Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Modification of the validity date: now put at 2007.

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe

Modification de la date de validité : fixée maintenant à 2007.

General Information

Status
Published
Publication Date
11-Aug-2003
Technical Committee
Current Stage
DELPUB - Deleted Publication
Completion Date
03-Mar-2017
Ref Project

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IEC 60749-3:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination Released:8/12/2003
English and French language
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Standards Content (Sample)


CEI 60749-3 IEC 60749-3
(Première édition – 2002) (First edition – 2002)
DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –
ET CLIMATIQUES –
Partie 3: Examen visuel externe Part 3: External visual examination
CORRIGENDUM 1
Page 2 Page 3
Au lieu de: Instead of:
Le comité a décidé que le contenu de The committee has decided
...

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