous edition:
a) exclusion of 116 terms transferred to IEV;
b) inclusion of 9 new terms related to printed electronics and packaging technology;
c) revision of definitions of 23 terms reflecting current technology;
d) three "printed wiring" terms were removed;
e) reintroduction of identification codes for terms.

IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with device embedded substrate technology;
4) inclusion of 113 synonymous terms;
5) removal of identification codes for terms and annexes.

IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

Defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

IEC 60194:2015 defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. The main changes with respect to the previous edition are the following:
- Some two hundred terms and definitions have been updated, where applicable, and
- another two hundred new terms and definitions have been added.