Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General

Modification of the validity date: now put at 2007.

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 1: Généralités

Modification de la date de validité : fixée maintenant à 2007.

General Information

Status
Published
Publication Date
11-Aug-2003
Technical Committee
Current Stage
PPUB - Publication issued
Start Date
31-Aug-2003
Completion Date
12-Aug-2003
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IEC 60749-1:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General Released:8/12/2003
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Standards Content (Sample)


CEI 60749-1 IEC 60749-1
(Première édition – 2002) (First edition – 2002)
DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –
ET CLIMATIQUES –
Partie 1: Généralités Part 1: General
CORRIGENDUM 1
Page 6 Page 7
Au lieu de: Instead of:
Le comité a décidé que le contenu de The committee has decided that the
cette
...

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