IEC PAS 62878-2-5:2015
(Main)Device embedded substrate - Guidelines - Data format
Device embedded substrate - Guidelines - Data format
IEC PAS 62878-2-5:2015(E) defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.
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IEC PAS 62878-2-5 ®
Edition 1.0 2015-08
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Device embedded substrate – Guidelines – Data format
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IEC PAS 62878-2-5 ®
Edition 1.0 2015-08
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
colour
inside
Device embedded substrate – Guidelines – Data format
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-2808-1
– 2 – IEC PAS 62878-2-5:2015 © IEC 2015
CONTENTS
FOREWORD . 4
1 Scope . 6
1.1 Purpose . 7
1.2 Applicable range . 7
1.2.1 Product . 7
1.2.2 Process . 8
1.3 Features . 9
1.3.1 Maintenance of the device embedded substrate structure . 9
1.3.2 Maintenance of SiP interposer structure . 10
1.3.3 Maintenance of design data with a virtual layer of terminal positions of
embedded device(s) . 10
1.3.4 Maintenance of terminal structure and embedded device structure
including SiP . 11
1.3.5 Seamless ownership of design data . 11
2 File description . 12
2.1 File description summary . 12
2.1.1 Types of data and their structure . 12
2.1.2 File structure . 14
2.2 3D expression . 15
2.2.1 Coordinates . 15
2.2.2 Position description . 16
2.2.3 Relation between coordinate origin and board position . 16
2.3 Layer concept . 17
2.4 Substrate data . 17
2.4.1 Layer map information . 18
2.4.2 Device arrangement information . 19
2.4.3 Basic figures . 21
2.4.4 Net information . 28
2.4.5 Artwork information . 29
2.4.6 Package information . 29
2.4.7 External port information. 29
2.4.8 Internal port information . 29
2.4.9 User expansion information . 29
2.5 Defined data . 29
2.5.1 Layer definition . 30
2.5.2 Land definition . 30
2.5.3 Via definition . 31
2.5.4 Device definition . 32
2.5.5 User expansion definition . 33
3 Terminology. 34
4 Commentary – Additional information . 36
Figure 1.1 – Flow chart of design of device embedded substrate . 7
Figure 1.2 – General concept of product . 8
Figure 1.3 – Example of a structure of a device embedded substrate . 10
Figure 1.4 – Examples of a structure of a SiP interposer . 10
Figure 1.5 – Example of a laying terminal position of an embedded device
in a virtual layer . 11
Figure 1.6 – Example of showing structures of device embedding and terminals . 11
Figure 1.7 – Example of showing structures of SiP and of a device
embedding substrate . 12
Figure 2.1 – Data structure . 14
Figure 2.2 – One file structure (recommended) . 15
Figure 2.3 – Two-File structure . 15
Figure 2.4 – Definition of coordinates . 16
Figure 2.5 – Position definition . 16
Figure 2.6 – Relation between coordinates and board position . 17
Figure 2.7 – Layer concept . 17
Figure 2.8 – Construction of mounting layers . 18
Figure 2.9 – Construction in the case of omission of mounting layers . 19
Figure 2.10 – Layer definition in pad connection . 20
Figure 2.11 – Layer definition in via connection . 20
Figure 2.12 – XYZ axes rotation direction . 21
Figure 2.13 – Point . 22
Figure 2.14 – Area shapes . 23
Figure 2.15 – Area shapes . 23
Figure 2.16 – Letter data. 24
Figure 2.17 – Text shape . 24
Figure 2.18 – Bonding wire information . 25
Figure 2.19 – Wire bonding shape . 25
Figure 2.20 – Rectangular prismoid . 26
Figure 2.21 – Examples of via specification . 27
Figure 2.22 – Device definition . 27
Figure 2.23 – Example of group such as dimension lines . 28
Figure 2.24 – Data structure of net information . 28
Figure 2.25 – Relation of layer definition data . 30
Figure 2.26 – Land definitions . 31
Figure 2.27 – Relation between hole information and land information . 32
Figure 2.28 – Definitions of SiP, module and MEMS . 33
Figure 2.29 – Definitions of package and mold components . 33
Table 1.1 – Information required in production . 9
Table 2.1 – List of data . 13
– 4 – IEC PAS 62878-2-5:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
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DEVICE EMBEDDED SUBSTRATE – GUIDELINES – DATA FORMAT
FOREWORD
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