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SIST

SIST EN 61189-3:2001

(Main)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen -- Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

Constitue un recueil de méthodes d'essai représentant les méthodologies et les procédures qui peuvent être appliquées pour essayer les structures d'interconnexion (cartes imprimées) et les ensembles. Il s'étend aux méthodes d'essais relatives à l'environnement et mécaniques.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

General Information

Status
Withdrawn
Publication Date
28-Feb-2001
Withdrawal Date
16-Dec-2010
ICS
31.180 - Printed circuits and boards
31.190 - Electronic component assemblies
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
17-Dec-2010
Due Date
09-Jan-2011
Completion Date
17-Dec-2010
Ref Project
EN 61189-3:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Relations

Replaced By
SIST EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
29-Jan-2023
Amended By
SIST EN 61189-3:2001/A1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
28-Jan-2023
Amended By
SIST EN 61189-3:2001/A1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
07-Jun-2022
Replaced By
SIST EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
01-Jan-2011
Amended By
SIST EN 61189-3:2001/A1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
01-Mar-2001

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-3:2001
01-marec-2001
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies -- Part 3: Test methods for interconnection structures
(printed boards)
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen -- Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:1997
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-3:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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