IEC 60664-3:2003/AMD1:2010/COR1:2010
(Amendment)Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
General Information
- Abstract
- Status
- Published
- Publication Date
- 28-Nov-2010
- Technical Committee
- TC 109 - Insulation co-ordination for low-voltage equipment
- Current Stage
- DELPUB - Deleted Publication
- Start Date
- 04-Nov-2016
- Completion Date
- 28-Aug-2026
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IEC 60664-3:2003/AMD1:2010/COR1:2010 - Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution Released:11/29/2010
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
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IEC 60664-3:2003/AMD1:2010/COR1:2010 - Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution Released:11/29/2010
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Frequently Asked Questions
IEC 60664-3:2003/AMD1:2010/COR1:2010 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution". This standard covers: Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
IEC 60664-3:2003/AMD1:2010/COR1:2010 is classified under the following ICS (International Classification for Standards) categories: 29.080.30 - Insulation systems. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60664-3:2003/AMD1:2010/COR1:2010 has the following relationships with other standards: It is inter standard links to IEC 60664-3:2003/AMD1:2010, IEC 60664-3:2016. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60664-3:2003/AMD1:2010/COR1:2010 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
IEC 60664-3 CEI 60664-3
(Amendment 1 to second edition – 2010) (Amendement 1 à la deuxième édition – 2010)
Insulation coordination for equipment within Coordination de l'isolement des matériels dans
low-voltage systems – les systèmes (réseaux) à basse tension –
Part 3: Use of coating, potting or moulding for Partie 3: Utilisation de revêtement, d'empotage
protection against pollution ou de moulage pour la protecti
...