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SIST

SIST EN 61189-3:2001/A1:2001

(Amendment)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

EN following parallel vote

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen -- Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

General Information

Status
Withdrawn
Publication Date
28-Feb-2001
Withdrawal Date
16-Dec-2010
ICS
31.180 - Printed circuits and boards
31.190 - Electronic component assemblies
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
17-Dec-2010
Due Date
09-Jan-2011
Completion Date
17-Dec-2010
Ref Project
EN 61189-3:1997/A1:1999 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Relations

Amends
SIST EN 61189-3:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
01-Mar-2001
Replaced By
SIST EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
01-Jan-2011
Amends
SIST EN 61189-3:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
28-Jan-2023
Replaced By
SIST EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
28-Jan-2023
Amends
SIST EN 61189-3:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Effective Date
07-Jun-2022

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-3:2001/A1:2001
01-marec-2001
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies - Part 3: Test methods for interconnection structures
(printed boards)
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen -- Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:1997/A1:1999
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-3:2001/A1:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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