IEC 60749-42:2014

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 42: Stockage de température et d'humidité

L'IEC 60749-42:2014 décrit une méthode d'essai pour évaluer l'endurance des dispositifs à semiconducteurs utilisés dans les environnements à température élevée et à forte humidité. Cette méthode d'essai est utilisée pour évaluer la résistance à la corrosion des interconnexions métalliques des puces des dispositifs à semiconducteurs sous boîtiers moulés en plastique ou contenus dans d'autres types de boîtiers. Elle est aussi utilisée comme moyen pour accélérer le phénomène de fuite dû à la pénétration d'humidité à travers le film de passivation et comme préconditionnement en vue de différents types d'essais.

General Information

• Status: Published
• Publication Date: 11-Aug-2014
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 31-Aug-2014
• Completion Date: 12-Aug-2014

Standards Content (Sample)

IEC 60749-42 ®
Edition 1.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 42: Temperature and humidity storage

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 42: Stockage de température et d'humidité

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IEC 60749-42 ®
Edition 1.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 42: Temperature and humidity storage

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 42: Stockage de température et d'humidité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX H
ICS 31.080.01 ISBN 978-2-8322-1785-6

– 2 – IEC 60749-42:2014 © IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Test equipment . 5
3.1 Capacity of the equipment . 5
3.2 Materials and construction of the thermostatic/humidistatic chamber . 5
3.3 Water to be used in the test . 5
4 Procedure . 5
4.1 Preconditioning . 5
4.2 Initial measurements . 6
4.3 Tests . 6
4.3.1 Inserting and removing specimens . 6
4.3.2 Test conditions . 6
4.3.3 Test duration . 6
4.3.4 Post treatment . 7
4.3.5 End-point measurement . 7
5 Failure criteria . 7
6 Information to be given in applicable procurement document . 8

Figure 1 – Unsaturated pressurized vapour test conditions profile. 7

Table 1 – Temperature and humidity storage test conditions . 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 42: Temperature and humidity storage

FOREWORD
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International Standard IEC 60749-42 has been prepared by IEC technical committee 47:
Semiconductor devices.
This first edition is based on Japan Electronics and Information Technology Industries
Association, EIAJ ED-4701/100, Environmental and endurance test methods for
semiconductor devices, test method 103. It is used with permission of the copyright holder,
Japan Electronics and Information Technology Industries Association (JEITA).

– 4 – IEC 60749-42:2014 © IEC 2014
The text of this standard is based on the following documents:
FDIS Report on voting
47/2200/FDIS 47/2204/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 42: Temperature and humidity storage

1 Scope
This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor
devices used in high temperature and high humidity environments.
This test method is used to evaluate the endurance against corrosion
...