IEC 60194:1999
(Main)Printed board design, manufacture and assembly - Terms and definitions
Printed board design, manufacture and assembly - Terms and definitions
Defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
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Standards Content (Sample)
INTERNATIONAL IEC
STANDARD
Fourth edition
1999-04
Printed board design, manufacture
and assembly –
Terms and definitions
Conception, fabrication et assemblage
des cartes imprimées –
Termes et définitions
Reference number
Numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series.
Consolidated publications
Consolidated versions of some IEC publications including amendments are
available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the
base publication, the base publication incorporating amendment 1 and the base
publication incorporating amendments 1 and 2.
Validity of this publication
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology.
Information relating to the date of the reconfirmation of the publication is available
in the IEC catalogue.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is to be found at the following IEC sources:
• IEC web site*
•
Catalogue of IEC publications
Published yearly with regular updates
(On-line catalogue)*
• IEC Bulletin
Available both at the IEC web site* and as a printed periodical
Terminology, graphical and letter symbols
For general terminology, readers are referred to IEC 60050: International
Electrotechnical Vocabulary (IEV).
For graphical symbols, and letter symbols and signs approved by the IEC for
general use, readers are referred to publications IEC 60027: Letter symbols to be
used in electrical technology, IEC 60417: Graphical symbols for use on equipment.
Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols
for diagrams.
* See web site address on title page.
INTERNATIONAL IEC
STANDARD
Fourth edition
1999-04
Printed board design, manufacture
and assembly –
Terms and definitions
Conception, fabrication et assemblage
des cartes imprimées –
Termes et définitions
IEC 1999 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
XE
International Electrotechnical Commission
For price, see current catalogue
– 2 – 60194 © IEC:1999(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60194 has been prepared by IEC technical committee 52: Printed
circuits.
This fourth edition cancels and replaces the third edition published in 1988. This fourth edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
52/801/FDIS 52/806/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Annexes A, B and C are for information only.
A bilingual version of this standard may be issued at a later date.
60194 © IEC:1999(E) – 3 –
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
1 Scope
This International Standard defines the terminology used in the field of printed circuit boards
and printed circuit board assembly products.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this International Standard. For dated references, subsequent
amendments to, or revisions of, any of these publications do not apply. However, parties to
agreements based on this International Standard are encouraged to investigate the possibility
of applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of IEC
and ISO maintain registers of currently valid International Standards.
IEC 60050(541), International Electrotechnical Vocabulary (IEV) – Chapter 541: Printed circuits
3 General
The terms have been classified according to the decimal classification code (DCC) and this
DCC number appears to the right of the defined term. The DCC numbering is explained fully
in annex A.
In order to avoid two ID numbers the usual practice of numbering every paragraph (every term
and definition) in front of the paragraph has not been followed in this standard. The official
IEC number is the number which follows the DCC and the period (21.xxxx). Annex B includes
an index of terms listed numerically according to the DCC number. Annex C includes an index
of terms listed alphabetically.
4 Terms and definitions
– 4 – 60194 © IEC:1999(E)
Acid-core solder 46.0008
Abrasive trimming 54.1318
Adjusting the value of a film component by Wire solder with a self-contained acid flux.
notching it with a finely-adjusted stream of an
Acid flux 46.0009
abrasive material against the resistor surface.
An aqueous solution of an acid and an
Absorption coefficients 40.1727
inorganic, organic, or water-soluble flux. (See
The degree to which various materials absorb also "Inorganic flux", "Organic flux", and
heat or radiant energy when compared to each "Water-soluble flux".)
other.
Acid number 54.0010
Accelerated ageing 93.0001
The amount of potassium hydroxide in
The means whereby the deterioration milligrams that is required to neutralize one
encountered in natural ageing is artificially gram of a substance.
reproduced and hastened.
Acid value 54.1217
Accelerator 53.0002
See "Acid number".
See "Catalyst".
Actinic radiation 52.0011
Acceptance quality level (AQL) 90.0003
Light energy that reacts with a photosensitive
The maximum number of defectives likely to material in order to produce an image.
exist within a population (lot) that can be
Activated rosin flux 46.0012
considered to be contractually tolerable;
normally associated with statistically derived A mixture of rosin and small amounts of
sampling plans.
organic-halide or organic-acid activators. (See
also "Synthetic activated flux".)
Acceptance tests 92.0004
Activating 53.0013
Those tests deemed necessary to determine
the acceptability of a product and as agreed to
A treatment that renders non-conductive
by both purchaser and vendor. material receptive to electroless deposition.
Access hole 60.1319
Activating layer 53.0014
A series of holes in successive layers of a A layer of material that renders a non-
multilayer board, each set having their centres
conductive material receptive to electroless
on the same axis. These holes provide access deposition.
to the surface of the land on one of the layers
Activator 46.0015
of the board.
A substance that improves the ability of a flux
to remove surface oxides from the surfaces
being joined.
Active device 30.0016
An electronic component whose basic
character changes while operating on an
applied signal. (This includes diodes,
Figure A-1: Access Hole
transistors, thyristors and integrated circuits
that are used for the rectification, amplification,
Access holes 22.1619
switching, etc. of analog or digital circuits in
A series of holes in successive layers, each set
either monolithic or hybrid form.)
having their centres on the same axis.
Active metal 36.0017
Access protocol 21.0005
A metal that is very high in electromotive force.
A method for establishing how nodes in a
Active trimming 54.1321
network communicate.
Adjusting the value of a film circuit element in
Accordion contact 36.0006
order to obtain a specified functional output
A type of connector contact that consists of a
from the circuit while it is electrically activated.
flat spring formed into a "Z" shape in order to
(See also "Functional trimming".)
permit high deflection without overstress.
Actual size 90.0018
Accuracy 90.0007
The measured size.
The deviation of the measured or observed
value from the accepted reference.
60194 © IEC:1999(E) – 5 –
Additive process 53.1322 Air pollution 14.0027
A process for obtaining conductive patterns by Contamination of the atmosphere with
the selective deposition of conductive material substances that are toxic or otherwise harmful.
on clad or unclad base material. (See also
Algorithm 11.0849
"Semi-additive process" and "Fully-additive
process".) [IEV 541-04-03, modified] A set of procedures for the solution of a problem
in a series of steps.
Add-on component 30.0019
Alignment mark 22.0030
Discrete or integrated packaged or chip
components that are attached to a film circuit in
A stylized pattern that is selectively positioned
order to complete the circuit's function. on a base material to assist in alignment.
Adhesion failure 96.0020
Aliphatic solvents 76.0031
The rupture of an adhesive bond such that the "Straight chain" solvents, derived from
separation appears to be at the adhesive- petroleum, of low solvent power.
adherend interface.
Alkaline cleaner 76.0032
Adhesion layer 74.0021
A material blended from alkali hydroxides and
The metal layer that adheres a barrier metal to alkaline salts.
a metal land on the surface of an integrated
Alpha error 91.0033
circuit.
The size of a Type I error or the probability of
Adhesion promotion 53.0022
rejecting a hypothesis that is true.
The chemical process of preparing a surface to
Alphanumerical 25.1729
enhance its ability to be bonded to another
surface or to accept an over-plate.
Pertaining to data that contain the letters of an
alphabet, the decimal digits, and may contain
Adhesive 46.1728
control characters, special characters and the
A substance such as glue or cement used to space character.
fasten objects together. In surface mounting, an
Alternating current (a.c.) 21.1793
epoxy adhesive is used to adhere SMD's to the
substrate.
A current that varies with time, commonly
applied to a power source that switches polarity
Adhesive-coated catalyzed
many times per second, in the shape of a
laminate 41.1320
sinusoidal, square, or triangular wave.
A base material with a thin polymer coating, that
Alternative hypothesis 93.1324
contains a plating catalyst, that is subsequently
treated in order to obtain a microporous surface.
The supposition that a significant difference
exists between the desired results of two
Adhesive-coated uncatalyzed
comparable populations. (See also "Null
laminate 41.1323
hypothesis" and "Statistical hypothesis".)
A base material with a thin polymer coating, that
Alumina substrate 43.1730
does not contain a plating catalyst, that is
subsequently treated in order to obtain a
Aluminum oxide used as a ceramic substrate
microporous surface.
material.
Adsorbed contaminant 96.0023
Ambient 29.0034
A contaminant attracted to the surface of a
The surrounding environment coming into
material that is held captive in the form of a gas,
contact with the system or component in
vapor or condensate.
question.
Advanced statistical method 91.0024
Amorphous polymer 40.0035
A statistical process analysis and control
A polymer with a random and unstructured
technique that is more sophisticated and less
molecular configuration.
widely applicable than basic statistical methods.
Amplitude, voltage 21.0036
Ageing 90.0025
The magnitude of a voltage as measured with
The change of a property, for example
respect to a reference, such as a ground plane.
solderability, with time. (See also "Accelerated
Analog circuit 21.0037
ageing".)
An electrical circuit that provides a continuous
Air contamination 14.0026
relationship between its input and output.
See "Air pollution".
– 6 – 60194 © IEC:1999(E)
Analysis of variance (ANOVA) 91.0038 Area array tape automated bonding 74.0048
The systematic method of statistically Tape automated Bonding where some carrier
evaluating experimental results in order to tape terminations are made to lands within the
separate the sources of variation. perimeter of the die.
Anchoring spur 22.1325 Array 22.0049
An extension of a land on a flexible printed A group of elements or circuits arranged in
board that extends beneath the cover lay
...
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