IEC 60749-22:2002/COR1:2003
(Corrigendum)Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés
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Standards Content (Sample)
CEI 60749-22 IEC 60749-22
(Première édition – 2002) (First edition – 2002)
DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –
ET CLIMATIQUES –
Part 22: Bond strength
Partie 22: Robustesse des contacts soudés
CORRIGENDUM 1
Page 6 Page 7
Au lieu de: Instead of:
Le comité a décidé que le contenu de The committee has decided
...
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