SIST EN 62496-2-2:2011

Optical circuit boards - Test and measurement procedures - Part 2-2: Measurements: Dimensions of optical circuit boards (IEC 62496-2-2:2011)

This part of IEC 62496 specifies the measurement procedures for dimensions related to interface information of optical circuit boards (OCB), defined in IEC 62496-4.

Optische Leiterplatten - Prüf- und Messverfahren - Teil 2-2: Messverfahren - Abmessungen optischer Leiterplatten (IEC 62496-2-2:2011)

Cartes à circuits optiques - Partie 2-2: Mesures - Dimensions des cartes à circuits optiques (CEI 62496-2-2:2011)

La CEI 62496-2-2:2011 spécifie les méthodes de mesure pour les dimensions liées aux informations d'interface des cartes à circuits optiques (OCB), définies dans la CEI 62496-4.

Plošče z optičnimi vezji - Preskusni in merilni postopki - 2-2. del: Meritve: Mere plošč z optičnimi vezji (IEC 62496-2-2:2011)

Ta del IEC 62496 določa merilne postopke za mere, povezane z informacijami o vmesnikih za plošče z optičnimi vezji (OCB), opredeljenimi v IEC 62496-4.

General Information

• Status: Published
• Publication Date: 06-Apr-2011
• ICS: 31.180 - Printed circuits and boards
• ICS: 33.180.01 - Fibre optic systems in general
• Technical Committee: iTEL - Communication cables
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 17-Mar-2011
• Due Date: 22-May-2011
• Completion Date: 07-Apr-2011
• Ref Project: EN 62496-2-2:2011 - Optical circuit boards - Part 2-2: Measurements - Dimensions of optical circuit boards

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62496-2-2:2011
01-maj-2011
3ORãþH]RSWLþQLPLYH]ML3UHVNXVQLLQPHULOQLSRVWRSNLGHO0HULWYH0HUH
SORãþ]RSWLþQLPLYH]ML,(&
Optical circuit boards - Test and measurement procedures - Part 2-2: Measurements:
Dimensions of optical circuit boards (IEC 62496-2-2:2011)
Optische Leiterplatten - Prüf- und Messverfahren - Teil 2-2: Messverfahren -
Abmessungen optischer Leiterplatten (IEC 62496-2-2:2011)
Cartes à circuits optiques - Partie 2-2: Mesures - Dimensions des cartes à circuits
optiques (CEI 62496-2-2:2011)
Ta slovenski standard je istoveten z: EN 62496-2-2:2011
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
33.180.01 6LVWHPL]RSWLþQLPLYODNQLQD Fibre optic systems in
VSORãQR general
SIST EN 62496-2-2:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62496-2-2:2011

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SIST EN 62496-2-2:2011

EUROPEAN STANDARD
EN 62496-2-2

NORME EUROPÉENNE
March 2011
EUROPÄISCHE NORM

ICS 33.180.01


English version


Optical circuit boards -
Part 2-2: Measurements -
Dimensions of optical circuit boards
(IEC 62496-2-2:2011)


Cartes à circuits optiques -  Optische Leiterplatten -
Partie 2-2: Mesures - Teil 2-2: Messungen -
Dimensions des cartes à circuits optiques Abmessungen optischer Leiterplatten
(CEI 62496-2-2:2011) (IEC 62496-2-2:2011)




This European Standard was approved by CENELEC on 2011-03-03. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62496-2-2:2011 E

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SIST EN 62496-2-2:2011
EN 62496-2-2:2011 - 2 -
Foreword
The text of document 86/378/FDIS, future edition 1 of IEC 62496-2-2, prepared by IEC TC 86, Fibre
optics, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 62496-2-2 on 2011-03-03.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-12-03
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-03-03
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62496-2-2:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60793-2 NOTE  Harmonized as EN 60793-2.
IEC 62496 series NOTE  Harmonized in EN 62496 series.
__________

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SIST EN 62496-2-2:2011
- 3 - EN 62496-2-2:2011

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60068-1 - Environmental testing - EN 60068-1 -
Part 1: General and guidance


IEC 60793-1-45 - Optical fibres - EN 60793-1-45 -
(mod) Part 1-45: Measurement methods and test
procedures - Mode field diameter


IEC 61189-2 - Test methods for electrical materials, printed EN 61189-2 -
boards and other interconnection structures
and assemblies -
Part 2: Test methods for materials for
interconnection structures


IEC 62496-2-1 - Optical circuit boards - Basic test and FprEN 62496-2-1 -
measurement procedures -
Part 2-1: Measurements - Optical attenuation
and isolation


IEC 62496-4 - Optical circuit boards - FprEN 62496-4 -
Part 4: Interface standards - General and
guidance


ISO 10360-2 - Geometrical product specifications (GPS) - EN ISO 10360-2 -
Acceptance and reverification tests for
coordinate measuring machines (CMM) -
Part 2: CMMs used for measuring linear
dimensions

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SIST EN 62496-2-2:2011

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SIST EN 62496-2-2:2011

IEC 62496-2-2
®

Edition 1.0 2011-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Optical circuit boards –
Part 2-2: Measurements – Dimensions of optical circuit boards

Cartes à circuits optiques –
Partie 2-2: Mesures – Dimensions des cartes à circuits optiques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX U
ICS 33.180.01 ISBN 978-2-88912-316-2
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62496-2-2:2011
– 2 – 62496-2-2  IEC:2011
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Measurement condition . 7
5 Objects to be measured and their procedures . 7
6 Measurement procedures for dimensions . 7
6.1 Core shape . 7
6.1.1 Measuring equipment . 7
6.1.2 Procedure . 9
6.2 Coordinates of I/O ports . 9
6.2.1 Measurement procedure for end face I/O type OCB . 9
6.2.2 Measurement procedure for surface I/O port type OCB . 11
6.3 Outer shape of optical circuit board . 14
6.3.1 Method 1 (reference) – Use of observation system . 14
6.3.2 Method 2 (alternative) – Use of dimensional drawing . 15
6.4 Misalignment angle of I/O ports . 16
6.4.1 Observation of cross section . 16
6.5 Mirror angle . 19
6.5.1 Method 1 (reference) – Use of observation system . 19
6.5.2 Method 2 (alternative) – Use of confocal microscope . 20
6.6 Hole . 21
6.6.1 Method 1 (reference) – Use of observation system . 21
6.6.2 Method 2 (alternative) – Use of laser scanning . 22
Annex A (informative) Pattern pitch . 24
Bibliography . 27

Figure 1 – Example of measuring equipment capable of observing core shape . 8
Figure 2 – Example of sample set-up for observation of core shape (end face I/O
type OCB or a sliced sample). 8
Figure 3 – Example of sample set-up using a halogen lamp house with light-guide
fibre for observation of core shape (surface I/O type OCB) . 9
Figure 4 – Example of optical position adjustment system for end face I/O type OCB . 10
Figure 5 – Example of optical position adjustment system for surface I/O type OCB . 13
Figure 6 – Example of verification with a dimensional drawing for a fibre flexible
OCB . 16
Figure 7 – Misalignment angle of I/O ports in end face I/O type OCB . 17
Figure 8 – Misalignment angle of I/O ports in surface I/O type OCB . 17
Figure 9 – Parameters for misalignment angle in end face I/O type OCB . 18
Figure 10 – Parameters for misalignment angle in surface I/O type OCB . 18
Figure 11 – Schematic diagram of the mirror angle measurement using a confocal
microscope . 21
Figure 12 – Example of the profile at a mirror portion using a confocal microscope . 21
Figure A.1 – Pattern pitch and objects of measurement (an example of single layer) . 24
Figure A.2 – Pattern pitch and objects of measurement (an example of multi-layer) . 25

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SIST EN 62496-2-2:2011
62496-2-2  IEC:2011 – 3 –

Table 1 – Objects to be measured and their methods . 7

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SIST EN 62496-2-2:2011
– 4 – 62496-2-2  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

OPTICAL CIRCUIT BOARDS –

Part 2-2: Measurements –
Dimensions of optical circuit boards


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to
promote international co-operation on all questions concerning standardization in the electrical and
electronic fields. To this end and in addition to other activities, IEC publishes International Standards,
Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter
referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National
Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation.
IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with
conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has
representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated
in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage
or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62496-2-2 has been prepared by IEC technical committee 86:
Fibre optics.
The text of this standard is based on the following documents:
FDIS Report on voting
86/378/FDIS 86/385/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62496 series, published under the general title Optical circuit
boards, can be found on the IEC website.

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SIST EN 62496-2-2:2011
62496-2-2  IEC:2011 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 62496-2-2:2011
– 6 – 62496-2-2  IEC:2011
OPTICAL CIRCUIT BOARDS –

Part 2-2: Measurements –
Dimensions of optical circuit boards



1 Scope
This part of IEC 62496 specifies the measurement procedures for dimensions related to
interface information of optical circuit boards (OCB), defined in IEC 62496-4.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest
edition of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60793-1-45, Optical fibres – Part 1-45: Measurement methods and test procedures –
Mode field diameter
IEC 61189-2, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 2: Test methods for materials for
interconnection structures
IEC 62496-2-1, Optical circuit boards – Part 2-1: Measurements – Optical attenuation and
1
isolation
IEC 62496-4, Optical circuit boards – Part 4: Interface standards – General and guidance
ISO 10360-2, Geometrical product specifications (GPS) – Acceptance and reverification
tests for coordinate measuring machines (CMM) – Part 2: CMMs used for measuring linear
dimensions
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
optical position adjusting system
consists of a light source, fibre position adjustment stage, OCB holder, input/output fibre
and a power meter. The optimum fibre launch position, at which the optical output power is
maximised, is determined through alignment of the input/output fibres to the OCB and
monitoring the output power from the OCB
3.2
dimensional drawing
illustration, including dashed lines, which defines classified OCB or OCB body shape
accuracy using the origin point or alignment mark as the standard point
___________
1
 To be published.

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SIST EN 62496-2-2:2011
62496-2-2  IEC:2011 – 7 –
4 Measurement condition
All the measurements are made under the conditions specified in IEC 60068-1, unless
otherwise specified. Measurements may be made under different conditions to the standard
conditions if the standard conditions are difficult to achieve, as long as the actual
measurement condition does not give rise to any doubt as to the result of the measurement.
5 Objects to be measured and their procedures
Objects to be measured as dimensions of OCB are stated in IEC 62496-4. The objects and
their methods are summarized in Table 1. This standard specifies mainly mechanical
procedures using observation systems for dimensions of OCBs.
Table 1 – Objects to be measured and their methods
Method 1
Method 2 (alternative)
(reference)
Optical
Observation Dimensional Confocal Laser
position
system drawing microscope scanning
adjustment
Core shape O
Coordinates of I/O
O O
port
Outer shape of
O O
OCB
Misalignment
O
angles of I/O
Mirror O  O
Hole O  O

6 Measurement procedures for dimensions
6.1 Core shape
6.1.1 Measuring equipment
6.1.1.1 General
The measuring equipment consists of observation, shape measuring and data processing
systems. The measurement system shall give reproducible results. An example of a total
measuring system is illustrated in Figure 1. Structural parameters for circlar core shape are
obtained by near field pattern observation of cross section specified in IEC 60793-1-45.
6.1.1.2 Observation system
The observation system detects a core shape by an optical microscope with resolution of
less than 1 % of designated dimension. It is necessary to select appropriate lighting,
magnification, detection system and fibre positioning system to obtain sufficient
measurement accuracy, but x10 to x80 for the object lens and x10 for the eyepiece seem
appropriate. A camera is also used for the observation of large core shape. An example of
sample set-up for the observation is illustrated in Figures 2 and 3. A light is launched in the
vicinity of one of I/O ports. The output light from the sample is detected from the other one
by the observation system. A movable stage or the observation system can have the
measuring function. The movable stage should be controllable in x, y and z axes and
vertical and horizontal rotations, independently.

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SIST EN 62496-2-2:2011
– 8 – 62496-2-2  IEC:2011
6.1.1.3 Data processing system
The data processing system has the capability of analyzing image information taken from
the observation system and calculates structural parameters of core shape.

Observation
Observation
system
system
OCB
OCB
Data processing sytem
Data processing system
Movable stage with scale
Movable stage with scale IEC  001/11


Figure 1 – Example of measuring equipment capable of observing core shape


Observation by microscope

End face tyoe OCB
Light source
or
Sliced OCB
Exposure

Light-guide
(optional)
Movable stage
IEC  002/11

Figure 2 – Example of sample set-up for observation of core shape
(end face I/O type OCB or a sliced sample)

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SIST EN 62496-2-2:2011
62496-2-2  IEC:2011 – 9 –
Electric circuit layer
Observation by
microscope
Light-guide
Output light from OCB
(optional)
Exposure
Light source
Surface I/O
type OCB
Mirror
Mirror
Waveguide layer
Movable stage
IEC  003/11

Figure 3 – Example of sample set-up using a halogen lamp house with light-guide
fibre for observation of core shape (surface I/O type OCB)
6.1.2 Procedure
a) Preparation
When the core shape which is not an I/O port is measured, an OCB is cut with a blade to a
smooth surface at a right angle to the core pattern. The OCB is set-up to observe I/O ports
or a sliced surface, as illustrated in Figures 2 and 3. The magnification of an optical
microscope is calibrated before measurement.
b) Measurement
Adjust the focus of the optical microscope at the position where the core shape can be
observed by moving the movable stage or the optical microscope. The core shape is
determined by processing of image information coming from the observation system. It is
possible to confirm the distance to the object under measurement if the optical microscope
has a distance measuring capability. The six structural parameters for a square core shape
are obtained by data analysis of the core shape according to definitions of their parameters
in IEC 62496-4.
6.2 Coordinates of I/O ports
6.2.1 Measurement procedure for end face I/O type OCB
6.2.1.1 Method 1 (reference) – Use of observation system
6.2.1.1.1 Measuring equipment
The measuring equipment stated in 6.1.1 shall be used.
6.2.1.1.2 Procedure
One example of measurement procedure is described below.
a) Preparation
The sample is fastened to the movable stage using a jig to attain flatness and to prevent it
from moving while measuring.
b) Measurement

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SIST EN 62496-2-2:2011
– 10 – 62496-2-2  IEC:2011
Align the direction of the coordinate axis and that of the movement of the movable stage to
obtain horizontal reference. Move the microscope to the coordinate origin to define its
coordinate to origin point. The origin point should be selected to the centre of the origin
point structure for an external coordinate system, and to the core centre when the origin is
specified by a coordinate of a specific core centre for internal coordinate system. Then
measure the coordinates of the core centres as I/O ports. There are some cases where the
observation of the I/O ports by a microscope is difficult, especially for surface I/O type. A
light is launched to the opposite port of the object of the OCB, and the image of exiting light
is observed.
6.2.1.2 Method 2 (alternative) – Use of optical position adjusting system
6.2.1.2.1 Measuring equipment
An optical position adjusting system consists of a light source, automatic fibre position
adjustment stage, OCB holder, input/output fibre and a power meter. A schematic of the
system illustrated in Figure 4 is a typical example of measurement systems for optical
attenuation of an OCB stated in IEC 62496-2-1.


LiLiLight sght sght sourourourcecc ee
 FiFiFbbibrerere ffofoorrr ou ou outputtputtput
OCB sample
OOCBCB s samamplplee
PPPowowowererer m m metereteete rr
 Fibre for input
FiFibbrere foforr i inputnput
Control
ContrControlol
system
sysyststeemm
OCB holder
OOCBCB hol holderder
Fibre adjusting stage
FiFibbrere adjadjusustiting sng stagetage

IEC  004/11

Figure 4 – Example of optical position adjustment system for end face I/O type OCB
a) Light source
Prepare a light source as stated in IEC 62496-2-1.
b) Fibre position adjustment stage
Fibre position adjustment stage consists of a jig for fixing an input/output fibre near an OCB
and a movable stage. The movable stage should be controllable in x, y and z axes and
vertical and horizontal rotations, independently. The preferred resolutions of the
micromanipulators operated by stepping motors are ≤0.1 µm and ≤1.5 µm for the single
mode and the multimode measurements, respectively. The repeatablilty of measurement is
less than 1 % of designated dimension.

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SIST EN 62496-2-2:2011
62496-2-2  IEC:2011 – 11 –
c) OCB holder
The OCB holder is to fix an OCB and should be provided with a rotation control stage for
alignment of coordinate axes.
d) Input/output fibres
Select appropriate optical fibres for introduction and detection of input into and output from,
respectively, I/O ports, according to IEC 62496-2-1. The input light should be stabilized in
its mode using a mode filter according to IEC 62496-2-1. It is recommended that the core
diameters and numerical aperture (NA) of input/output fibres are similar to those for optical
circuit of interest.
e) Power meter
Prepare a power meter according to IEC 62496-2-1. Measure the power of an optical output
and feed-back to the fibre position adjustment stage in order to obtain the position where
the maximum optical power output is available in a short time.
6.2.1.2.2 Procedure
a) Preparation
Preparation of measurement is as described in 6.2.1.1.
b) Measurement
1) Internal coordinate system
An OCB is placed on the OCB holder and input and output fibres are brought close
to the I/O port which is origin point. A light is launched in one port and detects from
the corresponding port by output fibre. Input fibre is moved in order to search the
position where the output power is the maximum value. Measure the coordinate of
input fibre as an origin point. Then input and output fibres are moved to I/O ports
which are to be measured. The position where the output power is maximum value
is obtained as coordinates in this way for other cores. These positions should be
calculated as the coordinate of I/O ports based on origin point measured in advance.
2) External coordinate system
The input fibre is moved to obtain the coordinate of externally formed origin point by
an observation system. Input and output fibres are brought close to the optical I/O
port of interest. A light is launched in one port and detects from the corresponding
port by output fibre. Input fibre is moved in order to search the position where the
output is the maximum. The position where the output power is maximum value is
obtained in this way for other cores. These positions should be calculated as the
coordinate of I/O ports based on externally formed origin point measured in
advance.
6.2.2 Measurement procedure for surface I/O port type OCB
6.2.2.1 Method 1 (reference) – Use of observation system
6.2.2.1.1 Equipment
Measuring equipment is illustrated in 6.2.1.1.

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SIST EN 62496-2-2:2011
– 12 – 62496-2-2  IEC:2011
6.2.2.1.2 Procedure
a) Preparation
The magnification of the optical microscope to be used is calibrated in advance. The
sample is fastened to the measuring stage using a jig to attain flatness and to prevent it
from moving while measuring.
b) Measurement
Align the direction of the coordinate axis and that of the movement of the movable stage to
obtain horizontal reference. Move the microscope to the coordinate origin to define its
coordinate to origin point. The origin point should be selected to the centre of the origin
point structure for an external coordinate system, and to the core centre when the origin is
specified by a coordinate of a specific I/O port for an internal coordinate system. Measure
the coordinate of each I/O port. There are cases where the direct observation of the plane
by a microscope is difficult. A light may be launched in the port on the other side of the
board and the near field pattern of the exiting light may be observed.
6.2.2.2 Method 2 (alternative) – Use of optical position adjusting system
6.2.2.2.1 Equipment
An optical position adjusting system consists of a light source, automatic fibre position
adjustment stage, OCB holder, input/output fibre and a power meter. A schematic of t
...