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EN 61191-3:1998

(Main)

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage

Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants

Décrit les exigences relatives aux ensembles de composants à trous traversants (broches et trous) montés par brasage. Les exigences s'appliquent aux ensembles entièrement constitués d'après une technique de montage par trous traversants (THT) et aux portions THT d'ensembles incluant d'autres techniques associées (par exemple montage en surface, montage à puce, montage à borne).

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

General Information

Status
Withdrawn
Publication Date
27-Oct-1998
Withdrawal Date
30-Jun-2001
ICS
31.240 - Mechanical structures for electronic equipment
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
04-Jul-2020
Completion Date
04-Jul-2020
Ref Project
SIST EN 61191-3:2001 - Printed board assemblies -- Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Relations

Replaced By
EN 61191-3:2017 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Effective Date
05-Sep-2017

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Standards Content (Sample)


SLOVENSKI STANDARD
01-marec-2001
Printed board assemblies - Part 3: Sectional specification - Requirements for
through-hole mount soldered assemblies
Printed board assemblies -- Part 3: Sectional specification - Requirements for through-
hole mount soldered assemblies
Elektronikaufbauten auf Leiterplatten -- Teil 3: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Durchsteckmontage
Ensembles de cartes imprimées -- Partie 3: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage de trous traversants
Ta slovenski standard je istoveten z: EN 61191-3:1998
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

SIST EN
...

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