IEC 60749-20-1:2019

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

IEC 60749-20-1:2019 is available as IEC 60749-20-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions;
- addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage

IEC 60749-20-1:2019 est disponible sous forme de IEC 60749-20-1:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60749-20-1:2019 s'applique à tous les dispositifs soumis à des procédés de brasage par refusion en masse lors de l'assemblage de la PCB, comprenant les boîtiers plastiques, les dispositifs sensibles aux procédés et les autres dispositifs sensibles à l'humidité fabriqués dans des matériaux perméables à l'humidité (époxydes, silicones, etc.), qui sont exposés à l'air ambiant. L'objet du présent document est de fournir aux fabricants et aux utilisateurs de CMS des méthodes normalisées pour la manipulation, l'emballage, le transport et l'utilisation des CMS sensibles à l'humidité/la refusion qui sont classés selon les niveaux définis dans l'IEC 60749‑20. Ces méthodes sont fournies pour éviter les dommages provoqués par l'absorption d'humidité et l'exposition aux températures de brasage par refusion pouvant donner lieu à une dégradation de rendement et de fiabilité. L'utilisation de ces procédures permet une refusion sûre et ne causant pas de dommages, avec le procédé d'emballage avec dessiccant, ce qui permet une durée minimale de stockage dans des sachets scellés avec dessiccant à compter de la date de scellement. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- mises à jour de certains paragraphes pour mieux aligner la méthode d'essai avec le document IPC/JEDEC J-STD-033C, comprenant de nouvelles sections sur le nettoyage aqueux et les précautions applicables aux emballages avec dessiccant;
- ajout de deux annexes sur les essais colorimétriques des cartes indicatrices d'humidité (HIC) et la détermination des tableaux d'étuvage.

General Information

• Status: Published
• Publication Date: 25-Jun-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 05-Jul-2019
• Completion Date: 26-Jun-2019

Relations

• Revises: IEC 60749-20-1:2009 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-20-1 ®
Edition 2.0 2019-06
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 20-1: Handling, packing, labelling and shipping of surface-mount devices
sensitive to the combined effect of moisture and soldering heat

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
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need further assistance, please contact the Customer Service

Centre: [e-mail].
IEC 60749-20-1 ®
Edition 2.0 2019-06
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 20-1: Handling, packing, labelling and shipping of surface-mount devices

sensitive to the combined effect of moisture and soldering heat

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-7124-7

– 2 – IEC 60749-20-1:2019 RLV © IEC:2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 General applicability and reliability considerations . 10
4.1 Assembly processes . 10
4.1.1 Mass reflow . 10
4.1.2 Localized heating. 10
4.1.3 Socketed components . 10
4.1.4 Point-to-point soldering . 11
4.1.5 Aqueous cleaning . 11
4.2 Reliability . 11
5 Dry packing . 11
5.1 Requirements . 11
5.2 Drying of SMDs and carrier materials before being sealed in MBBs . 11
5.2.1 Drying requirements – level A2 . 11
5.2.2 Drying requirements – levels B2a to B5a . 12
5.2.3 Drying requirements – carrier materials . 12
5.2.4 Drying requirements – other . 12
5.2.5 Excess time between bake and bag . 12
5.3 Dry pack . 12
5.3.1 Description . 12
5.3.2 Materials . 13
5.3.3 Labels . 16
5.3.4 Moisture barrier bag sealing . 17
5.3.5 Dry pack precautions . 17
5.3.6 Shelf life . 17
6 Drying. 17
6.1 Drying options . 17
6.2 Post exposure to factory ambient . 22
6.2.1 Floor life clock . 22
6.2.2 Any duration exposure . 22
6.2.3 Short duration exposure . 22
6.3 General considerations for baking . 22
6.3.1 High-temperature carriers . 22
6.3.2 Low-temperature carriers . 22
6.3.3 Paper and plastic container items . 23
6.3.4 Bakeout times . 23
6.3.5 ESD protection . 23
6.3.6 Reuse of carriers . 23
6.3.7 Solderability limitations . 23
7 Use . 23
7.1 Floor life clock start . 23
7.2 Incoming bag inspection . 23

7.2.1 Upon receipt . 23
7.2.2 Component inspection . 24
7.3 Floor life . 24
7.4 Safe storage . 24
7.4.1 Safe storage categories . 24
7.4.2 Dry pack . 24
7.4.3 Shelf life . 24
7.4.4 Dry atmosphere cabinet . 25
7.5 Reflow . 25
7.5.1 Reflow categories . 25
7.5.2 Opened MBB . 25
7.5.3 Reflow temperature extremes . 25
7.5.4 Additional thermal profile parameters. 25
7.5.5 Multiple reflow passes . 26
7.5.6 Maximum reflow passes . 26
7.6 Drying indicators . 26
7.6.1 Drying requirements . 26
7.6.2 Excess humidity in the dry pack . 26
7.6.3 Floor life or ambient temperature/humidity exceeded . 27
7.6.4 Level B6 SMDs . 27
Annex A (normative) Symbol and labels for moisture-sensitive devices . 28
A.1 Object . 28
A.2 Symbol and labels. 28
A.2.1 "Moisture-sensitive" symbol . 28
A.2.2 Moisture-sensitive identification (MSID) label . 28
A.2.3 Moisture-sensitive caution labels . 28
Annex B (informative) Board rework . 32
B.1 Component removal, rework and remount . 32
B.1.1 Removal precautions . 32
B.1.2 Removal for failure analysis . 32
B.1.3 Removal and remount . 32
B.2 Baking of populated boards. 32
Annex C (normative) Test method for humidity indicator cards used with electronic
component packaging . 33
C.1 HIC testing method . 33
C.2 Testing apparatus . 33
C.3 Testing procedure . 33
C.4 Data analysis . 34
Annex D (informative) Derivation of bake tables . 35
Annex E (informative) Derating due to factory environmental conditions . 37
Bibliography . 41

Figure 1 – Typical dry pack configuration for moisture-sensitive SMDs
in shipping tubes . 13
Figure 2 – Example humidity indicator cards . 16
Figure A.1 – Moisture-sensitive symbol (example) . 28
Figure A.2 – MSID label (example) . 28
Figure A.3 – Information label for level A1 or B1 (example) . 29

– 4 – IEC 60749-20-1:2019 RLV © IEC:2019
Figure A.4 – Moisture-sensitive caution label for level A2 (example) . 29
Figu
...

IEC 60749-20-1 ®
Edition 2.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 20-1: Handling, packing, labelling and shipping of surface-mount devices
sensitive to the combined effect of moisture and soldering heat

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –
Partie 20-1: Manipulation, emballage, étiquetage et transport des composants
pour montage en surface sensibles à l'effet combiné de l'humidité et de la
chaleur de brasage
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
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once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

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IEC 60749-20-1 ®
Edition 2.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 20-1: Handling, packing, labelling and shipping of surface-mount devices

sensitive to the combined effect of moisture and soldering heat

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –

Partie 20-1: Manipulation, emballage, étiquetage et transport des composants

pour montage en surface sensibles à l'effet combiné de l'humidité et de la

chaleur de brasage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-7043-1

– 2 – IEC 60749-20-1:2019 © IEC:2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 General applicability and reliability considerations . 10
4.1 Assembly processes . 10
4.1.1 Mass reflow . 10
4.1.2 Localized heating. 10
4.1.3 Socketed components . 10
4.1.4 Point-to-point soldering . 10
4.1.5 Aqueous cleaning . 11
4.2 Reliability . 11
5 Dry packing . 11
5.1 Requirements . 11
5.2 Drying of SMDs and carrier materials before being sealed in MBBs . 11
5.2.1 Drying requirements – level A2 . 11
5.2.2 Drying requirements – levels B2a to B5a . 12
5.2.3 Drying requirements – carrier materials . 12
5.2.4 Drying requirements – other . 12
5.2.5 Excess time between bake and bag . 12
5.3 Dry pack . 12
5.3.1 Description . 12
5.3.2 Materials . 13
5.3.3 Labels . 16
5.3.4 Moisture barrier bag sealing . 16
5.3.5 Dry pack precautions . 16
5.3.6 Shelf life . 16
6 Drying. 17
6.1 Drying options . 17
6.2 Post exposure to factory ambient . 20
6.2.1 Floor life clock . 20
6.2.2 Any duration exposure . 20
6.2.3 Short duration exposure . 20
6.3 General considerations for baking . 20
6.3.1 High-temperature carriers . 20
6.3.2 Low-temperature carriers . 20
6.3.3 Paper and plastic container items . 21
6.3.4 Bakeout times . 21
6.3.5 ESD protection . 21
6.3.6 Reuse of carriers . 21
6.3.7 Solderability limitations . 21
7 Use . 21
7.1 Floor life clock start . 21
7.2 Incoming bag inspection . 21

7.2.1 Upon receipt . 21
7.2.2 Component inspection . 22
7.3 Floor life . 22
7.4 Safe storage . 22
7.4.1 Safe storage categories . 22
7.4.2 Dry pack . 22
7.4.3 Shelf life . 22
7.4.4 Dry atmosphere cabinet . 22
7.5 Reflow . 23
7.5.1 Reflow categories . 23
7.5.2 Opened MBB . 23
7.5.3 Reflow temperature extremes . 23
7.5.4 Additional thermal profile parameters. 23
7.5.5 Multiple reflow passes . 23
7.5.6 Maximum reflow passes . 24
7.6 Drying indicators . 24
7.6.1 Drying requirements . 24
7.6.2 Excess humidity in the dry pack . 24
7.6.3 Floor life or ambient temperature/humidity exceeded . 25
7.6.4 Level B6 SMDs . 25
Annex A (normative) Symbol and labels for moisture-sensitive devices . 26
A.1 Object . 26
A.2 Symbol and labels.
...