IEC TR 61967-4-1:2005

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4

Serves as an application guidance and relates to IEC 61967-4. The division of IC types into -> IC function modules and the software modules for -> cores with CPU can be used for Parts 3, 5 and 6 of IEC 61967. Gives advice for performing test methods described in IEC 61967-4 by classifying types of integrated circuits (ICs) and providing hints for test applications related to the IC type classification. To obtain comparable results of IC emission measurements using IEC 61967-4, definitions are given which are in addition to the general conditions specified in IEC 61967-1 and IEC 61967-4. These definitions concern IC related operating modes, pins and ports to be tested, test set-ups according IEC 61967-4, including description of load circuits and RF path, and IC related emission limits (or limit classes). Parts of the guidance provided by this technical report may be applicable to other parts of IEC 61967.

General Information

• Status: Published
• Publication Date: 06-Feb-2005
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 9 - TC 47/SC 47A/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 15-Feb-2005
• Completion Date: 07-Feb-2005

Standards Content (Sample)

TECHNICAL IEC
REPORT TR 61967-4-1
First edition
2005-02
Integrated circuits –
Measurement of electromagnetic
emissions, 150 kHz to 1 GHz –
Part 4-1:
Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4
Reference number
IEC/TR 61967-4-1:2005(E)
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TECHNICAL IEC
REPORT TR 61967-4-1
First edition
2005-02
Integrated circuits –
Measurement of electromagnetic
emissions, 150 kHz to 1 GHz –
Part 4-1:
Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
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International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – TR 61967-4-1  IEC:2005(E)
CONTENTS
FOREWORD.4

1 Scope .6
2 Normative references .6
3 Terms and definitions .7
4 Splitting ICs into IC function modules.9
4.1 Background .9
4.2 Benefits.9
4.3 IC function modules.9
4.4 Example matrix for splitting ICs into IC function modules .14
5 Workflow to perform IC EMC emission tests .15
5.1 Emission test philosophy .15
5.2 Flowchart of performing emission tests .15
6 Test configurations for IC function modules.16
6.1 EMC test recommendations for IC function modules .16
6.2 Port selection guide .16
6.3 Test networks at selected ports.18
6.4 Supply selection guide.22
6.5 Test networks at selected supplies.23
6.6 Parameter initialization of IC function modules for testing .24
6.7 Test parameter for performing conducted emission measurements .30
7 Test board layout recommendations.36
7.1 Common test board recommendations .36
7.2 150 Ω network on 2 layer and multi layer PCB.36
7.3 1 Ω network on 2 layer and multi-layer PCB .37
8 Test report .37

Annex A (normative) IEC 61967-4 test network modification .38
Annex B (informative) Trace impedance calculation .40
Annex C (informative) Examples for splitting ICs into IC function modules.42

Figure 1 – Common definition of an IC function module .8
Figure 2 – Flowchart of performing emission tests .15
Figure 3 – Test network for IC function module line driver.18
Figure 4 – Symmetrical line driver without termination (not required by bus system
datasheet) .18
Figure 5 – Symmetrical line driver with termination required by bus system datasheet.19
Figure 6 – Test network for IC function module line driver.19
Figure 7 – Test network for IC function module high side driver .20
Figure 8 – Test network for IC function module low side driver.21
Figure 9 – Conducted emission measurement circuits for IC function module supply .23
Figure 10 – Layout recommendation 150 Ω network .36
Figure 11 – Layout recommendation 1 Ω network .37

TR 61967-4-1  IEC:2005(E) – 3 –
Figure A.1 – 150 Ω network, attenuation chart of some example capacitor values .38
Figure B.1 – Micro stripline .40
Figure B.2 – Symmetric stripline.41
Figure B.3 – Offset stripline .41

TTable 1 – Example matrix for splitting ICs into IC function modules T .14
TTable 2 – EMC test recommendations for IC function modules T.16
TTable 3 – Test port selection table T .17
TTable 4 – Creating priority for a subset of supply modules T.23
TTable 5 – Driver toggling definition T.24
TTable 6 – Test initialization software module for cores containing a CPU T .27
TTable 7 –Test loop software module for cores containing a CPU T.29
TTable 8 – Test procedure driver switching noise, with CPU T.30
TTable 9 – Test procedure driver switching noise, without CPU T.30
TTable 10 – Test procedure port internal crosstalk, with CPU T.31
TTable 11 – Test procedure regional signal driver supply noise, with CPU T.31
TTable 12 – Test procedure regional signal driver supply noise, without CPU T .31
TTable 13 – Test procedure symmetrical line drivers, with CPU T.32
TTable 14 – Test procedure symmetrical line drivers, without CPU T .32
TTable 15 –Test procedure high side drivers (without CPU) T.32
TTable 16 – Test procedure low side drivers (without CPU) T.33
TTable 17 – Test procedure core supply, without CPU T .33
TTable 18 – Test procedure core to drivers and inputs crosstalk, without CPU T.34
TTable 19 – Test procedure core supply, core with CPU T.34
TTable 20 – Test procedure core to drivers and inputs crosstalk, core with CPU, single
driver or input port T.35
TTable 21 – Test procedure core to drivers and inputs crosstalk, with CPU, multiple
driver or input port T.35
TTable 22 – Test procedure oscillator supply noise, with CPU T .36
TTable 23 – Test procedure oscillator supply noise, without CPU T .36
TTable A.1 – Limit frequencies of modified DC block capacitor values in 150 Ω network T .39

– 4 – TR 61967-4-1  IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 4-1: Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4

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