IEC PAS 62169:2000
(Main)Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
Provides SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Applicable to all nonhermetic SMDs subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials that are exposed to the ambient air. IEC/PAS 62169 is in the process of being re-issued in the form of IEC international standard under reference IEC 60749-20-1.
General Information
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Standards Content (Sample)
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Edition 1.0
2000-08
Standard for handling, packing,
shipping and use of moisture/reflow
sensitive surface mount devices
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62169
C O MMI S S I O N
IPC/JEDEC J-STD-033
MAY 1999
JOINT
INDUSTRY
STANDARD
Standard for Handling,
Packing, Shipping and
Use of Moisture/Reflow
Sensitive Surface
Mount Devices
Copyright © 1999, JEDEC; 2000, IEC
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
STANDARD FOR HANDLING, PACKING, SHIPPING AND USE
OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62169 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1469/PAS 47/1502/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1999, JEDEC; 2000, IEC
Contents
1 Foreword1
2 Purpose1
3 Scope1
3.3 Reliability2
4 Applicable documents2
4.1 2
Joint Industry Standards
4.2 Electronic Industries Alliance (EIA, JEDEC)2
4.3 Department of Defense3
4.4 American Society for testing and Materials (ASTM)3
5 Terms and definitions3
6.1 Requirements4
6.2 Drying of components before being sealed in MBBs4
7.1 Post exposure to factory ambient9
7.2 General considerations for baking9
8.2 Floor life11
8.3 Safe storage11
8.4 Reflow11
8.5 Drying indicators12
9 Derating due to factory environmental conditions13
-i-
8.6 Board rework
8.1 Incoming bag inspection
8 Use
7 Drying
6.3 Dry pack
6 Dry packing
EIA JEDEC/Institute for Interconnecting and Packaging Electronic Circuits (IPC) &
3.2 Assembly process
3.1 Packages
Page
SENSITIVE SURFACE MOUNT DEVICES
STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW
Joint IPC/JEDEC Standard J-STD-033
Copyright © 1999, JEDEC; 2000, IEC
Contents (concluded)
Tables
2 Reference conditions for drying components that were exposed to conditions £8
83 Default baking times used prior to dry-pack that were exposed to conditions £
4 Moisture classification level and floor life11
5 Recommended equivalent total floor life (days)14
Figures
1 Typical dry pack configuration for moisture-sensitive packages in shipping tubes5
2 Sample humidity indicator card6
3 Moisture-sensitive identification label (Example)7
4 Moisture-sensitive caution label (Example)7
-ii-
60% RH
60% RH
1 Dry packing requirements
Page
SENSITIVE SURFACE MOUNT DEVICES
STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW
Joint IPC/JEDEC Standard J-STD-033
Copyright © 1999, JEDEC; 2000, IEC
(From JEDEC Board Ballot JCB-99-04, formulated under the cognizance the IPC Plastic Chip Carrier
Cracking Task Group, B-10a, and the JEDEC JC-14.1 Committee on Reliability Test Methods for
1 Foreword
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns
regarding package cracks and delamination. This document describes the standardized levels of floor life
exposure for moisture/reflow-sensitive SMDs along with the handling, packing and shipping
requirements necessary to avoid moisture/reflow-related failures. Companion documents, J-STD-020,
define the classification procedure and JEP113 define the labeling requirements.
Moisture from atmospheric humidity will enter permeable packaging materials by diffusion and
preferentially collect at the dissimilar material interfaces. Assembly processes, used to solder SMDs to
printed circuit boards (PCBs), will expose the entire package body to temperatures higher than 200 °
During solder reflow, the combination of rapid moisture expansion and materials mismatch can result in
package cracking and/or delamination of critical interfaces within the package.
The solder reflow processes of concern are convection, convection/IR, infrared (IR), vapor phase (VPR),
and hot air rework tools. The use of assembly processes that immerse the component body in molten
2 Purpose
The purpose of this document is to provide SMD manufacturers and users with standardized methods for
handling, packing, shipping, and use of moisture/reflow sensitive SMDs. These methods are provided to
avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in
yield and reliability degradation. By using these procedures, safe and damage-free reflow can be
12 months from the seal date.
3 Scope
3.1 Packages
3.1.1 This standard applies to all nonhermetic SMDs subjected to bulk solder reflow processes during
permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air.
3.1.2 Hermetic components are not at risk and do not require moisture precautionary handling.
PCB assembly, including plastic encapsulated packages and all other packages made with moisture-
achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of
solder are not recommended for most SMD components.
C.
Packaged Devices.)
SENSITIVE SURFACE MOUNT DEVICES
STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW
Page
Joint IPC/JEDEC Standard J-STD-033
Copyright © 1999, JEDEC; 2000, IEC
3 Scope (cont’d)
3.2 Assembly processes
3.2.1 This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR),
and vapor phase reflow (VPR) processes. It does not apply to bulk solder reflow processes that immerse
the component bodies in molten solder (e.g., backside wave solder). Such processes are not allowed for
many SMDs and are not covered by the component qualifications standards used as a basis for this
3.2.2 This standard also applies to moisture sensitive components that are removed or attached singly by
local ambient heating, i.e., “hot air rework.”
3.2.3 This standard does not apply to components that are socketed and not exposed to solder reflow
temperatures. Such components are not at risk and do not require moisture precautionary handling.
3.2.4 This standard does not apply to components in which only the leads are heated to reflow the solder,
e.g., hand-soldering, hot bar attach of gull wing leads, and pin-thru-hole with backside wave solder. The
heat absorbed by the package body from such operations is typically much lower than for bulk surface
mount reflow or hot air rework, and moisture precautionary measures are typically not needed.
3.3 Reliability
3.3.1 The methods set forth in this specification ensure that adequate component reliability, as evaluated
and verified by J-STD-020 and/or by JESD22-A113 plus environmental reliability testing, is maintained
during and after the PCB assembly operation.
3.3.2 This specification does not address or ensure solder joint reliability of attached components.
4 Applicable documents
4.1 EIA JEDEC/Institute for Interconnecting and Packaging Electronic Circuits (IPC) & Joint
Industry Standards
J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount
4.2 Electronic Industries Alliance (EIA, JEDEC)
Packaging Material Standards for Moisture Sensitive Items
Requirements for Handling Electrostatic Discharge Sensitive (
Symbol and Labels for Moisture Sensitive Devices
Preconditioning of Nonhermetic Surface Mount Components Prior to Reliability
Testing
JESD22-A113
JEP-113
ESD) Devices EIA-625
EIA-583
Packaging Material Standards for ESD Sensitive Items EIA-541
Devices
document.
Page
Joint IPC/JEDEC Standard J-STD-033
Copyright © 1999, JEDEC; 2000, IEC
4 Applicable documents (cont’d)
4.3 Department of Defense
r Materials, Water vapor proof, Grease proof, Flexible, Heat sealable
Type I - Barrier Materials Flexible. Electrostatic-free. Heat sealable
4.4 American Society for Testing and Materials (ASTM)
Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and
Sheeting Using a Modulated Infrared Sensor.
Standard Test Method for Flex Durability of Flexible Barrier Materials
5 Terms and definitions
active desiccant: Desiccant that is either fresh (new) or has been baked according to the manufacturer's
recommendations to renew desiccant to original specifications.
bulk reflow: Reflow of multiple components, with simultaneous attachment, by an infrared (IR),
convection/IR, convection, or vapor phase reflow (VPR) process.
carrier : Container that directly holds components, such as a tray, tube, or tape and reel.
desiccant: An absorbent material used to maintain a low relative humidity in moisture barrier bags for
floor life: The allowable time period, after removal from a moisture barrier bag and before the solder
reflow process, for a moisture sensitive device to be exposed to a factory ambient not exceeding 30 °C
Humidity Indicator Card (HIC): A card on which a moisture sensitive chemical is printed such that it
will change color from blue to pink when the indicated relative humidity is exceeded. This is packed
inside the moisture sensitive bag, along with the desiccant, to aid in determining the level of moisture to
which the moisture sensitive devices have been subjected. The humidity indicator card should comply
Manufacturer's Exposure Time (MET):
manufacturer requires to process components prior to bag seal. It also includes the maximum time
allowed at the distributor for having the bag open to split out smaller shipments.
Moisture Barrier Bag (MBB): A bag designed to restrict the transmission of water vapor and used to
flexibility, electrostatic discharge protection, mechanical strength, and puncture resistance. The water
vapor transmission rate as measured using ASTM F 1249-90 is required to be £ in 24
hrs. at 40 °C after flex testing per condition “E” of ASTM F 392-93.
0.002 gm/100 in
pack moisture-sensitive devices. The MBB should meet or exceed MIL-B-81705 Type I requirements for
The maximum time after bake that the component
-8835. -I with MIL
and 60% RH.
in dustless pouches. Desiccant must meet or exceed MIL-D 3464 Class II requirements.
dry-packing moisture-sensitive devices. Desiccant may be a silica gel or other absorbent material packed
ASTM F 392-93
ASTM F 1249-90
Indicator, Humidity, Card, Chemically Impregnated MIL-I-8835
Type II - Desiccant, Activated, Bagged, Packaging Use and Static Dehumidification MIL-D-3464
MIL-B-81705
Type I - Barrie MIL-B-131
Page
Joint IPC/JEDEC Standard J-STD-033
Copyright © 1999, JEDEC; 2000, IEC
5 Terms and definitions (cont’d)
shelf life:
MBB, such that the required interior bag ambient humidity is maintained, based on the HIC reading.
solder reflow: The solder attachment process in which previously applied solder or solder paste is
remelted to attach a component to the printed circuit board.
Water Vapor Transmission Rate (WVTR): A measure of the permeability of plastic film or metallized
plastic film material to moisture, an important rating for moisture barrier bags.
6.1 Requirements
Dry packing requirements for the various moisture sensitivity levels are shown in Table 1. The levels are
determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. As a minimum all materials
Table 1 — Dry packing requirements
Dry Before
Level Bag MBB Desiccant Caution Label
1Optional Optional Optional Not Required Not Required if
classified at 220 °C
Required if classified
at 235 °C
2Optional Required Required Required Required
Required Required Required Required Required
6Optional Optional Optional Required Required
* MSID = Moisture-Sensitive Identification Label
6.2 Drying of components before being sealed in MBBs
6.2.1 Components classified at levels 2a through 5a
...
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