IEC 60286-5:2018

Packaging of components for automatic handling - Part 5: Matrix trays

IEC 60286-5:2018 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This edition includes the following significant technical changes with respect to the previous edition:
- The generic rules for the design of matrix trays are given in this document. Newly developed trays which follow these rules will not be listed individually. Only those trays which conform to the design rules set forth herein are classified as "standard trays" and are thus preferred for use.
- An update of the matrix trays, which do not conform to the design rules set forth herein, are considered as "non-standard trays" and are not preferred for use, is listed in Annex A.

Emballage de composants pour opérations automatisées - Partie 5: Supports matriciels

L'IEC 60286-5:2018 décrit les dimensions communes, les tolérances et les caractéristiques des supports. Elle ne comprend que les dimensions qui sont essentielles pour la manipulation des supports dans le but indiqué et pour le chargement et le déchargement des composants sur ces supports. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- Les règles génériques pour la conception des supports matriciels sont données dans le présent document. Les supports mis au point récemment qui suivent ces règles ne sont pas répertoriés individuellement. Seuls les supports qui sont conformes aux règles de conception exposées ci-après sont classés comme "supports normalisés" et constituent ainsi les modèles d'utilisation préférentielle.
- Une liste mise à jour des supports matriciels qui ne sont pas conformes aux règles de conception exposées ci-après, qui sont considérés comme des "supports non normalisés" et qui ne sont pas d'utilisation préférentielle, est donnée à l'Annexe A.

General Information

• Status: Published
• Publication Date: 24-Apr-2018
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.020 - Electronic components in general
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60286-5 - TC 40/MT 60286-5
• Current Stage: PPUB - Publication issued
• Start Date: 09-May-2018
• Completion Date: 25-Apr-2018

Relations

• Revises: IEC 60286-5:2003 - Packaging of components for automatic handling - Part 5: Matrix trays
• Effective Date: 05-Sep-2023
• Revises: IEC 60286-5:2003/AMD1:2009 - Amendment 1 - Packaging of components for automatic handling - Part 5: Matrix trays
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60286-5 ®
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
Packaging of components for automatic handling –
Part 5: Matrix trays
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

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IEC 60286-5 ®
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
Packaging of components for automatic handling –

Part 5: Matrix trays
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020 ISBN 978-2-8322-5617-6

– 2 – IEC 60286-5:2018 © IEC 2018
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 Material . 8
4.1 Electrostatic dissipative requirements . 8
4.2 Effect of properties . 8
4.3 Recycling and rigidity . 8
5 Mechanical stability . 8
5.1 Loaded tray . 8
5.2 Empty tray . 8
5.3 Outer edges . 8
6 Tray design, dimensions and other physical properties . 8
6.1 Tray design . 8
6.1.1 Number of pockets . 8
6.1.2 Orientation of pockets . 8
6.1.3 Design rules for pocket density . 9
6.2 Overall tray dimensions . 10
6.3 Cell dimensions . 10
6.4 Tray vacuum pick-up sites . 11
6.4.1 Size . 11
6.4.2 Centre . 11
6.4.3 Perimeter . 11
6.5 Detail features . 11
6.6 Weight . 12
6.7 Movement of components . 12
6.8 Dimensional information . 12
7 Polarity and orientation of components in the tray . 15
7.1 Pin one . 15
7.2 Loading . 15
8 Tray stacking . 15
8.1 Bundling . 15
8.2 Top protection . 16
8.3 Partial filling . 16
8.4 Protrusion of components . 16
8.5 Stack-up . 16
8.6 Damaging of components . 16
8.7 Warpage . 16
9 Missing components . 16
10 Marking . 16
Annex A (informative) List of existing matrix trays with wide anticipated use in the
electronic industries . 17
A.1 Matrix trays (for different packages) . 17

A.2 Matrix trays for PGA packages . 25
A.2.1 Dimensional information . 25
A.2.2 Variation sheet PGA (pin grid array package) . 28
Annex B (normative) Measurement methodology of the tray dimensions . 29
B.1 General . 29
B.2 Definition of the dimensions . 29
B.2.1 Outline dimensions . 29
B.2.2 Tray thickness (A) . 30
B.2.3 Dimensions of the stacking feature . 31
B.2.4 Warpage . 31
B.3 Measuring instrument. 31
B.4 Measurement conditions . 31
B.5 Measurement methodology . 31
B.5.1 Outline dimensions . 31
B.5.2 Tray thickness (A) . 32
B.5.3 Dimensions of the stacking feature . 33
B.5.4 Warpage . 33
Annex C (normative) Matrix trays – General considerations for design (design value) . 34
C.1 Lateral movement of leaded devices . 34
C.2 Lateral movement of un-leaded devices . 34
C.3 Lead protection . 35

Figure 1 – Sample of leaded packages . 11
Figure 2 – Sample of grid array packages . 11
Figure 3 – Tray main view . 13
Figure 4 – Tray stacking details . 14
Figure 5 – Tray tolerances . 14
Figure A.1 – Thin tray . 18
Figure A.2 – Thick matrix . 26
Figure B.1 – Cross-sections of the outline dimensions . 30
Figure B.2 – Tray thickness . 30
Figure B.3 – Examples of tray warpage . 31
Figure B.4 – Top view of a tray showing the measurement locations for the outline
dimensions . 32
Figure B.5 – Measurement locations for tray thickness . 32
Figure B.6 – Holding position in calliper jaws for measurement . 32
Figure B.7 – Correction of a lift of the tray at the measurement point . 32
Figure B.8 – Measurement locations for the stackable design . 33
Figure B.9 – Measurement points for warpage . 33
Figure C.1 – Lateral movement of leaded devices A to I . 34
Figure C.2 – Lateral movement of un-leaded devices check points A to C . 34
Figure C.3 – Lateral movement of un-leaded devices check points D to F . 35
Figure C.4 – Lead protection gap . 35

Table 1 – P and W dimension . 9
Table 2 – Height dimensions . 10

– 4 – IEC 60286-5:2018 © IEC 2018
Table 3 – Notes related to Figures 3 and 4 . 15
Table A.1 – Variations . 19
Table A.2 – Notes related to Figures A.1 and A.2.
...

IEC 60286-5 ®
Edition 3.0 2018-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 5: Matrix trays
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

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bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

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The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

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details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
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IEC 60286-5 ®
Edition 3.0 2018-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –

Part 5: Matrix trays
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020 ISBN 978-2-8322-5661-9

– 2 – IEC 60286-5:2018 RLV © IEC 2018
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 Material . 8
4.1 Electrostatic dissipative requirements . 8
4.2 Effect of properties . 8
4.3 Recycling and rigidity . 8
5 Mechanical stability . 8
5.1 Loaded tray . 8
5.2 Empty tray . 8
5.3 Outer edges . 8
6 Tray design, dimensions and other physical properties . 8
6.1 Tray design . 8
6.1.1 Number of pockets . 8
6.1.2 Orientation of pockets . 8
6.1.3 Design rules for pocket density . 9
6.2 Overall tray dimensions . 10
6.3 Cell dimensions . 10
6.4 Tray vacuum pick-up sites . 11
6.4.1 Size . 11
6.4.2 Centre . 11
6.4.3 Perimeter . 11
6.5 Detail features . 11
6.6 Weight . 12
6.7 Movement of components . 12
6.8 Dimensional information . 12
7 Polarity and orientation of components in the tray . 15
7.1 Pin one . 15
7.2 Loading . 15
8 Tray stacking . 15
8.1 Bundling . 15
8.2 Top protection . 16
8.3 Partial filling . 16
8.4 Protrusion of components . 16
8.5 Stack-up . 16
8.6 Damaging of components . 16
8.7 Warpage . 16
9 Missing components . 16
10 Marking . 16
Annex A (informative) List of existing matrix trays with wide anticipated use in the
electronic industries . 17
A.1 Matrix trays (for different packages) . 17

A.1.1 Dimensional information .
A.1.2 Variation sheets .
A.2 Matrix trays for PGA packages . 26
A.2.1 Dimensional information . 26
A.2.2 Variation sheet PGA (pin grid array package) . 29
Annex B (normative) Measurement methodology of the tray dimensions . 30
B.1 General . 30
B.2 Definition of the dimensions . 30
B.2.1 Outline dimensions . 30
B.2.2 Tray thickness (A) . 31
B.2.3 Dimensions of the stacking feature . 32
B.2.4 Warpage . 32
B.3 Measuring instrument. 32
B.4 Measurement conditions . 32
B.5 Measurement methodology . 32
B.5.1 Outline dimensions . 32
B.5.2 Tray thickness (A) . 33
B.5.3 Dimensions of the stacking feature . 34
B.5.4 Warpage . 34
Annex C (normative) Matrix trays – General considerations for design (design value) . 35
C.1 Lateral movement of leaded devices . 35
C.2 Lateral movement of un-leaded devices . 35
C.3 Lead protection . 36

Figure 1 – Sample of leaded packages . 11
Figure 2 – Sample of grid array packages . 11
Figure 3 – Tray main view . 13
Figure 4 – Tray stacking details . 14
Figure 5 – Tray tolerances . 14
Figure A.1 – Thin tray . 18
Figure A.2 – Thick matrix . 27
Figure B.1 – Cross-sections of the outline dimensions . 31
Figure B.2 – Tray thickness . 31
Figure B.3 – Examples of tray warpage . 32
Figure B.4 – Top view of a tray showing the measurement locations for the outline
dimensions . 33
Figure B.5 – Measurement locations for tray thickness . 33
Figure B.6 – Holding position in calliper jaws for measurement . 33
Figure B.7 – Correction of a lift of the tray at the measurement point . 33
Figure B.8 – Measurement locations for the stackable design . 34
Figure B.9 – Measurement points for warpage . 34
Figure C.1 – Lateral movement of leaded devices A to I . 35
Figure C.2 – Lateral movement of un-leaded devices check points A to C . 35
Figure C.3 – Lateral movement of un-leaded devices check points D to F . 36
Figure C.4 – Lead protection gap . 36

– 4 – IEC 60286-5:2018 RLV © IEC 2018
Table 1 – P and W dimension . 9
Table 2 – Height dimensions . 10
Table 3 – Notes relate
...

IEC 60286-5 ®
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 5: Matrix trays
Emballage de composants pour opérations automatisées –
Partie 5: Supports matriciels
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

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The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

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The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

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IEC 60286-5 ®
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –

Part 5: Matrix trays
Emballage de composants pour opérations automatisées –

Partie 5: Supports matriciels
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-6301-3

– 2 – IEC 60286-5:2018 © IEC 2018
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 Material . 8
4.1 Electrostatic dissipative requirements . 8
4.2 Effect of properties . 8
4.3 Recycling and rigidity . 8
5 Mechanical stability . 8
5.1 Loaded tray . 8
5.2 Empty tray . 8
5.3 Outer edges . 8
6 Tray design, dimensions and other physical properties . 8
6.1 Tray design . 8
6.1.1 Number of pockets . 8
6.1.2 Orientation of pockets . 8
6.1.3 Design rules for pocket density . 9
6.2 Overall tray dimensions . 10
6.3 Cell dimensions . 10
6.4 Tray vacuum pick-up sites . 11
6.4.1 Size . 11
6.4.2 Centre . 11
6.4.3 Perimeter . 11
6.5 Detail features . 11
6.6 Weight . 12
6.7 Movement of components . 12
6.8 Dimensional information . 12
7 Polarity and orientation of components in the tray . 15
7.1 Pin one . 15
7.2 Loading . 15
8 Tray stacking . 15
8.1 Bundling . 15
8.2 Top protection . 16
8.3 Partial filling . 16
8.4 Protrusion of components . 16
8.5 Stack-up . 16
8.6 Damaging of components . 16
8.7 Warpage . 16
9 Missing components . 16
10 Marking . 16
Annex A (informative) List of existing matrix trays with wide anticipated use in the
electronic industries . 17
A.1 Matrix trays (for different packages) . 17

A.2 Matrix trays for PGA packages . 25
A.2.1 Dimensional information . 25
A.2.2 Variation sheet PGA (pin grid array package) . 28
Annex B (normative) Measurement methodology of the tray dimensions . 29
B.1 General . 29
B.2 Definition of the dimensions . 29
B.2.1 Outline dimensions . 29
B.2.2 Tray thickness (A) . 30
B.2.3 Dimensions of the stacking feature . 31
B.2.4 Warpage . 31
B.3 Measuring instrument. 31
B.4 Measurement conditions . 31
B.5 Measurement methodology . 31
B.5.1 Outline dimensions . 31
B.5.2 Tray thickness (A) . 32
B.5.3 Dimensions of the stacking feature . 33
B.5.4 Warpage . 33
Annex C (normative) Matrix trays – General considerations for design (design value) . 34
C.1 Lateral movement of leaded devices . 34
C.2 Lateral movement of un-leaded devices . 34
C.3 Lead protection . 35

Figure 1 – Sample of leaded packages . 11
Figure 2 – Sam
...