Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods

IEC 62007-2:2009 describes the measuring methods applicable to the semiconductor optoelectronic devices to be used in the field of fibre optic digital communication systems and subsystems. This edition includes the following significant technical changes with respect to the previous edition:
- descriptions related to analogue characteristics have been removed;
- some definitions and terms have been revised for harmonisation with other standards originating from SC 86C.

Dispositifs optoélectroniques à semiconducteurs pour application dans les systèmes à fibres optiques - Partie 2: Méthodes de mesure

La CEI 62007-2:2009 décrit les méthodes de mesure applicables aux dispositifs optoélectroniques à semi-conducteurs utilisés dans le domaine des systèmes et sous-systèmes de télécommunication numérique à fibres optiques. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- les descriptions relatives aux caractéristiques analogiques ont été retirées;
- certains termes et définitions ont été revus afin de les harmoniser avec ceux des autres normes émises par le SC 86C.

General Information

Status
Published
Publication Date
25-Jan-2009
Current Stage
PPUB - Publication issued
Start Date
31-Jan-2009
Completion Date
26-Jan-2009
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IEC 62007-2
Edition 2.0 2009-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor optoelectronic devices for fibre optic system applications –
Part 2: Measuring methods
Dispositifs optoélectroniques à semiconducteurs pour application dans les
systèmes à fibres optiques –
Partie 2: Méthodes de mesure
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IEC 62007-2
Edition 2.0 2009-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor optoelectronic devices for fibre optic system applications –
Part 2: Measuring methods
Dispositifs optoélectroniques à semiconducteurs pour application dans les
systèmes à fibres optiques –
Partie 2: Méthodes de mesure
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.080.01; 31.260; 33.180.01 ISBN 978-2-88910-606-6
– 2 – 62007-2 © IEC:2009
CONTENTS
FOREWORD.0H4
INTRODUCTION.1H6
1 Scope.2H7
2 Normative references .3H7
3 Terms, definitions and abbreviations .4H7
3.1 Terms and definitions .5H7
3.2 Abbreviations .6H8
4 Measuring methods for photoemitters .7H8
4.1 Outline of the measuring methods .8H8
4.2 Radiant power or forward current of LEDs and LDs with or without optical
fibre pigtails .9H8
4.3 Small signal cut-off frequency (f ) of LEDs and LDs with or without optical
c
fibre pigtails .10H9
4.4 Threshold current of LDs with or without optical fibre pigtails .11H10
4.5 Relative intensity noise of LEDs and LDs with or without optical fibre pigtails.12H12
4.6 S parameter of LEDs, LDs and LD modules with or without optical fibre
pigtails .13H13
4.7 Tracking error for LD modules with optical fibre pigtails, with or without
cooler.14H15
4.8 Spectral linewidth of LDs with or without optical fibre pigtails .15H17
4.9 Modulation current at 1 dB efficacy compression (I ) of LEDs .16H18
F (1 dB)
4.10 Differential efficiency (η ) of a LD with or without pigtail and an LD module .17H20
d
4.11 Differential (forward) resistance r of an LD with or without pigtail .18H22
d
5 Measuring methods for receivers.19H23
5.1 Outline of the measuring methods .20H23
5.2 Noise of a PIN photodiode.21H23
5.3 Excess noise factor of an APD with or without optical fibre pigtails.22H25
5.4 Small-signal cut-off frequency of a photodiode with or without optical fibre
pigtails .23H27
5.5 Multiplication factor of an APD with or without optical fibre pigtails .24H28
5.6 Responsivity of a PIN-TIA module .25H30
5.7 Frequency response flatness (ΔS/S) of a PIN-TIA module .26H32
5.8 Output noise power (spectral) density P of a PIN-TIA module.27H33
λ
no,
5.9 Low frequency output noise power (spectral) density (P ) and corner
,λ,
no LF
frequency (f ) of a PIN-TIA module .28H35
cor
5.10 Minimum detectable power of PIN-TIA module .29H36
Bibliography.30H38

Figure 1 – Equipment setup for measuring radiant power and forward current of LEDs
and LDs .31H8
Figure 2 – Circuit diagram for measuring small-signal cut-off frequency LEDs and LDs .32H10
Figure 3 – Circuit diagram for measuring threshold current of a LD.33H11
Figure 4 – Graph to determine threshold current of lasers.34H11
Figure 5 – Circuit diagram for measuring RIN of LEDs and LDs .35H12
Figure 6 – Circuit diagram for measuring the S parameter LEDs, LDs and LD
modules.36H14

62007-2 © IEC:2009 – 3 –
Figure 7– Cathode and anode connected to the package of a LD.37H15
Figure 8 – Output radiant power versus time.38H16
Figure 9 – Output radiant power versus case temperature .39H16
Figure 10 – Circuit diagram for measuring linewidth of LDs.40H17
Figure 11 – Circuit diagram for measuring 1 dB efficacy compression of LDs.41H19
Figure 12 – Plot of log V versus log I .42H20
2 1
Figure 13 – Circuit diagram for measuring differential efficiency of a LD .43H21
Figure 14 – Current waveform for differential efficiency measurement .44H21
Figure 15 – Circuit diagram for measuring differential resistance .45H22
Figure 16 – Current waveform for differential resistance .46H23
Figure 17 – Circuit diagram for measuring noise of a PIN photoreceiver .47H24
Figure 18 – Circuit diagram for measuring noise with synchronous detection .48H25
Figure 19 – Circuit diagram for measuring excess noise of an APD.49H26
Figure 20 – Circuit diagram for measuring small-signal cut-off wavelength of a
photodiode.50H28
Figure 21 – Circuit diagram for measuring multiplication factor of an APD .51H29
Figure 22 – Graph showing measurement of I and I .52H30

R1 R2
Figure 23 – Circuit diagram for measuring responsivity of a PIN-TIA module .53H31
Figure 24 – Circuit diagram for measuring frequency response flatness of a PIN-TIA
module.54H32
Figure 25 – Circuit diagram for measuring output noise power (spectral) density of a
PIN-TIA module under matched output conditions.55H34
Figure 26 – Circuit diagram for measuring output noise power (spectral) density of a
non-irradiated PIN-TIA module in the low frequency region.56H35
Figure 27 – Graph of V versus frequency.57H36
m
Figure 28 – Circuit diagram for measuring minimum detectable power of a PIN-TIA
module at a specified bit-error rate (BER) or carrier-to-noise ratio (C/N) .58H37

– 4 – 62007-2 © IEC:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR OPTOELECTRONIC DEVICES
FOR FIBRE OPTIC SYSTEM APPLICATIONS –

Part 2: Measuring methods
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardizatio
...

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