IEC 60749-3:2017

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe

L’IEC 60749-3:2017 a pour but de vérifier que les matériaux, la conception, la construction, les marquages et l’exécution du dispositif à semiconducteurs sont conformes au document d’approvisionnement applicable. L’examen visuel externe est un essai non destructif et il s’applique à tous les types de boîtiers. Cet essai est utile pour la qualification, la surveillance des procédés ou pour la réception des lots.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) référence à la nécessité d’une protection contre les décharges électrostatiques;
b) inclusion d’informations sur le phénomène de trichite d’étain;
c) inclusion d’un formulaire/d’une liste de contrôle facultatif, à des fins de rapport.

General Information

• Status: Published
• Publication Date: 02-Mar-2017
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 24-Mar-2017
• Completion Date: 03-Mar-2017

Relations

• Revises: IEC 60749-3:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
• Effective Date: 05-Sep-2023
• Revises: IEC 60749-3:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-3 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 3: External visual examination

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 60749-3 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –

Part 3: External visual examination

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4001-4

– 2 – IEC 60749-3:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 5
5 Procedure . 5
6 Failure criteria . 6
7 Summary . 6
Annex A (informative) External visual report form/checklist (example only – not a
mandatory template) . 7
A.1 Leads. 7
A.2 Lead finish . 8
A.3 Moulding and mould compound . 8
A.4 Critical sealant . 9
A.5 Attachments . 9
A.6 Marking . 9
A.7 Solder Balls . 10
A.8 Substrate . 10
A.9 Exposed (Backside) Silicon . 10
Bibliography . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 3: External visual examination

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-3 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of a
...

IEC 60749-3 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 3: External visual examination

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 3: Examen visuel externe

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
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Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
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once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
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publication ou si vous avez des questions contactez-nous:
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IEC 60749-3 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 3: External visual examination

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 3: Examen visuel externe

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-7318-0

– 2 – IEC 60749-3:2017 © IEC 2017
CONTENTS
CONTENTS . 2
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 5
5 Procedure . 5
6 Failure criteria . 6
7 Summary . 6
Annex A (informative) External visual report form/checklist (example only – not a
mandatory template) . 7
A.1 Leads. 7
A.2 Lead finish . 8
A.3 Moulding and mould compound . 8
A.4 Critical sealant . 9
A.5 Attachments . 9
A.6 Marking . 9
A.7 Solder Balls . 10
A.8 Substrate . 10
A.9 Exposed (Backside) Silicon . 10
Bibliography . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 3: External visual examination

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-3 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

– 4 – IEC 60749-3:2017 © IEC 2017
This bilingual version (2019-08) corresponds to the monolingual English version, published in
2017-03.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2345/FDIS 47/2370/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 3: External visual examination

1 Scope
The purpose of this part of IEC 60749 is to verify that the materials, design, construction,
markings, and workmanship of a semiconductor device are in accordance with the applicable
procurement document. External visual inspection is a non-destructive test and applicable for
all package types. The test is useful for qualification, process monitor, or lot acceptance.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61340-5-1, Electrostatics – Part 5-1: Protec
...