Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011)

This part of IEC 60352 is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques.
Information on materials and data from industrial experience are included in addition to the test
procedures to provide electrically stable connections under prescribed environmental conditions.
The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.

Lötfreie Verbindungen - Teil 8: Druckmontage-Verbindungen - Allgemeine Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 60352-8:2011)

Connexions sans soudure - Partie 8: Connexions par compression - Exigences générales, méthodes d'essai et guide pratique (CEI 60352-8:2011)

La CEI 60352-8:2011 est applicable aux connexions par compression comportant des contacts à ressort métalliques, utilisées dans les équipements de télécommunication et autres systèmes électroniques employant des techniques similaires. Des informations sur les matériaux et des résultats en retour d'expérience industrielle sont inclus en plus des méthodes d'essais, pour assurer des connexions électriquement stables dans les conditions d'environnement prescrites. La présente norme a pour objet de déterminer la bonne adaptation des connexions par compression dans des conditions électriques, mécaniques et atmosphériques spécifiées et de fournir un moyen de comparaison des résultats d'essai lorsque les outils utilisés pour réaliser les connexions sont de conception ou de fabrication différente.

Nespajkani spoji - 8. del: Spoji s stiskanjem - Splošne zahteve, preskusne metode in praktični napotki (IEC 60352-8:2011)

Ta del IEC 60352 velja za spoje s stiskanjem s kovinskimi vzmetnimi stiki za uporabo v telekomunikacijski opremi in v drugih elektronskih napravah, ki uporabljajo podobne tehnike.
Poleg preskusnih postopkov so vključene informacije o materialih in podatki iz industrijskih izkušenj za zagotovitev električno stabilnih spojev pod predpisanimi okoljskimi pogoji.
Namen tega dela IEC 60352 je določiti primernost spojev s stiskanjem pod določenimi električnimi, mehanskimi in atmosferskimi pogoji in zagotoviti sredstvo za primerjavo preskusnih rezultatov, kadar so orodja za izdelavo spojev različne zasnove in izdelave.

General Information

Status
Published
Publication Date
11-Apr-2011
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
30-Mar-2011
Due Date
04-Jun-2011
Completion Date
12-Apr-2011

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SLOVENSKI STANDARD
SIST EN 60352-8:2011
01-maj-2011

1HVSDMNDQLVSRMLGHO6SRMLVVWLVNDQMHP6SORãQH]DKWHYHSUHVNXVQHPHWRGH

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Solderless connections - Part 8: Compression mount connections - General
requirements, test methods and practical guidance (IEC 60352-8:2011)
Lötfreie Verbindungen - Teil 8: Druckmontage-Verbindungen - Allgemeine
Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 60352-8:2011)
Connexions sans soudure - Partie 8: Connexions par compression - Exigences
générales, méthodes d'essai et guide pratique (CEI 60352-8:2011)
Ta slovenski standard je istoveten z: EN 60352-8:2011
ICS:
29.120.20 Spojni elementi Connecting devices
SIST EN 60352-8:2011 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60352-8:2011
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SIST EN 60352-8:2011
EUROPEAN STANDARD
EN 60352-8
NORME EUROPÉENNE
March 2011
EUROPÄISCHE NORM
ICS 13.220.10
English version
Solderless connections -
Part 8: Compression mount connections -
General requirements, test methods and practical guidance
(IEC 60352-8:2011)
Connexions sans soudure - Lötfreie Verbindungen -
Partie 8: Connexions par compression - Teil 8: Druckmontage-Verbindungen -
Exigences générales, méthodes d'essai et Allgemeine Anforderungen, Prüfverfahren
guide pratique und Anwendungshinweise
(CEI 60352-8:2011) (IEC 60352-8:2011)

This European Standard was approved by CENELEC on 2011-03-17. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,

Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60352-8:2011 E
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SIST EN 60352-8:2011
EN 60352-8:2011 - 2 -
Foreword

The text of document 48B/2223/FDIS, future edition 1 of IEC 60352-8, prepared by SC 48B, Connectors,

of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was

submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60352-8 on

2011-03-17.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent

rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-12-17
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-03-17
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60352-8:2011 was approved by CENELEC as a European

Standard without any modification.
__________
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SIST EN 60352-8:2011
- 3 - EN 60352-8:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60050-581 2008 International Electrotechnical Vocabulary - - -
Part 581: Electromechanical components
for electronic equipment
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
+ A1 1992 Part 1: General and guidance
IEC 60512 Series Connectors for electronic equipment - EN 60512 Series
Tests and measurements
IEC 60512-1 - Connectors for electronic equipment - EN 60512-1 -
Tests and measurements -
Part 1: General
IEC 60512-1-100 - Connectors for electronic equipment - EN 60512-1-100 -
Tests and measurements -
Part 1-100: General - Applicable publications
IEC 61249-2-7 2002 Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
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SIST EN 60352-8:2011
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SIST EN 60352-8:2011
IEC 60352-8
Edition 1.0 2011-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Solderless connections –
Part 8: Compression mount connections – General requirements, test methods
and practical guidance
Connexions sans soudure –
Partie 8: Connexions par compression – Exigences générales, méthodes d’essai
et guide pratique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX S
ICS 13.220.10 ISBN 978-2-88912-363-6
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN 60352-8:2011
– 2 – 60352-8  IEC:2011
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope and object .............................................................................................................. 7

2 Normative references ....................................................................................................... 7

3 Terms and definitions ....................................................................................................... 7

4 Requirements ................................................................................................................... 8

4.1 General ................................................................................................................... 8

4.2 Mounting tools ......................................................................................................... 8

4.3 Compression mount contact .................................................................................... 8

4.3.1 Materials ..................................................................................................... 8

4.3.2 Design features ........................................................................................... 8

4.3.3 Surface finishes ........................................................................................... 8

4.4 Connector body ....................................................................................................... 9

4.4.1 Materials ..................................................................................................... 9

4.4.2 Design features ........................................................................................... 9

4.5 Printed wiring board ................................................................................................ 9

4.5.1 Materials ..................................................................................................... 9

4.5.2 Design features ........................................................................................... 9

4.5.3 Surface finishes ........................................................................................... 9

4.6 Stiffener .................................................................................................................. 9

5 Tests ................................................................................................................................ 9

5.1 General ................................................................................................................... 9

5.1.1 Standard conditions for testing .................................................................... 9

5.1.2 Mounting of the specimen .......................................................................... 10

5.2 Test and measuring methods ................................................................................ 10

5.2.1 General examination.................................................................................. 10

5.2.2 Mechanical tests ........................................................................................ 10

5.2.3 Electrical tests ........................................................................................... 11

5.2.4 Climatic tests ............................................................................................. 12

5.3 Test schedule ........................................................................................................ 13

5.3.1 General ..................................................................................................... 13

5.3.2 Basic test schedule ................................................................................... 14

5.3.3 Full test schedule ...................................................................................... 14

6 Practical guidance .......................................................................................................... 17

6.1 Advantages for compression mount connection ..................................................... 17

6.2 Current-carrying capacity ...................................................................................... 18

6.3 Compression mount contact .................................................................................. 18

6.4 Connector housing and printed wiring board .......................................................... 18

6.4.1 General ..................................................................................................... 18

6.4.2 Connector housing .................................................................................... 18

6.4.3 Printed wiring board .................................................................................. 18

Bibliography .......................................................................................................................... 20

Figure 1 – Wiring arrangement for contact resistance test ..................................................... 12

Figure 2 – An example of compression mount connection within a connector ........................ 17

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SIST EN 60352-8:2011
60352-8  IEC:2011 – 3 –

Table 1 – Vibration, preferred test severities ......................................................................... 11

Table 2 – Group P – basic test .............................................................................................. 14

Table 3 – Group A – corrosion test ....................................................................................... 15

Table 4 – Group B – mechanical test .................................................................................... 15

Table 5 – Group C – climatic test .......................................................................................... 16

Table 6 – Group D – current carrying capacity test ............................................................... 16

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SIST EN 60352-8:2011
– 4 – 60352-8  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SOLDERLESS CONNECTIONS –
Part 8: Compression mount connections –
General requirements, test methods and practical guidance
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in

addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses

arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60352-8 has been prepared by subcommittee 48B: Connectors, of

IEC technical committee 48: Electromechanical components and mechanical structures for

electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48B/2223/FDIS 48B/2229/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts of the IEC 60352 series, published under the general title Solderless

connections, can be found on the IEC website.
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SIST EN 60352-8:2011
60352-8  IEC:2011 – 5 –

The committee has decided that the contents of this publication will remain unchanged until the

stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to

the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

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SIST EN 60352-8:2011
– 6 – 60352-8  IEC:2011
INTRODUCTION

This part of IEC 60352 includes requirements, tests and practical guidance information.

Two test schedules are provided:

A basic test schedule applies to compression mount connections which conform to all of the

requirements given in Clause 4.

A full test schedule applies to compression mount connections which are part of a new

component and have already passed the basic test schedule or to connections of the same kind

which do not fully comply with the requirements of Clause 4.

Requirements given in Clause 4 are derived from experience with successful applications of

such compression mount connections.

IEC Guide 109 advocates the need to minimize the impact of a product on the natural

environment throughout the product life cycle.

It is understood that some of the materials permitted in this standard may have a negative

environmental impact.

As technological advances lead to acceptable alternatives for these materials, they will be

eliminated from the standard.
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SIST EN 60352-8:2011
60352-8  IEC:2011 – 7 –
SOLDERLESS CONNECTIONS –
Part 8: Compression mount connections –
General requirements, test methods and practical guidance
1 Scope and object

This part of IEC 60352 is applicable to compression mount connections with metallic spring

contacts for use in telecommunication equipments and in other electronic devices employing

similar techniques.

Information on materials and data from industrial experience are included in addition to the test

procedures to provide electrically stable connections under prescribed environmental

conditions.

The object of this part of IEC 60352 is to determine the suitability of compression mount

connections under specified electrical, mechanical and atmospheric conditions and to provide a

means of comparing test results when the tools used to make the connectors are of different

designs or manufacture.
2 Normative references

The following referenced documents are indispensable for the application of this document. For

dated references, only the edition cited applies. For undated references, the latest edition of the

referenced document (including any amendments) applies.
IEC 60050(581):2008, International Electrotechnical Vocabulary (IEV) – Part 581:
Electromechanical components for electronic equipment
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992)

IEC 60512 (all parts), Connectors for electric equipment – Tests and measurements

IEC 60512-1, Connectors for electronic equipment – Tests and measurements – Part 1: General

IEC 60512-1-100, Connectors for electric equipment – Tests and measurements – Part 1-100:

General – Applicable publications

IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures –

Part 2-7: Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet

of defined flammability (vertical burning test), copper-clad
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60050(581) and

IEC 60512-1 as well as the following (additional) terms and definitions apply.
3.1
compression mount connection

solderless connection between a compression mount contact and a contact pad which is

established by a continuous compression force
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SIST EN 60352-8:2011
– 8 – 60352-8  IEC:2011
3.2
compression mount contact
conductive element in a compression mount connector which makes contact with its

corresponding contact pad on a printed wiring board to provide an electrical path

3.3
contact pad (land)

conductive element on a printed wiring board which makes contact with its corresponding

compression mount contact of a connector to provide an electrical path

NOTE Usually the contact area on devices such as on semiconductors is called “land”.

3.4
stiffener
component used to provide resistance against warpage of a printed wiring board
3.5
locating pin
guiding element equipped w
...

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