IEC 60749-12:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 12: Vibrations, fréquences variables

General Information

• Status: Published
• Publication Date: 12-Aug-2003
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 13-Dec-2017

Relations

• Corrects: IEC 60749-12:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
• Effective Date: 05-Sep-2023
• Revised: IEC 60749-12:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
• Effective Date: 05-Sep-2023

Standards Content (Sample)

CEI 60749-12 IEC 60749-12
(Première édition – 2002) (First edition – 2002)

DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –

ET CLIMATIQUES –
Part 12: Vibration, variable frequency
Partie 12: Vibrations, fréquences variables

CORRIGENDUM 1
Page 2 Page 3
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