Packaging of components for automatic handling - Part 5: Matrix trays

IEC 60286-5:2018 is available as IEC 60286-5:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60286-5:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60286-5:2018 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This edition includes the following significant technical changes with respect to the previous edition:
- The generic rules for the design of matrix trays are given in this document. Newly developed trays which follow these rules will not be listed individually. Only those trays which conform to the design rules set forth herein are classified as "standard trays" and are thus preferred for use.
- An update of the matrix trays, which do not conform to the design rules set forth herein, are considered as "non-standard trays" and are not preferred for use, is listed in Annex A.

Emballage de composants pour opérations automatisées - Partie 5: Supports matriciels

IEC 60286-5:2018 est disponible sous forme de IEC 60286-5:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60286-5:2018 décrit les dimensions communes, les tolérances et les caractéristiques des supports. Elle ne comprend que les dimensions qui sont essentielles pour la manipulation des supports dans le but indiqué et pour le chargement et le déchargement des composants sur ces supports. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- Les règles génériques pour la conception des supports matriciels sont données dans le présent document. Les supports mis au point récemment qui suivent ces règles ne sont pas répertoriés individuellement. Seuls les supports qui sont conformes aux règles de conception exposées ci-après sont classés comme "supports normalisés" et constituent ainsi les modèles d'utilisation préférentielle.
- Une liste mise à jour des supports matriciels qui ne sont pas conformes aux règles de conception exposées ci-après, qui sont considérés comme des "supports non normalisés" et qui ne sont pas d'utilisation préférentielle, est donnée à l'Annexe A.

General Information

Status
Published
Publication Date
24-Apr-2018
Current Stage
PPUB - Publication issued
Completion Date
25-Apr-2018
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IEC 60286-5
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 5: Matrix trays
Emballage de composants pour opérations automatisées –
Partie 5: Supports matriciels
IEC 60286-5:2018-04(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60286-5
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 5: Matrix trays
Emballage de composants pour opérations automatisées –
Partie 5: Supports matriciels
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-6301-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60286-5:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and abbreviated terms ........................................................................ 7

3.1 Terms and definitions .............................................................................................. 7

3.2 Abbreviated terms ................................................................................................... 7

4 Material ........................................................................................................................... 8

4.1 Electrostatic dissipative requirements ..................................................................... 8

4.2 Effect of properties ................................................................................................. 8

4.3 Recycling and rigidity .............................................................................................. 8

5 Mechanical stability ......................................................................................................... 8

5.1 Loaded tray ............................................................................................................. 8

5.2 Empty tray .............................................................................................................. 8

5.3 Outer edges ............................................................................................................ 8

6 Tray design, dimensions and other physical properties .................................................... 8

6.1 Tray design ............................................................................................................. 8

6.1.1 Number of pockets ........................................................................................... 8

6.1.2 Orientation of pockets ...................................................................................... 8

6.1.3 Design rules for pocket density ........................................................................ 9

6.2 Overall tray dimensions ........................................................................................ 10

6.3 Cell dimensions .................................................................................................... 10

6.4 Tray vacuum pick-up sites .................................................................................... 11

6.4.1 Size ............................................................................................................... 11

6.4.2 Centre ........................................................................................................... 11

6.4.3 Perimeter ....................................................................................................... 11

6.5 Detail features ...................................................................................................... 11

6.6 Weight .................................................................................................................. 12

6.7 Movement of components ..................................................................................... 12

6.8 Dimensional information ........................................................................................ 12

7 Polarity and orientation of components in the tray ......................................................... 15

7.1 Pin one ................................................................................................................. 15

7.2 Loading ................................................................................................................. 15

8 Tray stacking ................................................................................................................. 15

8.1 Bundling ............................................................................................................... 15

8.2 Top protection ....................................................................................................... 16

8.3 Partial filling .......................................................................................................... 16

8.4 Protrusion of components ..................................................................................... 16

8.5 Stack-up ............................................................................................................... 16

8.6 Damaging of components ...................................................................................... 16

8.7 Warpage ............................................................................................................... 16

9 Missing components ...................................................................................................... 16

10 Marking ......................................................................................................................... 16

Annex A (informative) List of existing matrix trays with wide anticipated use in the

electronic industries .............................................................................................................. 17

A.1 Matrix trays (for different packages) ...................................................................... 17

---------------------- Page: 4 ----------------------
IEC 60286-5:2018 © IEC 2018 – 3 –

A.2 Matrix trays for PGA packages .............................................................................. 25

A.2.1 Dimensional information ................................................................................ 25

A.2.2 Variation sheet PGA (pin grid array package) ................................................ 28

Annex B (normative) Measurement methodology of the tray dimensions .............................. 29

B.1 General ................................................................................................................. 29

B.2 Definition of the dimensions .................................................................................. 29

B.2.1 Outline dimensions ........................................................................................ 29

B.2.2 Tray thickness (A) .......................................................................................... 30

B.2.3 Dimensions of the stacking feature ................................................................ 31

B.2.4 Warpage ........................................................................................................ 31

B.3 Measuring instrument............................................................................................ 31

B.4 Measurement conditions ....................................................................................... 31

B.5 Measurement methodology ................................................................................... 31

B.5.1 Outline dimensions ........................................................................................ 31

B.5.2 Tray thickness (A) .......................................................................................... 32

B.5.3 Dimensions of the stacking feature ................................................................ 33

B.5.4 Warpage ........................................................................................................ 33

Annex C (normative) Matrix trays – General considerations for design (design value) .......... 34

C.1 Lateral movement of leaded devices ..................................................................... 34

C.2 Lateral movement of un-leaded devices ................................................................ 34

C.3 Lead protection ..................................................................................................... 35

Figure 1 – Sample of leaded packages ................................................................................. 11

Figure 2 – Sample of grid array packages ............................................................................. 11

Figure 3 – Tray main view ..................................................................................................... 13

Figure 4 – Tray stacking details ............................................................................................ 14

Figure 5 – Tray tolerances .................................................................................................... 14

Figure A.1 – Thin tray ........................................................................................................... 18

Figure A.2 – Thick matrix ...................................................................................................... 26

Figure B.1 – Cross-sections of the outline dimensions .......................................................... 30

Figure B.2 – Tray thickness .................................................................................................. 30

Figure B.3 – Examples of tray warpage ................................................................................. 31

Figure B.4 – Top view of a tray showing the measurement locations for the outline

dimensions ........................................................................................................................... 32

Figure B.5 – Measurement locations for tray thickness ........................................................ 32

Figure B.6 – Holding position in calliper jaws for measurement ............................................ 32

Figure B.7 – Correction of a lift of the tray at the measurement point .................................... 32

Figure B.8 – Measurement locations for the stackable design ............................................... 33

Figure B.9 – Measurement points for warpage ...................................................................... 33

Figure C.1 – Lateral movement of leaded devices A to I ....................................................... 34

Figure C.2 – Lateral movement of un-leaded devices check points A to C ............................. 34

Figure C.3 – Lateral movement of un-leaded devices check points D to F ............................. 35

Figure C.4 – Lead protection gap .......................................................................................... 35

Table 1 – P and W dimension .................................................................................................. 9

Table 2 – Height dimensions ................................................................................................. 10

---------------------- Page: 5 ----------------------
– 4 – IEC 60286-5:2018 © IEC 2018

Table 3 – Notes related to Figures 3 and 4 ........................................................................... 15

Table A.1 – Variations .......................................................................................................... 19

Table A.2 – Notes related to Figures A.1 and A.2.................................................................. 27

Table A.3 – PGA variations ................................................................................................... 28

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IEC 60286-5:2018 © IEC 2018 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 5: Matrix trays
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60286-5 has been prepared by IEC technical committee 40:

Capacitors and resistors for electronic equipment.
This third edition cancels and replaces the second edition published in 2003 and
Amendment 1:2009. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) The generic rules for the design of matrix trays are given in this document. Newly

developed trays which follow these rules will not be listed individually. Only those trays

which conform to the design rules set forth herein are classified as "standard trays" and

are thus preferred for use.

b) An update of the matrix trays, which do not conform to the design rules set forth herein,

are considered as "non-standard trays" and are not preferred for use, is listed in Annex A.

---------------------- Page: 7 ----------------------
– 6 – IEC 60286-5:2018 © IEC 2018

This bilingual version (2018-11) corresponds to the monolingual English version, published in

2018-04.
The text of this International Standard is based on the following documents:
CDV Report on voting
40/2556/CDV 40/2597/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.
The French version of this standard has not been voted upon.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60286 series, published under the general title Packaging of

components for automatic handling, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 8 ----------------------
IEC 60286-5:2018 © IEC 2018 – 7 –
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 5: Matrix trays
1 Scope

This part of IEC 60286 describes the common dimensions, tolerances and characteristics of

the tray. It includes only those dimensions that are essential for the handling of the trays for

the stated purpose and for placing or removing components from the trays.

Matrix trays are designed to facilitate the transport and handling of electronic components

during their testing, baking, transport/storage, and final mounting by automatic placement

equipment.

The generic rules for their design are given in this document. Newly developed trays that

follow these rules will not be listed individually. Only those trays that conform to the design

rules set forth herein are classified as "standard trays" and are thus preferred for use.

NOTE Matrix trays listed in Annex A that do not conform to the design rules set forth herein shall be considered

as "non-standard trays" and are not preferred for use.
2 Normative references
There are no normative references in this document.
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
No terms and definitions are listed in this document.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2 Abbreviated terms
The following are the abbreviated terms used in Table A.1 and Table A.3.
ball grid array (ball grid array type package) BGA
ceramic quad flat package (ceramic quad flat type package) CQFP
metric quad flat package (metric quad flat type package) MQFP
plastic leaded chip carrier (plastic leaded type chip carrier) PLCC
plastic quad flat package (plastic quad flat type package) PQFP
thin quad flat package (thin quad flat type package) TQFP
small outline j-leaded package (small outline j-leaded type package) SOJ
type 1 thin small outline package (thin small outline type package1) TSOP (I)
type 2 thin small outline package (thin small outline type package2) TSOP (II)
---------------------- Page: 9 ----------------------
– 8 – IEC 60286-5:2018 © IEC 2018
4 Material
4.1 Electrostatic dissipative requirements

Trays shall be moulded from material that meets the ESD dissipative requirements with

ohms/square but less than
surface resistance equal to or greater than 1,0 × 10
−11
1,0 × 10 ohms/square.
4.2 Effect of properties

The tray material shall not adversely affect the mechanical, electrical characteristics,

solder-ability, or marking of the component during or after transport, baking or storage in the

tray.
4.3 Recycling and rigidity

The tray material shall be reusable or recyclable and shall be rigid enough to avoid damage to

the components during handling, loading, baking, testing, shipping and placement operations.

There should be space for a recycle logo and material code or material declaration close to

'Detail B'.
5 Mechanical stability
5.1 Loaded tray

Mechanical stability of loaded trays shall be such that the components are adequately

retained, without lead/terminal damage, and can be easily removed from the tray.
5.2 Empty tray

The empty tray shall withstand normal environmental conditions (including component baking

temperatures, if required) without distorting, warping, expanding, shrinking or any other

physical change outside the specified dimensions of the trays.
5.3 Outer edges

The outer edges of the tray shall be of sufficient thickness and strength to allow mechanical

positioning and clamping.
6 Tray design, dimensions and other physical properties
6.1 Tray design
6.1.1 Number of pockets

All new tray proposals should maximize the number of pockets in each tray-family variation

without violating the pocket-density design rules specified in 6.1.3.
6.1.2 Orientation of pockets

When designing a tray for a rectangular package, the longest dimension (D) of the package is

oriented parallel to the length of the tray to maximize tray pocket density.
---------------------- Page: 10 ----------------------
IEC 60286-5:2018 © IEC 2018 – 9 –
6.1.3 Design rules for pocket density
6.1.3.1 Formulas
DT is D + strengthening pocket rib width W
max
ET is E " + strengthening pocket rib width W
max
M is (135,9 mm − M3(N1 − 1))/2
M1 is (315,0 mm − M2(N2 − 1))/2
M2 is [(315,0 mm − 2P mm) − W(N2 − 1)]/N2 + W
M3 is [(135,9 mm − 2P mm) − W(N1 − 1)]/N1 + W
N1 is (135,9 mm − 2P mm)/ET (rounded down to a whole number)
N2 is (315,0 mm − 2P mm)/DT (rounded down to a whole number)

NOTE 1 After the maximum matrix has been established by the above calculation using a minimum W value, N1

and N2 may not have resulted in even numbers and may therefore have been rounded down to the nearest whole

number. This means we may have fractions of millimetres extra that should be added back to M2 and M3 to

maximize the pitch between the pockets while minimizing the edge of the tray to the centre line of the first pocket

M and M1.

NOTE 2 For component sizes < (7 × 7) mm high density can cause difficulties for inspection and risks for handling.

NOTE 3 See Annex C for further information about tray design considerations.
The dimensions P and W are given in Table 1.
Table 1 – P and W dimension
Dimension Thin tray Thick tray
Normal stacking tray Low stacking tray mm
mm mm
P 3,2 5,0 5,0
W 2,0 2,5 2,0
6.1.3.2 Constituents of the design rules, formulas and drawings
D is determined by appropriate specification
max
DT is the max. length D + strengthening pocket rib width W
E is determined by appropriate specification
max
ET is the max. width E + strengthening pocket rib width W
M is the edge of the tray width to the centre line of the first pocket
M1 is the edge of the tray length to the centre line of the first pocket
M2 is the pitch of the tray pocket in the tray length
M3 is the pitch of the tray pocket in the tray width
N is the package pin counts supported
N1 is the number of columns in the tray
N2 is the number of rows in the tray
N3 is the total number of pockets in the tray (N1 × N2 = N3)
N4 is the package type accommodated
N5 i
...

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