31.180 - Printed circuits and boards
Printed circuits and boards
Gedruckte Schaltungen. Leiterplatten
Cartes et circuits imprimes
Tiskana vezja (TIV) in tiskane plošče
General Information
IEC 62899-202-6:2020(E) provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.
- Standard15 pagesEnglish language
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Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.
- Standard23 pagesEnglish and French language
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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
- Standard83 pagesEnglish and French language
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This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.
- Standard29 pagesEnglish language
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IEC 62899-402-2:2020(E) describes the measurement methods of the edge waviness of printed patterns in printed electronics.
This document includes the measurement procedure, as well as the definition of edge waviness and related attributes such as average edge, touch edge and distribution edge of edge waviness, which are quite different from those that appear in the printing of graphic arts or from etching processes.
- Standard13 pagesEnglish language
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This part of IEC 62496 defines the standard interface dimensions for a terminated waveguide
optical circuit board (OCB) assembly (referred to simply as "assembly") using single-row thirtytwo-
channel connectors for polymer waveguides connected with a symmetric PMT connector.
- Standard19 pagesEnglish language
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IEC 60947-4-3:2020(E) applies to semiconductor controllers and semiconductor contactors for non-motor load intended to be connected to circuits, the rated voltage of which does not exceed 1 000 V AC.
It covers their use:
– for operations of changing the state of AC electric circuits between the ON-state and the OFF-state;
– with or without bypass switching devices;
– as controller, for reducing the amplitude of the RMS AC voltage.
This third edition cancels and replaces the second edition p...view more
- Standard88 pagesEnglish language
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- Corrigendum3 pagesEnglish language
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IEC 62020-1:2020 applies to residual current monitors for household and similar purposes, having rated operational voltages and a rated voltage of the monitored circuit not exceeding 440 V AC and rated currents not exceeding 125 A.
This first edition cancels and replaces IEC 62020:1998 and IEC 62020:1998/AMD1:2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
– definition of Type F and Ty...view more
- Standard222 pagesEnglish and French language
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IEC 61189-5-504:2020 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues.
- Standard49 pagesEnglish and French language
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IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
- Technical report115 pagesEnglish language
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This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.
- Standard48 pagesEnglish language
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This standard specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
- Standard43 pagesEnglish language
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IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
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- Standard38 pagesEnglish and French language
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Gives requirements for flexible polyester (PETP) films coated on one side or both with polyester, acrylic or epoxide type adhesive for use in the fabrication of flexible printed wring.[
]Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress.[
]Films coated on both sides are used as bonding films in the fabricati...view more
- Standard91 pagesEnglish and French language
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IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for ...view more
- Standard112 pagesEnglish and French language
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This standard addresses the qualification and procurement of printed circuit boards, which are necessary for all type of space projects.
- Standard269 pagesEnglish language
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This standard addresses the qualification and procurement of printed circuit boards, which are necessary for all type of space projects.
- Standard269 pagesEnglish language
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IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
- Standard43 pagesEnglish language
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IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.
- Technical report23 pagesEnglish language
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