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SIST EN 61191-3:2001

(Main)

Printed board assemblies -- Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Printed board assemblies -- Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Elektronikaufbauten auf Leiterplatten -- Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage

Ensembles de cartes imprimées -- Partie 3: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants

Décrit les exigences relatives aux ensembles de composants à trous traversants (broches et trous) montés par brasage. Les exigences s'appliquent aux ensembles entièrement constitués d'après une technique de montage par trous traversants (THT) et aux portions THT d'ensembles incluant d'autres techniques associées (par exemple montage en surface, montage à puce, montage à borne).

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

General Information

Status
Withdrawn
Publication Date
28-Feb-2001
Withdrawal Date
18-Oct-2020
ICS
31.180 - Printed circuits and boards
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
16-Oct-2020
Due Date
08-Nov-2020
Completion Date
19-Oct-2020
Ref Project
EN 61191-3:1998 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Relations

Replaced By
SIST EN 61191-3:2018 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Effective Date
05-Sep-2017
Revised
SIST EN 61191-3:2018 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Effective Date
01-Nov-2016

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61191-3:2001
01-marec-2001
Printed board assemblies - Part 3: Sectional specification - Requirements for
through-hole mount soldered assemblies
Printed board assemblies -- Part 3: Sectional specification - Requirements for through-
hole mount soldered assemblies
Elektronikaufbauten auf Leiterplatten -- Teil 3: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Durchsteckmontage
Ensembles de cartes imprimées -- Partie 3: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage de trous traversants
Ta slovenski standard je istoveten z: EN 61191-3:1998
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61191-3:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61191-3:2001

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SIST EN 61191-3:2001

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SIST EN 61191-3:2001

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SIST EN 61191-3:2001

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SIST EN 61191-3:2001

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SIST EN
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