IEC PAS 62168:2000

Symbols and labels for moisture-sensitive devices

Provides a distinctive symbol and labels to be used to identify those devices that require special packing and handling precautions. Certain plastic surface-mount components are subject to permanent damage due to moisture-induced failures encountered during high-temperature surface-mount processing unless appropriate precautions are observed. IEC/PAS 62168 is in the process of being re-issued in the form of IEC international standard under reference IEC 60749-20-1.

General Information

• Status: Replaced
• Publication Date: 21-Aug-2000
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 07-Apr-2009

Relations

• Replaced By: IEC 60749-20-1:2009 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
• Effective Date: 05-Sep-2023

Standards Content (Sample)

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Edition 1.0
2000-08
Symbol and labels for
moisture-sensitive devices
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62168
C O MMI S S I O N
EIA/JEDEC
ENGINEERING
PUBLICATION
Symbol and Labels for Moisture-
Sensitive Devices
(Revision of JEP113-A)
MAY 1999
JEDEC Solid State Technology Association
ELECTRONIC INDUSTRIES ALLIANCE
JEP113-B
Copyright © 1999, JEDEC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES

FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the

public and established in an organization operating under given procedures.
IEC-PAS 62168 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1468/PAS 47/1501/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1999, JEDEC; 2000, IEC
JEDEC Publication No. 113-B
SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES

1 Introduction
J-STD-020 Moisture/
4 Symbol and labels
Figure 1 — Moisture-sensitive symbol
it appears on all moisture sensitive caution labels (see Figure 4).
This symbol (see Figure 1) indicates that devices are moisture sensitive to a level from 2 to 6 and
4.1 Moisture-sensitive symbol
Devices
J-STD-033 Standard for Handling And Shipping Of Moisture/Reflow Sensitive Surface Mount
Mount Devices
Reflow Sensitivity Classification for Non-Hermetic Solid State Surface
3 Reference documents
those devices that require special packing and handling precautions.
The purpose of this publication is to provide a distinctive symbol and labels to be used to identify
2 Purpose
appropriate precautions are observed.
induced failures encountered during high-temperature surface-mount processing unless
Certain plastic surface-mount components are subject to permanent damage due to moisture-
Subcommittee on Reliability Test Methods for Packaged Devices.)
(From JEDEC Board Ballot JCB-98-132, formulated under the cognizance of the JC-14.1
Page
Copyright © 1999, JEDEC; 2000, IEC
JEDEC Publication No. 113-B
4 Symbol and labels (
4.2  Moisture-Sensitive Identification (MSID) label

°
These Devices do not require special storage
conditions provided:
1. They are maintained at conditions equal to or
less than 30 °C/85 % RH, and
2. They are solder
temperature which does not exceed 235 °C
Note: Level and body temperature defined
by IPC/JED
...