IEC PAS 62175:2000

Marking permanency test method

Verifies that the markings on solid state semiconductor devices will not become illegible when subjected to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.

General Information

• Status: Replaced
• Publication Date: 23-Aug-2000
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: WPUB - Publication withdrawn
• Start Date: 30-Jun-2002
• Completion Date: 01-Jul-2002

Relations

• Replaced By: IEC 60749-9:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
• Effective Date: 05-Sep-2023

Standards Content (Sample)

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Edition 1.0
2000-08
Marking permanency test method

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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62175
C O MMI S S I O N
Copyright © 1995, JEDEC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
MARKING PERMANENCY TEST METHOD

FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62175 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1448/PAS 47/1481/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1995, JEDEC; 2000, IEC

EIA/JESD22-B107-A
Page 1
MARKING PERMANENCY
(From Council Ballot JCB-94-29A formulated under the cognizance of JC-14.1

Committee on Reliability Test Methods for Packaged Devices)

1 Purpose
The purpose of this test is to verify that the markings on solid state semiconductor devices
will not become illegible when subjected to solvents or cleaning solutions commonly used
during the removal of solder flux residue from the printed circuit board assembly process.
1.1 Formulation of solvents
The formulation of solvents herein is considered typical and representative of the desired
stringency as far as the usual coatings and markings are concerned. Many available solvents
that could be used are either not sufficiently active, too stringent, or even dangerous to
humans when in direct contact or when the fumes are inhaled.
2 Scope
This test is applicable for all package types. It is suitable for use in qualification and/or
process monitor testing. The test should be considered nondestructive and electrical or
mechanical rejects may be used for the purposed of this test.
NOTE - This procedure does not apply to laser branded packages.
3 References
Mil-Std-883, Method 2015 “Resistance to Solvents”
4 Terms and definitions
4.1 Solvent solution “A”
A mixture consisting of the following:
1) One part by volume of isopropyl alcohol, A.C.S. (American Chemical Society)
reagent grade, or isopropyl alcohol according to TT-1-735, grade A or B,
and
Test Method B107-A
(Revision of Test Method B107)

Copyright © 1995, JEDEC; 2000, IEC
JESD22-B107-A
Page 2
2) Three parts by volume of mineral spirits according to TT-
...