Amendment 1 - LED-binning - Part 1: General requirements and white colour grid intended for automotive applications intended for automotive applications

Amendement 1 - Tri des LED - Partie 1: Exigences générales et matrice de couleur blanche destinées aux applications automobiles

General Information

Status
Published
Publication Date
16-Aug-2018
Current Stage
PPUB - Publication issued
Completion Date
17-Aug-2018
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IEC 62707-1:2013/AMD1:2018 - Amendment 1 - LED-binning - Part 1: General requirements and white colour grid intended for automotive applications intended for automotive applications
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IEC 62707-1
Edition 1.0 2018-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AM ENDMENT 1
AM ENDEMENT 1
LED-binning –
Part 1: General requirements and white colour grid intended for automotive
applications
Tri des LED –
Partie 1: Exigences générales et matrice de couleur blanche destinées aux
applications automobiles
IEC 62707-1:2013-12/AMD1:2018-08(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62707-1
Edition 1.0 2018-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AM ENDMENT 1
AM ENDEMENT 1
LED-binning –
Part 1: General requirements and white colour grid intended for automotive
applications
Tri des LED –
Partie 1: Exigences générales et matrice de couleur blanche destinées aux
applications automobiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.140.99 ISBN 978-2-8322-5944-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62707-1:2013/AMD1:2018
© IEC 2018
FOREWORD
This amendment has been prepared by subcommittee 34A: Lamps, of IEC technical
committee 34: Lamps and related equipment.
The text of this amendment is based on the following documents:
FDIS Report on voting
34A/2098/FDIS 34A/2107/RVD

Full information on the voting for the approval of this amendment can be found in the report

on voting indicated in the above table.

The committee has decided that the contents of this amendment and the base publication will

remain unchanged until the stability date indicated on the IEC website under

"http://webstore.iec.ch" in the data related to the specific publication. At this date, the

publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Title
Replace the part title as follows:
Part 1: General requirements and white colour grid intended for
automotive applications
1 Scope
Replace, in the first paragraph, the last sentence with the following new text:
“It applies to LED packages intended for automotive applications.”
Add, at the end of Clause 4, the following new Clause 5:
5 Binning test procedure
5.1 General

For LED packages producing visible radiation the following binning test procedure shall be

applied. Annex C gives information on the recommended measurement accuracy.
---------------------- Page: 4 ----------------------
IEC 62707-1:2013/AMD1:2018 – 3 –
© IEC 2018
5.2 Temperature pre-conditioning

Before starting the binning test procedure, the LED package temperatures shall be stabilized

as follows:
Each of T , T , T , T shall be 23 °C ± 5 °C
a s c j
where
T is the ambient temperature of the air surrounding the LED package;
T is the solder temperature of the LED package;
T is the temperature at the T point of the LED package;
c c
T is the junction temperature of the LED package.
5.3 Pulse definition and measurement intervals

During the binning test procedure, the following times and time-intervals (in millisecond, ms)

shall be applied, see Table 5 and Figure 5.

Where a certain range is given, the LED package manufacturer shall choose an appropriate

value.

This choice of the LED package manufacturer shall be made taking into account the following

parameters:
• measurement equipment capability,
• typical input power of the LED package,
• typical heat capacity of the LED package,
• typical thermal conductivity of the LED package,
• typical thermal time-constant of the LED package,

• typical increase of T during the measurement e.g. by monitoring changes in forward

voltage.
NOTE In this context, “typical” means: representative for the product family.
The integrating times for the measurements shall be chosen by the LED package

manufacturer to ensure stabilization of the measurement and to avoid an excessive increase

of the junction temperature (T ) of the LED package during the integration time.

It is recommended that the increase of junction temperature (T ) during the integration time

should not be greater than 5 K.
---------------------- Page: 5 ----------------------
– 4 – IEC 62707-1:2013/AMD1:2018
© IEC 2018
Table 5 – Times and time-intervals for the binning test procedure
Step Time (ms) Action
1 t = 0 LED package is switched ON at the binning current I . See Note 1.
f,bin
2 t = 1 to 5 End of stabilization time.

3 t = 1 to 10: Start of the electrical measurement (e.g. V ), using a 4-wire technique, with an

integration time of 1 ms (minimum) to 5 ms (maximum).

4 t = 1 to 10 Start of optical measurement (e.g. luminous flux, luminous intensity, colour,

λ ) , with an integration time of 1 ms (minimum) to 40 ms (maximum) (see Note
dom
2 and Note 3)

5 t = 50 Latest time at which optical measurement ends and LED package is switched off.

NOTE 1 The method of selecting the binning current I is described in 5.4.
f,bin
NOTE 2 A typical integration time for optical measurements is 20 ms.

NOTE 3 For LED packages with intensity values below 50 mcd, higher integration times can be used.

If luminous intensity binning is used, information should be provided for correlation of a luminous intensity

value to its corresponding luminous flux value. This correlation factor should be based on a representative

value for the product family.
Pulse length: LED is switched on at t = 0 at the binning current I bin
and switched off no later than at t = 51 ms
Optical measurement: Integration time 1 ms to 51 ms

(Note: some manufacturers can start the optical measurement only after the end of the

electrical measurement)
Stabilization time: 1 ms to 5 ms
Electrical
Integration time: 1 ms to 5 ms after stabilization
Measurement

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

time in ms
IEC
Figure 5 – Times and time-intervals for binning tests
5.4 Binning currents
5.4.1 High-power (rated power ≥ 250 mW) InGaN-based LED packages

For LED packages with a rated input power equal or greater than 250 mW, based on InGaN

technology, the appropriate binning current shall be selected from the list of binning currents

given in Table 6, in order to be within the range of 65 % to 75 % of the maximum rated value

as given in the LED package datasheet, i.e. 0,65 x I ≤ I ≤ 0,75 x I where I is
f,max f,bin f,max f,bin
chosen from the values given in Table 6 (rule No.1)
where
I is the binning current;
f,bin
I is the maximum drive current specified on the data sheet.
f,max
---------------------- Page: 6 ----------------------
IEC 62707-1:2013/AMD1:2018 – 5 –
© IEC 2018

If more than one value of Table 6 meet this criteria, then the value closest to one of the two

border values shall be chosen (rule No.1a).
In case of doubt, the higher value shall be chosen (rule No.1b).

NOTE The input power of an LED package and its material-technology are given by the LED package

manufacturer on the data sheet.
If no value from Table 6 fulfils the above requirements (“unl
...

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