IEC 61837-1:2012

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240.
This publication is to be read in conjunction with IEC 61240:1994.

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 1: Encombrements des enveloppes en plastique moulées

La CEI 61837-1:2012 traite des encombrements normalisés et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence, applicables aux enveloppes en plastique moulées, et elle est basée sur la CEI 61240.
Cette publication doit être lue conjointement avec la CEI 61240:1994.

General Information

• Status: Published
• Publication Date: 19-Apr-2012
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
• Current Stage: PPUB - Publication issued
• Start Date: 30-Apr-2012
• Completion Date: 20-Apr-2012

Relations

• Revises: IEC 61837-1:1999 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61837-1 ®
Edition 2.0 2012-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 1: Plastic moulded enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 1: Encombrements des enveloppes en plastique moulées

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IEC 61837-1 ®
Edition 2.0 2012-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 1: Plastic moulded enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 1: Encombrements des enveloppes en plastique moulées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.140 ISBN 978-2-8322-0078-0

– 2 – 61837-1 © IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Plastic moulded enclosure dimensions . 6
6 Lead connections . 6
7 Plastic moulded enclosures . 6

Table 1 – Designation of plastic moulded enclosures . 6

61837-1 © IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 1: Plastic moulded enclosure outlines

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
lnternational Standard IEC 61837-1 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
This second edition cancels and replaces the first edition published in 1999. It is a technical
revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• one enclosure type (SIP-L5/01) has been deleted;
• Configuration symbol of enclosures is currently consolidated into one as DCC (dual chip
carrier).
– 4 – 61837-1 © IEC:2012
The text of this standard is based on the following documents:
CDV Report on voting
49/930/CDV 49/969/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This lnternational Standard shall be read in conjunction with IEC 61240:1994. IEC 61240:1994
deals with standard outlines and terminal lead connections as they apply to SMDs for frequency
control and selection in plastic moulded enclosures.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC web site.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
61837-1 © IEC:2012 – 5 –
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 1: Plastic moulded enclosure outlines

1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply
to SMDs for frequency control and selection in plastic moulded enclosures and is based on
IEC 61240.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240: 1994, Piezoelectric devices – Preparation of outline drawings of surface-mounted
devices (SMD), for frequency control and selection – General rules
3 Configuration of enclosures
These enclosures are made of plastic moulded materials with the terminal leads based on the
descriptive designation system for semiconductors, devices package.
The configuration symbols are shown as follows:
– DCC (dual chip carrier)
4 Designation of types
The designation of types is shown in four parts as follows:

A B C D D’
A: Configuration symbol of enclosures:
– DCC (dual chip carrier);
B: Structure of terminal leads:
– J: leaded type;
C: Number of terminal leads
D: Two digit serial number
___________
A new edition is under consideration.

– 6 – 61837-1 © IEC:2012
5 Plastic moulded enclosure dimensions
The dimensions in this standard apply to all the completed SMD-devices for frequency control
and selection. Only those dimensions are given which meet the requirements of IEC 61240.
6 Lead connections
Recommendations for the lead connections of all completed SMD-devices for frequency control
and selection are given in the following individual sheets. Lead connections shall always be
given in the detail specification.
7 Plastic moulded enclosures
The following table sets out the designation of the plastic moulded enclosures as outlined in the
ensuing specification sheets.
Table 1 – Designation of plastic moulded enclosures
No. Type Sheet No. Description
1 DCC-J4/01 Sheet 1 Plastic, moulded,
...