IEC 60286-3:2019

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues

L'IEC 60286-3:2019 est applicable à la mise en bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise en bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l'emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout d'un tableau de classification des symboles concernant les bandes, les bobines et les symboles courants;
- ajout d'une figure représentant un exemple de polarité et d'orientation et d'une figure représentant un exemple de collage ponctuel;
- révision des exigences de cambrage;
- ajout d'une définition de la valeur de conception concernant l'inclinaison.

General Information

• Status: Published
• Publication Date: 15-Jan-2019
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• ICS: 97.040.50 - Small kitchen appliances
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60286-3 - TC 40/MT 60286-3
• Current Stage: DELPUB - Deleted Publication
• Start Date: 15-Nov-2022
• Completion Date: 31-May-2021

Relations

• Revised: IEC 60286-3:2022 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• Effective Date: 05-Sep-2023
• Revises: IEC 60286-3:2013 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• Effective Date: 05-Sep-2023

Overview

IEC 60286-3:2019 - "Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes" is the international standard that defines tape-and-reel packaging requirements for surface-mount components (SMT) and singulated die (bare die, bumped die/flip chips). It specifies the essential dimensional, mechanical and marking characteristics for carrier tape, cover tape and reels used in automated handling and pick-and-place assembly.

This 2019 edition (Edition 6.0) updates tape classification and symbols, adds examples for polarity/orientation and dot seals, revises camber requirements and introduces a design value definition for component tilt.

Key Topics and Technical Requirements

• Scope: Applies to components without leads or with lead stumps intended for connection to electronic circuits, including singulated die products.
• Tape types: Defines requirements for multiple carrier tape styles (punched, pressed, blister, adhesive-backed) and standard tape widths and pitches.
• Dimensional requirements: Cavity geometry, pocket pitch, maximum offsets, tilt, planar rotation and lateral displacement limits for component positioning.
• Carrier and cover tape: Material, minimum bending radius, camber limits, peel-force criteria and cover-seal methods (including dot seals for thin components).
• Reel requirements: Standard reel dimensions, hub and hole tolerances, labelling areas, leader/trailer configuration and tape reeling rules.
• Die and flip-chip handling: Specific requirements for tape design, cleanliness, die lateral movement control and coordinate referencing for singulated die.
• Measurement and testing: Normative annex on measuring methods for carrier thickness, cavity dimensions and depths.
• Symbols and classification: Table of symbols concerning tape, reel and common markings to support compatibility across the supply chain.

Practical Applications

• Ensures compatibility with automated pick-and-place machines and feeders used in PCB assembly lines.
• Standardizes tape-and-reel packaging for component suppliers, contract manufacturers (EMS) and PCB assemblers to reduce misfeeds, damage and downtime.
• Guides design of packaging for bare die and flip-chip distribution where cleanliness and precise positioning are critical.
• Supports procurement and quality assurance in electronics manufacturing for vendor compliance and incoming inspection.

Who Uses IEC 60286-3:2019

• Component manufacturers and packaging engineers
• Electronic manufacturing services (EMS) and contract assemblers
• SMT line engineers and automation integrators
• Quality, inspection and procurement teams in electronics supply chains

Related Standards

• Other parts of the IEC 60286 series (packaging of components for automatic handling) cover complementary packaging methods and general requirements relevant to tape-and-reel operations. Consult the IEC webstore for the latest related parts and amendments.

Keywords: IEC 60286-3:2019, tape-and-reel, packaging of components, surface mount, SMT packaging, carrier tape, cover tape, reel dimensions, singulated die, flip chip.

Standards Content (Sample)

IEC 60286-3 ®
Edition 6.0 2019-01
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes

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IEC 60286-3 ®
Edition 6.0 2019-01
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020; 31.240 ISBN 978-2-8322-6449-2

– 2 – IEC 60286-3:2019 RLV © IEC 2019

CONTENTS
FOREWORD . 5

INTRODUCTION . 7

1 Scope . 8

2 Normative references . 8

3 Terms, definitions and symbols. 8

3.1 Terms and definitions . 8

3.2 Symbols . 10
4 Structure of the specification . 11
5 Dimensional requirements for taping . 12
5.1 Component cavity positioning requirements . 12
5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12
5.1.2 Requirements for types 4 . 12
5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 13
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15
5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 18
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 20
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24
6 Polarity and orientation requirements of components in the tape . 26
6.1 Requirements for all tape types . 26
6.2 Specific requirements for type 1a . 27
6.3 Specific requirements for type 4 . 27
7 Carrier tape requirements . 27
7.1 Taping materials . 27
7.2 Minimum bending radius (for all types) . 27
7.3 Camber . 28
8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29

9 Component taping and additional tape requirements. 30
9.1 All types . 30
9.2 Specific requirements for type 1b . 31
9.3 Specific tape requirements for type 2b . 31
9.4 Specific requirement for type 4 . 31
9.4.1 General . 31
9.4.2 Coordinate system . 31
9.4.3 Component positioning and lateral displacement . 33
9.5 Specific requirements for tapes containing die products . 33
9.5.1 General . 33
9.5.2 Tape design for tapes containing die products . 33
9.5.3 Cleanliness . 34
9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34
10 Reel requirements . 34

10.1 Dimensions . 34

10.1.1 General . 34

10.1.2 Reel dimensions . 34

10.1.3 Reel hole dimensions . 36

10.2 Marking . 36

11 Tape reeling requirements . 37

11.1 All types . 37

11.2 Specific requirements for type 1a . 37

11.3 Specific requirements for type 4 . 37

11.4 Leader and trailer tape . 37
11.4.1 General . 37
11.4.2 Leader . 38
11.4.3 Trailer . 38
11.5 Recycling . 38
11.6 Missing components . 38
Annex A (normative) Recommended measuring methods for type 1b . 39
A.1 Measurement method for carrier tape thickness (T and T ) . 39
A.2 Measurement method for cavity (A and B ) . 39
0 0
A.3 Measurement method for cavity depth (dimension K ) . 40
Bibliography . 41

Figure – Camber (top view) .
Figure 1 – Sectional view of component cavity (type 1b) . 10
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13
Figure 4 – Maximum component tilt, rotation and lateral movement . 14
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 16
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16
Figure 7 – Maximum component tilt, rotation and lateral movement . 16
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 18
Figure 10 – Maximum component tilt, rotation and lateral movement . 18
Figure 11 – Type 2b carrier tape . 20

Figure 12 – Maximum pocket offset . 20
Figure 13 – Maximum component tilt, rotation and lateral movement . 20
Figure 14 – Blister carrier tape . 22
Figure 15 – Elongated sprocket hole skew . 22
Figure 16 – Maximum component tilt, rotation and lateral movement . 22
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 24
Figure 18 – Illustration of 2 mm compartment pitch . 24
Figure 19 – Maximum component planar rotation and lateral displacement . 25
Figure 20 – Example of polarity and orientation . 27
Figure 21 – Bending radius . 28
Figure 22 – Measuring method and camber . 29

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Figure 23 – Dot seals for thin components (as exceptions) . 30

Figure 24 – Type 4 coordinate system . 32

Figure 25 – Component clearance and positioning method . 33

Figure 26 – Reel . 35

Figure 27 – Reel hole presentation . 36

Figure 28 – Tape reeling and label area on the reel . 37

Figure 29 – Leader and trailer . 38

Figure A.1 – Carrier tape thickness measurement points . 39

Figure A.2 – Cavity cross-section . 40
Figure A.3 – Cavity depth dimension . 40

Table 1 – Component size codes . 9
Table 2 – Classification to symbols concerning tape, reel and common symbols . 10
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 14
Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 15
Table 5 – Component tilt, planar rotation and lateral movement . 15
Table 6 – Constant dimensions of 8 mm pressed carrier tape . 17
Table 7 – Variable dimensions of 8 mm pressed carrier tape . 17
Table 8 – Component tilt, planar rotation and lateral movement . 17
Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 19
Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 19
Table 11 – Component tilt, rotation and lateral movement . 19
Table 12 – Constant dimensions of 4 mm carrier tape . 21
Table 13 – Variable dimensions of 4 mm carrier tape . 21
Table 14 – Component tilt, planar rotation and lateral movements . 21
Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 23
Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 23
Table 17 – Component tilt, planar rotation and lateral movements . 24
Table 18 – Dimensions of adhesive backed punched carrier tape . 25
Table 19 – Variable dimensions of adhesive-backed punched carrier tape . 26
Table 20 – Component planar rotation and lateral displacement . 26

Table 21 – Minimum bending radius . 28
Table 22 – Peel force . 30
Table 23 – Absolute referencing data for component target position . 32
Table 24 – Reel dimensions . 35
Table 25 – Reel hole dimensions . 36

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components

on continuous tapes
FOREWORD
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
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– 6 – IEC 60286-3:2019 RLV © IEC 2019

International Standard IEC 60286-3 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.

This sixth edition cancels and replaces the fifth edition published in 2013. This edition
constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous
edition:
a) addition of a table of the classification to symbols concerning tape, reel and common

symbols;
b) additions of a figure of example of polarity and orientation and a figure of example of dot
seal;
c) revision of requirements for camber;
d) addition of a definition of design value with regard to tilt.
The text of this International Standard is based on the following documents:
FDIS Report on voting
40/2643/FDIS 40/2649/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60286 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
INTRODUCTION
Tape packaging meets the requirements of automatic component placement machines and

also covers the use of tape packaging for components and singulated dies for test purposes

and other operations.
– 8 – IEC 60286-3:2019 RLV © IEC 2019

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components

on continuous tapes
1 General
1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps, intended to be connected to electronic circuits. It includes only
those dimensions that are essential for the taping of components intended for the above-
mentioned purposes.
This document also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
3 Terms, definitions and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply. Definitions apply
to all tape types, unless specifically mentioned.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
components
unless specifically mentioned otherwise, for all packaging types for bare die products, the
term components refers to components as well as singulated die products
electronic part of a product that cannot be physically divided into smaller parts without losing
its particular function
Note 1 to entry: This includes singulated die product.

Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned
otherwise.
3.1.2
component sizes
all component sizes size of component that are identified with their metric size code

Note 1 to entry: This size code is followed by a capital M.

Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalent equivalency table is

shown in Table 1.
Table 1 – Component size codes
Metric size code Inch size code
0402M 01005
0603M 0201
1005M 0402
1608M 0603
2012M 0805
3.1.3
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
3.1.4
pressed carrier tape
carrier tape with concave cavities formed by compression of the base material
3.1.5
fluff
fibre from the base material attached inside the cavity
Note 1 to entry: See Figure 1.
3.1.6
burr
surface projection of tape unintentially produced when cavity is formed

Note 1 to entry: See Figure 1.
3.1.7
deformation
bulge on the inner wall of the cavity
Note 1 to entry: See Figure 1.
3.1.8
puff
bulge on the reverse side of the cavity
Note 1 to entry: See Figure 1.

– 10 – IEC 60286-3:2019 RLV © IEC 2019

Figure 1 – Sectional view of component cavity (type 1b)
3.1.9
blister carrier tape
tape types 2a, 2b and 3 are identified as blister carrier tapes carrier tape which is identified as
tape belonging to types 2a, 2b and 3
Note 1 to entry These types of carriers are also known as "embossed" carrier types.
3.2 Symbols
The symbols used in this document are listed in Table 2.
Table 2 – Classification to symbols concerning tape, reel and common symbols
Symbols Definitions Figure references
A Reel diameter Figure 26
A Cavity’s bottom dimension in direction of unreeling Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16
and 20
B Reel hole key’s groove width Figure 27
B Cavity’s bottom dimension in direction of tape width Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16
and 20
B Cavity’s rim in direction of tape width Figures 8, 11 and 14
C Reel hole diameter Figures 26 and 27
C Distance of puff under cavity in direction of tape width Figure 5
T
d Difference of diameter between sprocket hole and round Figure 14
foramen
D Reel slot diameter Figure 27
D Sprocket hole diameter Figures 2, 5, 8, 11, 14 and 17
D Cavity’s bottom hole diameter Figures 8 and 14
E Shorter distance in direction of width between the origin Figures 2, 5, 8, 11, 14 and 17
point of round sprocket hole and the edge of a side of
tape
E Longer distance in direction of width between the origin Figures 2, 5, 8 and 11
point of round sprocket hole and the edge of a side of
tape
F Distance in direction of width between the origin point of Figures 2, 5, 8, 11 and 14
round sprocket hole and the centre of cavity
F Distance in direction of width between the origin point of Figures 17, 19, 24 and 25
A
round sprocket hole and the centre of compartment
G Shorter distance in direction of width between the cavity Figures 2, 5, 8, 11 and 17
and the edge of a side of tape
K Cavity depth Figures 2, 5, 8 ,11 ,14 and A.3
N Hub diameter Figure 26
Symbols Definitions Figure references

P Pitch of the sprocket holes Figures 2, 3, 5, 6, 8, 9, 11, 14 and 17
P Cavity pitch Figures 2, 3, 5, 6, 8, 9, 11, 14, 17 and
P Pitch between the centre of a cavity on the same line Figures 2, 3, 5, 6, 8, 9, 11 and 14
with the origin point of round sprocket hole and the
centre of the next cavity in direction of unreeling

P Pitch between the centre line of the origin point of round Figures 17, 18, 19, 24 and 25
2A
sprocket hole and the centre line of compartment in

direction of unreeling
P Pitch between the centre of a cavity on the same line Figures 3 and 6
with the origin point of round sprocket hole and the
centre of the second next cavity in direction of unreeling
P Pitch between the centre of a cavity on the same line Figures 3 and 6
with the origin point of round sprocket hole and the
centre of the third next cavity in direction of unreeling
S Sprocket hole pitch in direction of width Figure 14
R Bending radius of carrier tape Figure 21
r Curvature radius of reel hole key’s groove Figure 27
T Carrier tape thickness without cover tape Figures 2, 5, 8, 11, 14, 17, 25 and A.1
T Top cover tape thickness or bottom cover tape thickness Figures 2, 5, 8, 11, 14 and 17
T Sum of outer cavity height and top cover tape thickness Figures 8, 11 and 14
T Thickenss of pressed carrier tape including bulge Figures 5 and A.1
V Compartment dimension in direcion of unreeling Figures 17 and 18
V Compartment dimension in direction of width Figures 17 and 18
W Carrier tape width Figures 2, 5, 8, 11, 14 and 17
W Distance between adhesive tapes Figure 17
P
W Reel inner width(measured at hub) Figure 26
W Reel overall width Figure 26
W Reel inner width in the rim Figure 26
Z Component thickness Figure 25

4 Structure of the specification
The various types of tapes are as follows.

NOTE 1 The separation of the prior type 1 into two sub-types 1a and 1b is new in this edition of this standard.
Any reference to type 1 not being specific to type 1a or type 1b is considered as referring to type 1a.
Type 1 – Punched and pressed carrier tape
Type 1a: Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm)
Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm)
NOTE 2 The separation of the prior type 2 into two sub-types 2a and 2b is new in this edition of this standard.
Any reference to type 2 not being specific to type 2a or type 2b is considered as referring to type 2a.

– 12 – IEC 60286-3:2019 RLV © IEC 2019

Type 2 – Blister carrier tape, with single round sprocket holes

Type 2a: Blister carrier tape, with single round sprocket holes, with top

cover tape and tape pitches down to 2 mm (tape widths: 8 mm,

12 mm, 16 mm and 24 mm)
Type 2b: Blister carrier tape, with single round sprocket holes, with top

cover tape and with 1mm tape pitch (tape widths: 4 mm)

Type 3 – Blister carrier tape, with double sprocket holes (tape widths: 32 mm to

200 mm)
Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components (tape widths: 8 mm, 12 mm, 16 mm, and
24 mm)
5 Dimensional requirements for taping
5.1 Component cavity positioning requirements
5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3
For defined component positioning, the cavity shall be defined to an origin point. The origin is
and P .
the centre of the round sprocket hole, defined by the crosshair of the dimensions E
1 0
The centre of the compartment shall be defined by P and F, relative to the round sprocket
hole (see Figures 2, 5, 8, 11 and 14). When dimension P is smaller or equal to 2 mm, the
maximum allowed pocket offset, relative to the centre of the round sprocket hole, shall be
applied (see Figures 3, 6, 9 and 12).
5.1.2 Requirements for types 4
For defined component positioning, the component placement and location shall be defined to
an origin. The origin is the centre of the sprocket hole, defined by the crosshair of the
dimensions E and P . The centre of the component location shall be defined by P and F ,
1 0 2A A
relative to the sprocket hole (see Figure 17). Type 4 does not have cavities that are used to
position components, therefore all position measurements should be made according to the
principle defined here and not to the compartments or ‘pockets’, which are virtual boundaries
for component protection only. The term ‘pocket offset’ does not apply to type 4. The following
applies to tape type 4:
a) rotation and lateral movement of the component is defined by the accuracy to which it has
been placed in the compartment, with reference to the target;
b) the component shall not protrude above the top surface of the carrier tape (see Figure 25,

sketch R);
c) the components shall not change their orientation within the tape;
d) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction.
5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3)
The size of the component cavity, including applicable tolerances, is governed by the
dimensions of the component for which the packaging applies, to ensure that the component
is adequately protected and that tilt, rotation and lateral movement of the component complies
with the requirements detailed for each type of tape. The following applies to tape types 1a,
1b, 2a, 2b and 3:
a) dimensions A ≤ B , unless otherwise specified in the component detail specification;
0 0
b) maximum and minimum dimensions of the component shall be taken from the component
detail specification;
c) the component shall not protrude above the top surface of the carrier tape, except for type

1a where the component shall not protrude beyond either surface of the carrier tape;

d) the components shall not change their orientation within the tape;

e) the component shall be able to be removed from the cavity or compartment in a vertical

direction, without mechanical restriction, after the top cover has been removed, where a
cover tape is used.
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:

8 mm and 12 mm)
For respective dimensional codes, see Figures 2 to 4 and Tables 3 to 5.

Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch)

Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

– 14 – IEC 60286-3:2019 RLV © IEC 2019

Figure 4 – Maximum component tilt, rotation and lateral movement
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
Tape size D E P G T T P pitch
0 1 0 1 0
(each T ) cumulative
min. max.
tolerance
8 and 12 0,75 1,1 0,1
+0,1 1,75 ± 0,1 4,0 ± 0,1 ± 0,2 / 10 pitches

1,5
a
paper maximum
(P ≥ 4)
1,6 non-
4,0 ± 0,05
paper
(P = 2, P = 1)
1 1
For respective dimensional codes, see Figure 2.
a
The paper is the material of the punched carrier tape.

Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape

Dimensions in millimetres
Tape E F P P P P W A , B , K
2 1 2 3 4 0 0 0
size
min.
8 6,25 +0,3 See 5.2
3,5 ± 0,05 1,0 ± 0,05 1,0 ± 0,05 2,0 ± 0,05 3,0 ± 0,05

8,0
−0,1
(P = 1) (P = 1) (P = 1) (P = 1)
1 1 1 1
2,0 ± 0,05 2,0 ± 0,05
(P = 2) (P = 2)
1 1
4,0 ± 0,1 2,0 ± 0,05
(P = 4) (P = 4)
1 1
12 10,25 5,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 – – +0,3
12,0
−0,1
(P = 2)
4,0 ± 0,1
(P ≥ 4)
For respective dimensional codes, see Figures 2 to 4.

Table 5 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
(design value) (design value)
mm mm
8 and 12 10° maximum 20° maximum 0,3 maximum
(P = 1, P = 2)
1 1
0,5 maximum
(P ≥ 4)
For respective dimensional codes, see Figure 4.
The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is
10° maximum.
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral
movement of 0,2 mm maximum.
When handling bare die products in tape size 8 mm, the minimum lateral movement of 0,1 mm maximum for
either cavity dimension should be allowed.
When handling bare die products in tape size 12 mm, the minimum lateral movement of 0,15 mm maximum for
either cavity dimension should be allowed.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm)
For respective dimensional codes, see Figures 5 to 7 and Tables 6 to 8.

– 16 – IEC 60286-3:2019 RLV © IEC 2019

Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm)
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

Figure 7 – Maximum component tilt, rotation and lateral movement

Table 6 – Constant dimensions of 8 mm pressed carrier tape

Dimensions in millimetres
a b
Tape D E G P T T T -T P pitch
0 1 0 1 3 0
size cumulative
min. max. max. max.
tolerance
8 +0,1 0,75 1,1 0,1 0,1
1,75 ± 0,1 4,0 ± 0,1 ± 0,1 / 10 pitches

1,5
For respective dimensional codes, see Figures 5 and 6.

a
If positioning precision is required, for example when components ≤ size 1005M are mounted in a narrow
space, then the tolerance on D should be +0,05 / −0,00 mm.

b
For components with size designation of 1005M or smaller, the puff (T − T) should be limited to 0,05 mm
maximum.
Table 7 – Variable dimensions of 8 mm pressed carrier tape
Dimensions in millimetres
Tape C E F P P P P W A , B ,
T 2 1 2 3 4 0 0
size K
max. min.
8 4,35 6,25 3,5 ± 0,05 1,0 ± 0,05 1,0 ± 0,05 2,0 ± 0,05 3,0 ± 0,05 +0,3 See

8,0
−0,1
5.2
(P = 1) (P = 1) (P = 1) (P = 1)
1 1 1 1
2,0 ± 0,05 2,0 ± 0,05
(P = 2) (P = 2)
1 1
4,0 ± 0,1 2,0 ± 0,05
(P = 4) (P = 4)
1 1
For respective dimensional codes, see Figures 5 to 7.

Table 8 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
mm (design value) (design value) mm
8 20° maximum 20° maximum 0,12 maximum

(Component size ≤ 0603M)
0,20 maximum
(Component size 1005M)
0,30 maximum
(Component size ≥ 1608M)
For respective dimensional codes, see Figure 7.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

– 18 – IEC 60286-3:2019 RLV © IEC 2019

5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape pitches

down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm)

For respective dimensional codes, see Figures 8 to 10 and Tables 9 to 11.

Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm)

Figure 9 – Illustration of 2 mm cavity pitch and pocket offset

Figure 10 – Maximum component tilt, rotation and lateral movement

Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape

Dimensions in millimetres
Tape size D E G P T T P pitch cumulative

0 1 0 1 0
tolerance
min. max. max.
8 to 24 +0,1 0,75 0,6 0,1
1,75 ± 0,1 4,0 ± 0,1 ±0,2 / 10 pitches

1,5
(P ≥ 4)
4,0 ± 0,05
(P = 2)
For respective dimensional codes, see Figures 8 and 9.

Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape
Dimensions in millimetres
a
Tape B D E F P P T W A ,
1 1 2 1 2 2 0
size B , K
0 0
max. min. min. max.
8 4,35 0,3 6,25 3,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 3,5 +0,3

8,0 See
−0,1
4,0 ± 0,1
5.2
12 8,2 1,5 10,25 5,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 6,5 +0,3

12,0
−0,1
4,0 ± 0,1 to
12,0 ± 0,1 in
4,0 increments
16 12,1 1,5 14,25 7,5 ± 0,1 4,0 ± 0,1 to 2,0 ± 0,1 9,5 +0,3

16,0
−0,1
16,0 ± 0,1 in
4,0 increments
24 20,1 1,5 22,25 12,5 +0,3
11,5 ± 0,1 4,0 ± 0,1 to 2,0 ± 0,1
24,0
−0,1
24,0 ± 0,1 in
4,0 increments
For respective dimensional codes, see Figures 8 to 10.
a
Optionally, for easy and reliable removal of the component, or for component inspection or for any applicable
application, the cavity may have a hole in the centre of the bottom.

Table 11 – Component tilt, rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
(design value) (design value)
mm mm
8, 12 10° maximum 20° maximum 0,5 maximum
16, 24 10° maximum 10° maximum 0,5 maximum
For respective dimensional codes, see Figure 10.
The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is
10° maximum.
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral
movement of 0,2 mm maximum.
When handling bare die products in tape size 8 mm, the minimum lateral movement of 0,1 mm maximum for
either cavity dimension should be allowed.
When handling bare die products in tape size 12 mm, the minimum lateral movement of 0,15 mm maximum for
either cavity dimension should be allowed.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

– 20 – IEC 60286-3:2019 RLV © IEC 2019

5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with 1mm

tape pitch (tape widths: 4 mm)

For respective dimensional codes, see Figures 11 to 13 and Tables 12 to 14.

Figure 11 – Type 2b carrier tape

Figure 12 – Maximum pocket offset

Figure 13 – Maximum component tilt, rotation and lateral movement

Table 12 – Constant di
...

IEC 60286-3 ®
Edition 6.0 2019-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
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IEC 60286-3 ®
Edition 6.0 2019-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-6387-7

– 2 – IEC 60286-3:2019 © IEC 2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and symbols. 8
3.1 Terms and definitions . 8
3.2 Symbols . 10
4 Structure of the specification . 11
5 Dimensional requirements for taping . 12
5.1 Component cavity positioning requirements . 12
5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12
5.1.2 Requirements for types 4 . 12
5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 12
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15
5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 17
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 20
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24
6 Polarity and orientation requirements of components in the tape . 26
6.1 Requirements for all tape types . 26
6.2 Specific requirements for type 1a . 27
6.3 Specific requirements for type 4 . 27
7 Carrier tape requirements . 27
7.1 Taping materials . 27
7.2 Minimum bending radius (for all types) . 27
7.3 Camber . 28
8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29
9 Component taping and additional tape requirements. 30
9.1 All types . 30
9.2 Specific requirements for type 1b . 31
9.3 Specific tape requirements for type 2b . 31
9.4 Specific requirement for type 4 . 31
9.4.1 General . 31
9.4.2 Coordinate system . 31
9.4.3 Component positioning and lateral displacement . 33
9.5 Specific requirements for tapes containing die products . 33
9.5.1 General . 33
9.5.2 Tape design for tapes containing die products . 33
9.5.3 Cleanliness . 34
9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34
10 Reel requirements . 34

10.1 Dimensions . 34
10.1.1 General . 34
10.1.2 Reel dimensions . 34
10.1.3 Reel hole dimensions . 36
10.2 Marking . 36
11 Tape reeling requirements . 37
11.1 All types . 37
11.2 Specific requirements for type 1a . 37
11.3 Specific requirements for type 4 . 37
11.4 Leader and trailer tape . 37
11.4.1 General . 37
11.4.2 Leader . 38
11.4.3 Trailer . 38
11.5 Recycling . 38
11.6 Missing components . 38
Annex A (normative) Recommended measuring methods for type 1b . 39
A.1 Measurement method for carrier tape thickness (T and T ) . 39
A.2 Measurement method for cavity (A and B ) . 39
0 0
A.3 Measurement method for cavity depth (dimension K ) . 40
Bibliography . 41

Figure 1 – Sectional view of component cavity (type 1b) . 9
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13
Figure 4 – Maximum component tilt, rotation and lateral movement . 13
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 15
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16
Figure 7 – Maximum component tilt, rotation and lateral movement . 16
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 18
Figure 10 – Maximum component tilt, rotation and lateral movement . 18
Figure 11 – Type 2b carrier tape . 20
Figure 12 – Maximum pocket offset . 20
Figure 13 – Maximum component tilt, rotation and lateral movement . 20
Figure 14 – Blister carrier tape . 22
Figure 15 – Elongated sprocket hole skew . 22
Figure 16 – Maximum component tilt, rotation and lateral movement . 22
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 24
Figure 18 – Illustration of 2 mm compartment pitch . 24
Figure 19 – Maximum component planar rotation and lateral displacement . 25
Figure 20 – Example of polarity and orientation . 27
Figure 21 – Bending radius . 28
Figure 22 – Measuring method and camber . 29
Figure 23 – Dot seals for thin components (as exceptions) . 30

– 4 – IEC 60286-3:2019 © IEC 2019
Figure 24 – Type 4 coordinate system . 32
Figure 25 – Component clearance and positioning method . 33
Figure 26 – Reel . 35
Figure 27 – Reel hole presentation . 36
Figure 28 – Tape reeling and label area on the reel . 37
Figure 29 – Leader and trailer . 38
Figure A.1 – Carrier tape thickness measurement points . 39
Figure A.2 – Cavity cross-section . 40
Figure A.3 – Cavity depth dimension . 40

Table 1 – Component size codes . 9
Table 2 – Classification to symbols concerning tape, reel and common symbols . 10
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 14
Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 14
Table 5 – Component tilt, planar rotation and lateral movement . 15
Table 6 – Constant dimensions of 8 mm pressed carrier tape . 16
Table 7 – Variable dimensions of 8 mm pressed carrier tape . 17
Table 8 – Component tilt, planar rotation and lateral movement . 17
Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 19
Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 19
Table 11 – Component tilt, rotation and lateral movement . 19
Table 12 – Constant dimensions of 4 mm carrier tape . 21
Table 13 – Variable dimensions of 4 mm carrier tape . 21
Table 14 – Component tilt, planar rotation and lateral movements . 21
Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 23
Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 23
Table 17 – Component tilt, planar rotation and lateral movements . 24
Table 18 – Dimensions of adhesive backed punched carrier tape . 25
Table 19 – Variable dimensions of adhesive-backed punched carrier tape . 26
Table 20 – Component planar rotation and lateral displacement . 26
Table 21 – Minimum bending radius . 28
Table 22 – Peel force . 30
Table 23 – Absolute referencing data for component target position . 32
Table 24 – Reel dimensions . 35
Table 25 – Reel hole dimensions . 36

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60286-3 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This sixth edition cancels and replaces the fifth edition published in 2013. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) addition of a table of the classification to symbols concerning tape, reel and common
symbols;
b) additions of a figure of example of polarity and orientation and a figure of example of dot
seal;
c) revision of requirements for camber;

– 6 – IEC 60286-3:2019 © IEC 2019
d) addition of a definition of design value with regard to tilt.
The text of this International Standard is based on the following documents:
FDIS Report on voting
40/2643/FDIS 40/2649/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60286 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
INTRODUCTION
Tape packaging meets the requirements of automatic component placement machines and
also covers the use of tape packaging for components and singulated dies for test purposes
and other operations.
– 8 – IEC 60286-3:2019 © IEC 2019
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes
1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps, intended to be connected to electronic circuits. It includes only
those dimensions that are essential for the taping of components intended for the above-
mentioned purposes.
This document also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
3 Terms, definitions and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply. Definitions apply
to all tape types, unless specifically mentioned.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
components
electronic part of a product that cannot be physically divided into smaller parts without losing
its particular function
Note 1 to entry: This includes singulated die product.
Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned
otherwise.
3.1.2
component sizes
size of component that are identified with their metric size code
Note 1 to entry: This size code is followed by a capital M.
Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1.

Table 1 – Component size codes
Metric size code Inch size code
0402M 01005
0603M 0201
1005M 0402
1608M 0603
2012M 0805
3.1.3
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
3.1.4
pressed carrier tape
carrier tape with concave cavities formed by compression of the base material
3.1.5
fluff
fibre from the base material attached inside the cavity
Note 1 to entry: See Figure 1.
3.1.6
burr
surface projection of tape unintentially produced when cavity is formed
Note 1 to entry: See Figure 1.
3.1.7
deformation
bulge on the inner wall of the cavity
Note 1 to entry: See Figure 1.
3.1.8
puff
bulge on the reverse side of the cavity
Note 1 to entry: See Figure 1.

Figure 1 – Sectional view of component cavity (type 1b)

– 10 – IEC 60286-3:2019 © IEC 2019
3.1.9
blister carrier tape
carrier tape which is identified as tape belonging to types 2a, 2b and 3
Note 1 to entry These types of carriers are also known as "embossed" carrier types.
3.2 Symbols
The symbols used in this document are listed in Table 2.
Table 2 – Classification to symbols concerning tape, reel and common symbols
Symbols Definitions Figure references
A Reel diameter Figure 26
A Cavity’s bottom dimension in direction of unreeling Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16
and 20
B Reel hole key’s groove width Figure 27
B Cavity’s bottom dimension in direction of tape width Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16
and 20
B Cavity’s rim in direction of tape width Figures 8, 11 and 14
C Reel hole diameter Figures 26 and 27
C Distance of puff under cavity in direction of tape width Figure 5
T
d Difference of diameter between sprocket hole and round Figure 14
foramen
D Reel slot diameter Figure 27
D Sprocket hole diameter Figures 2, 5, 8, 11, 14 and 17
D Cavity’s bottom hole diameter Figures 8 and 14
E Shorter distance in direction of width between the origin Figures 2, 5, 8, 11, 14 and 17
point of round sprocket hole and the edge of a side of
tape
E Longer distance in direction of width between the origin Figures 2, 5, 8 and 11
point of round sprocket hole and the edge of a side of
tape
F Distance in direction of width between the origin point of Figures 2, 5, 8, 11 and 14
round sprocket hole and the centre of cavity
F Distance in direction of width between the origin point of Figures 17, 19, 24 and 25
A
round sprocket hole and the centre of compartment
G Shorter distance in direction of width between the cavity Figures 2, 5, 8, 11 and 17
and the edge of a side of tape
K Cavity depth Figures 2, 5, 8 ,11 ,14 and A.3
N Hub diameter Figure 26
P Pitch of the sprocket holes Figures 2, 3, 5, 6, 8, 9, 11, 14 and 17
P Cavity pitch Figures 2, 3, 5, 6, 8, 9, 11, 14, 17 and
P Pitch between the centre of a cavity on the same line Figures 2, 3, 5, 6, 8, 9, 11 and 14
with the origin point of round sprocket hole and the
centre of the next cavity in direction of unreeling
P Pitch between the centre line of the origin point of round Figures 17, 18, 19, 24 and 25
2A
sprocket hole and the centre line of compartment in
direction of unreeling
P Pitch between the centre of a cavity on the same line Figures 3 and 6
with the origin point of round sprocket hole and the
centre of the second next cavity in direction of unreeling
P Pitch between the centre of a cavity on the same line Figures 3 and 6
with the origin point of round sprocket hole and the
centre of the third next cavity in direction of unreeling

Symbols Definitions Figure references
S Sprocket hole pitch in direction of width Figure 14
R Bending radius of carrier tape Figure 21
r Curvature radius of reel hole key’s groove Figure 27
T Carrier tape thickness without cover tape Figures 2, 5, 8, 11, 14, 17, 25 and A.1
T Top cover tape thickness or bottom cover tape thickness Figures 2, 5, 8, 11, 14 and 17
T Sum of outer cavity height and top cover tape thickness Figures 8, 11 and 14
T Thickenss of pressed carrier tape including bulge Figures 5 and A.1
V Compartment dimension in direcion of unreeling Figures 17 and 18
V Compartment dimension in direction of width Figures 17 and 18
W Carrier tape width Figures 2, 5, 8, 11, 14 and 17
W Distance between adhesive tapes Figure 17
P
W Reel inner width(measured at hub) Figure 26
W Reel overall width Figure 26
W Reel inner width in the rim Figure 26
Z Component thickness Figure 25

4 Structure of the specification
The various types of tapes are as follows.
Type 1 – Punched and pressed carrier tape
Type 1a: Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm)
Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm)
Type 2 – Blister carrier tape, with single round sprocket holes
Type 2a: Blister carrier tape, with single round sprocket holes, with top
cover tape and tape pitches down to 2 mm (tape widths: 8 mm,
12 mm, 16 mm and 24 mm)
Type 2b: Blister carrier tape, with single round sprocket holes, with top
cover tape and with 1mm tape pitch (tape widths: 4 mm)
Type 3 – Blister carrier tape, with double sprocket holes (tape widths: 32 mm to
200 mm)
Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components (tape widths: 8 mm, 12 mm, 16 mm, and
24 mm)
– 12 – IEC 60286-3:2019 © IEC 2019
5 Dimensional requirements for taping
5.1 Component cavity positioning requirements
5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3
For defined component positioning, the cavity shall be defined to an origin point. The origin is
the centre of the round sprocket hole, defined by the crosshair of the dimensions E and P .
1 0
and F, relative to the round sprocket
The centre of the compartment shall be defined by P
hole (see Figures 2, 5, 8, 11 and 14). When dimension P is smaller or equal to 2 mm, the
maximum allowed pocket offset, relative to the centre of the round sprocket hole, shall be
applied (see Figures 3, 6, 9 and 12).
5.1.2 Requirements for types 4
For defined component positioning, the component placement and location shall be defined to
an origin. The origin is the centre of the sprocket hole, defined by the crosshair of the
dimensions E and P . The centre of the component location shall be defined by P and F ,
1 0 2A A
relative to the sprocket hole (see Figure 17). Type 4 does not have cavities that are used to
position components, therefore all position measurements should be made according to the
principle defined here and not to the compartments or ‘pockets’, which are virtual boundaries
for component protection only. The term ‘pocket offset’ does not apply to type 4. The following
applies to tape type 4:
a) rotation and lateral movement of the component is defined by the accuracy to which it has
been placed in the compartment, with reference to the target;
b) the component shall not protrude above the top surface of the carrier tape (see Figure 25,
sketch R);
c) the components shall not change their orientation within the tape;
d) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction.
5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3)
The size of the component cavity, including applicable tolerances, is governed by the
dimensions of the component for which the packaging applies, to ensure that the component
is adequately protected and that tilt, rotation and lateral movement of the component complies
with the requirements detailed for each type of tape. The following applies to tape types 1a,
1b, 2a, 2b and 3:
a) dimensions A ≤ B , unless otherwise specified in the component detail specification;
0 0
b) maximum and minimum dimensions of the component shall be taken from the component
detail specification;
c) the component shall not protrude above the top surface of the carrier tape, except for type
1a where the component shall not protrude beyond either surface of the carrier tape;
d) the components shall not change their orientation within the tape;
e) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction, after the top cover has been removed, where a
cover tape is used.
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm)
For respective dimensional codes, see Figures 2 to 4 and Tables 3 to 5.

Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch)

Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

Figure 4 – Maximum component tilt, rotation and lateral movement

– 14 – IEC 60286-3:2019 © IEC 2019
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
Tape size D E P G T T P pitch
0 1 0 1 0
(each T ) cumulative
min. max.
tolerance
8 and 12 0,75 1,1 0,1
+0,1 1,75 ± 0,1 4,0 ± 0,1 ± 0,2 / 10 pitches

1,5
a
paper maximum
(P ≥ 4)
1,6 non-
4,0 ± 0,05
paper
(P = 2, P = 1)
1 1
For respective dimensional codes, see Figure 2.
a
The paper is the material of the punched carrier tape.

Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
Tape E F P P P P W A , B , K
2 1 2 3 4 0 0 0
size
min.
8 6,25 3,5 ± 0,05 1,0 ± 0,05 1,0 ± 0,05 2,0 ± 0,05 3,0 ± 0,05 +0,3 See 5.2

8,0
−0,1
(P = 1) (P = 1) (P = 1) (P = 1)
1 1 1 1
2,0 ± 0,05 2,0 ± 0,05
(P = 2) (P = 2)
1 1
4,0 ± 0,1 2,0 ± 0,05
(P = 4) (P = 4)
1 1
12 10,25 – –
5,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 +0,3
12,0
−0,1
(P = 2)
4,0 ± 0,1
(P ≥ 4)
For respective dimensional codes, see Figures 2 to 4.

Table 5 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
(design value) (design value)
mm mm
8 and 12 10° maximum 20° maximum 0,3 maximum
(P = 1, P = 2)
1 1
0,5 maximum
(P ≥ 4)
For respective dimensional codes, see Figure 4.
The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is
10° maximum.
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral
movement of 0,2 mm maximum.
When handling bare die products in tape size 8 mm, the lateral movement of 0,1 mm maximum for either cavity
dimension should be allowed.
When handling bare die products in tape size 12 mm, the lateral movement of 0,15 mm maximum for either
cavity dimension should be allowed.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm)
For respective dimensional codes, see Figures 5 to 7 and Tables 6 to 8.

Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm)
0 1 0 1
– 16 – IEC 60286-3:2019 © IEC 2019

Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

Figure 7 – Maximum component tilt, rotation and lateral movement
Table 6 – Constant dimensions of 8 mm pressed carrier tape
Dimensions in millimetres
a b
Tape D E G P T T T -T P pitch
0 1 0 1 3 0
size cumulative
min. max. max. max.
tolerance
8 +0,1 0,75 1,1 0,1 0,1
1,75 ± 0,1 4,0 ± 0,1 ± 0,1 / 10 pitches

1,5
For respective dimensional codes, see Figures 5 and 6.
a
If positioning precision is required, for example when components ≤ size 1005M are mounted in a narrow
space, then the tolerance on D should be +0,05 / −0,00 mm.
b
For components with size designation of 1005M or smaller, the puff (T − T) should be limited to 0,05 mm
maximum.
Table 7 – Variable dimensions of 8 mm pressed carrier tape
Dimensions in millimetres
Tape C E F P P P P W A , B ,
T 2 1 2 3 4 0 0
size K
max. min.
8 4,35 6,25 +0,3 See
3,5 ± 0,05 1,0 ± 0,05 1,0 ± 0,05 2,0 ± 0,05 3,0 ± 0,05
8,0
−0,1
5.2
(P = 1) (P = 1) (P = 1) (P = 1)
1 1 1 1
2,0 ± 0,05 2,0 ± 0,05
(P = 2) (P = 2)
1 1
4,0 ± 0,1 2,0 ± 0,05
(P = 4) (P = 4)
1 1
For respective dimensional codes, see Figures 5 to 7.

Table 8 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
mm (design value) (design value) mm
8 20° maximum 20° maximum 0,12 maximum
(Component size ≤ 0603M)
0,20 maximum
(Component size 1005M)
0,30 maximum
(Component size ≥ 1608M)
For respective dimensional codes, see Figure 7.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape pitches
down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm)
For respective dimensional codes, see Figures 8 to 10 and Tables 9 to 11.

– 18 – IEC 60286-3:2019 © IEC 2019

Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm)

Figure 9 – Illustration of 2 mm cavity pitch and pocket offset

Figure 10 – Maximum component tilt, rotation and lateral movement

Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape
Dimensions in millimetres
Tape size D E G P T T P pitch cumulative

0 1 0 1 0
tolerance
min. max. max.
8 to 24 +0,1 0,75 0,6 0,1
1,75 ± 0,1 4,0 ± 0,1 ±0,2 / 10 pitches

1,5
(P ≥ 4)
4,0 ± 0,05
(P = 2)
For respective dimensional codes, see Figures 8 and 9.

Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape
Dimensions in millimetres
a
Tape B D E F P P T W A ,
1 1 2 1 2 2 0
size B , K
0 0
max. min. min. max.
8 4,35 0,3 6,25 3,5
3,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 +0,3
8,0 See
−0,1
4,0 ± 0,1
5.2
12 8,2 1,5 10,25 6,5
5,5 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 +0,3
12,0
−0,1
4,0 ± 0,1 to
12,0 ± 0,1 in
4,0 increments
16 12,1 1,5 14,25 7,5 ± 0,1 4,0 ± 0,1 to 2,0 ± 0,1 9,5 +0,3
16,0
−0,1
16,0 ± 0,1 in
4,0 increments
24 20,1 1,5 22,25 11,5 ± 0,1 4,0 ± 0,1 to 2,0 ± 0,1 12,5 +0,3
24,0
−0,1
24,0 ± 0,1 in
4,0 increments
For respective dimensional codes, see Figures 8 to 10.
a
Optionally, for easy and reliable removal of the component, or for component inspection or for any applicable
application, the cavity may have a hole in the centre of the bottom.

Table 11 – Component tilt, rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
(design value) (design value)
mm mm
8, 12 10° maximum 20° maximum 0,5 maximum
16, 24 10° maximum 10° maximum 0,5 maximum
For respective dimensional codes, see Figure 10.
The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is
10° maximum.
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral
movement of 0,2 mm maximum.
When handling bare die products in tape size 8 mm, the lateral movement of 0,1 mm maximum for either cavity
dimension should be allowed.
When handling bare die products in tape size 12 mm, the lateral movement of 0,15 mm maximum f
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