IEC 60749-40:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.

Dispositifs à semiconducteurs - Méthodes d'essais climatiques et mécaniques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte

La CEI 60749-40:2011 est destinée à évaluer et comparer la performance de chute d'un dispositif à semiconducteurs pour montage en surface dans des applications de produits électroniques portatifs dans un environnement d'essai accéléré, où une flexion excessive d'une carte à circuit imprimé provoque une défaillance du produit. Le but est de normaliser la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des dispositifs à semiconducteurs pour montage en surface, en reproduisant les mêmes modes de défaillance que ceux observés normalement au cours d'un essai au niveau du produit. La présente norme internationale utilise une jauge de contrainte pour mesurer la contrainte et le taux de contrainte d'une carte au voisinage d'un composant.

General Information

• Status: Published
• Publication Date: 12-Jul-2011
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 15-Aug-2011
• Completion Date: 13-Jul-2011

Standards Content (Sample)

IEC 60749-40 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 40: Board level drop test method using a strain gauge

Dispositifs à semiconducteurs – Méthodes d'essais climatiques et mécaniques –
Partie 40: Méthode d’essai de chute au niveau de la carte avec utilisation d’une
jauge de contrainte
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IEC 60749-40 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 40: Board level drop test method using a strain gauge

Dispositifs à semiconducteurs – Méthodes d'essais climatiques et mécaniques –
Partie 40: Méthode d’essai de chute au niveau de la carte avec utilisation d’une
jauge de contrainte
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX S
ICS 31.080.01 ISBN 978-2-88912-583-8

– 2– 60749-40  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test equipment . 6
5 Test procedure . 6
5.1 Test specimen . 6
5.2 Test substrate . 6
5.3 Solder paste . 6
5.4 Mounting method . 7
5.5 Pre-conditionings . 7
5.6 Initial measurements . 7
5.7 Intermediate measurement . 7
5.8 Final measurement . 7
6 Test method . 7
6.1 Purpose of test method . 7
6.2 Example of drop test equipment . 7
6.3 Example of substrate-securing jig . 8
6.4 Example of distance between supporting points . 8
6.5 Example of impacting surface . 8
6.6 Strain gauge . 8
6.7 Strain gauge attachment . 8
6.8 Strain measurement instrument . 9
6.9 Test condition . 10
6.9.1 Drop test conditions . 10
6.9.2 Test procedure . 10
6.9.3 Drop height. 11
6.9.4 Pre-test characterization . 11
6.9.5 Direction . 13
6.9.6 Number of drops . 13
7 Summary . 13
Annex A (normative) Drop impact test method using test rod . 15
Annex B (informative) An example of strain gauge attachment procedure . 18

Figure 1 – Example of drop test equipment and substrate securing jig . 9
Figure 2 – Position of strain gauge attachment . 10
Figure 3 – Strain measurement instrument . 11
Figure 4 – Waveform of strain and electrical conductivity of daisy chain . 11
Figure 5a – Number of times of drop to failure . 13
Figure 5b – Pulse duration . 13
Figure 5 – Correlation strain and number of failures and strain and pulse duration . 13
Figure 6 – Correlation between pulse duration and distance between supporting points . 13
Figure 7 – Correlation between the number of times of failure and the maximum strain. 14
Figure 8 – Direction of dropping . 14

60749-40  IEC:2011 – 3 –
Figure A.1 – Outline of test apparatus . 16
Figure A.2 – Waveform of strain and electrical conductivity of a daisy chain . 18
Figure B.1 – Equipment and materials . 19
Figure B.2 – Example of Attaching Strain Gauge and Guide Mark Dimensions . 20
Figure B.3 – Strain gauge attachment procedure, part 1 . 21
Figure B.4 – Strain gauge attachment procedure, part 2 . 22

– 4– 60749-40  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 40: Board level drop test method using a strain gauge

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