Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009)

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. The standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including - product identity - product data - die mechanical information - test, quality, assembly and reliability information - handling, shipping and storage information It covers the specific requirements for the data that are needed to describe the geometrical properties of die, their physical properties and the means of connection necessary for their use in the development and manufacture of products. It also contains, in the annexes, a vocabulary and list of common acronyms.

Halbleiter-Chip-Erzeugnisse - Teil 1: Beschaffung und Anwendung (IEC 62258-1:2009)

Produits de puces de semiconducteurs - Partie 1: Approvisionnement et utilisation (CEI 62258-1:2009)

La CEI 62258-1:2009 a été élaborée afin de faciliter la production, la fourniture et l'utilisation de produits de puces de semi-conducteurs, y compris:  - lest tranches,  - les puces nues isolées,  - les puces et tranches munies de leurs structures de connexion,  - les puces et tranches à encapsulation minimale ou partielle.  Cette norme définit les exigences minimales applicables aux données nécessaires à la description desdits produits de puces et constitue une aide à la conception et à l'approvisionnement d'ensembles intégrant des produits de puces. Les exigences ainsi couvertes comprennent:  - l'identification du produit,  - les données du produit,  - les informations mécaniques concernant les puces,  - les informations concernant les essais, la qualité, l'assemblage et la fiabilité,  - les informations relatives à la manifulation, à l'expédition et au stockage.  Les principales modifications ayant été introduites dans la présente édition sont destinées à assurer la cohérence entre toutes les parties de la norme. L'ordre des paragraphes, notamment à l'Article 6, a été modifié de manière à être plus logique, et le texte de certaines des exigences, a été amendé de manière à ajouter les exigences relatives aux informations supplémentaires objet de la CEI/TR 62258-4, de la CEI/TR 62258-7 et de la CEI/TR 62258-8. Les nouvelles exigences comprennent les informations sur la permutabilité des bornes et des éléments fonctionnels (6.6.4) et surla sensibilité à l'humidité des dispositifs partiellement encapsulés (8.8).

Izdelki iz polprevodniških čipov - 1. del: Nabava in uporaba (IEC 62258-1:2009)

Ta del IEC 62258 je bil razvit, da olajšuje proizvodnjo, nabavo in uporabo izdelkov iz polprevodniških čipov, vključno s/z – ploščicami, -  individualnimi nepokritimi čipi – čipi in ploščicami s pritrjenimi povezovalnimi strukturami; - minimalno ali delno inkapsuliranimi čipi in ploščicami. Ta standard opredeljuje minimalne zahteve za podatke, ki so potrebni za opis teh izdelkov iz čipov, ter je namenjen v pomoč načrtovanju in naročevanju sklopov, ki vsebujejo izdelke iz čipov. Zajema zahteve za podatke, vključno s/z – prepoznavanje izdelka – podatke o izdelku – informacije o mehanskih lastnosti čipov – informacije o preskušanju, montaži in zanesljivosti – informacije o rokovanju, odpremi in shranjevanju. Zajema posebne zahteve za podatke, ki so potrebni za opis geometričnih lastnosti čipov, njihovih fizičnih lastnosti in načine povezave, ki so potrebni za njihovo uporabo pri razvoju in proizvodnji izdelkov. Prav tako v dodatkih zajema slovar in seznam skupnih akronimov.

General Information

Publication Date
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
Due Date
Completion Date


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Standards Content (Sample)

SIST EN 62258-1:2011
SIST EN 62258-1:2007
Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009)
Halbleiter-Chip-Erzeugnisse - Teil 1: Beschaffung und Anwendung (IEC 62258-1:2009)
Produits de puces de semiconducteurs - Partie 1: Approvisionnement et utilisation (CEI
Ta slovenski standard je istoveten z: EN 62258-1:2010
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 62258-1:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62258-1:2011

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SIST EN 62258-1:2011

EN 62258-1

October 2010

ICS 31.080.99 Supersedes EN 62258-1:2005

English version

Semiconductor die products -
Part 1: Procurement and use
(IEC 62258-1:2009)

Produits de puces de semiconducteurs -  Halbleiter-Chip-Erzeugnisse -
Partie 1: Approvisionnement et utilisation Teil 1: Beschaffung und Anwendung
(CEI 62258-1:2009) (IEC 62258-1:2009)

This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-1:2010 E

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SIST EN 62258-1:2011
EN 62258-1:2010 - 2 -
The text of document 47/1974/CDV, future edition 2 of IEC 62258-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-1 on 2010-10-01.
This European Standard supersedes EN 62258-1:2005.
The main changes that have been introduced in this issue have been to ensure consistency across all
parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be
more logical and the text of some of the requirements has been amended to add requirements on further
information as covered by CLC/TR 62258-4, CLC/TR 62258-7 and CLC/TR 62258-8. New requirements
include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity
for partially encapsulated devices (8.8).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2013-10-01
Annex ZA has been added by CENELEC.
Endorsement notice
The text of the International Standard IEC 62258-1:2009 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068 series NOTE  Harmonized in EN 60068 series (not modified).
IEC 60749-26 NOTE  Harmonized as EN 60749-26.
IEC 60749-27 NOTE  Harmonized as EN 60749-27.
IEC 61340-5-1 NOTE  Harmonized as EN 61340-5-1.
IEC 61340-5-2 NOTE  Harmonized as EN 61340-5-2.
IEC 61340-5-2 NOTE  Harmonized as EN 61340-5-2.
ISO 9000 NOTE  Harmonized as EN ISO 9000.

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SIST EN 62258-1:2011
- 3 - EN 62258-1:2010
Annex ZA
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

Publication Year Title EN/HD Year

IEC 60050 Series International Electrotechnical Vocabulary - -

IEC 60191 Series Mechanical standardization of semiconductor EN 60191 Series

IEC 60191-4 1999 Mechanical standardization of semiconductor EN 60191-4 1999
+ A1 2001 devices - + A1 2002
+ A2 2002 Part 4: Coding system and classification into + A2 2002
forms of package outlines for semiconductor
device packages

IEC 61360-1 - Standard data elements types with EN 61360-1 -
associated classification scheme for electric
items -
Part 1: Definitions - Principles and methods

IEC 62258-2 - Semiconductor die products - EN 62258-2 -
Part 2: Exchange data formats

IEC/TR 62258-3 - Semiconductor die products - CLC/TR 62258-3 -
Part 3: Recommendations for good practice in
handling, packing and storage

IEC/TR 62258-4 - Semiconductor die products - CLC/TR 62258-4 -
Part 4: Questionnaire for die users and

IEC 62258-5 - Semiconductor die products - EN 62258-5 -
Part 5: Requirements for information
concerning electrical simulation

IEC 62258-6 - Semiconductor die products - EN 62258-6 -
Part 6: Requirements for information
concerning thermal simulation

IEC/TR 62258-7 - Semiconductor die products - CLC/TR 62258-7 -
Part 7: XML schema for data exhange

IEC/TR 62258-8 - Semiconductor die products - CLC/TR 62258-8 -
Part 8: EXPRESS model schema for data

ISO 14644-1 1999 Cleanrooms and associated controlled EN ISO 14644-1 1999
environments -
Part 1: Classification of air cleanliness

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SIST EN 62258-1:2011

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SIST EN 62258-1:2011
IEC 62258-1
Edition 2.0 2009-04

Semiconductor die products –
Part 1: Procurement and use

Produits de puces de semiconducteurs –
Partie 1 : Approvisionnement et utilisation

ICS 31.080.99 ISBN 2-8318-1036-7
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62258-1:2011
– 2 – 62258-1 © IEC:2009

1 Scope.8
2 Normative references.8
3 Terms and definitions .9
3.1 Basic definitions .9
3.2 General terminology .10
3.3 Semiconductor manufacturing and interconnection terminology.12
4 General requirements .13
5 Data exchange .13
6 Requirements for all devices .14
6.1 Data package .14
6.1.1 General .14
6.1.2 Information source.14
6.1.3 Data version .14
6.1.4 Data exchange formats .14
6.2 Identity and source .14
6.2.1 General .14
6.2.2 Type number .14
6.2.3 Manufacturer .14
6.2.4 Supplier .14
6.2.5 Signature.14
6.3 Function .14
6.4 Physical characteristics .15
6.4.1 Semiconductor material .15
6.4.2 Technology.15
6.5 Ratings and limiting conditions.15
6.5.1 Power dissipation.15
6.5.2 Operating temperature .15
6.6 Connectivity.15
6.6.1 General .15
6.6.2 Terminal count.15
6.6.3 Terminal information .15
6.6.4 Permutability.16
6.7 Documentation .16
6.8 Form of supply.16
6.8.1 Physical form .16
6.8.2 Packing .16
6.9 Simulation and modelling .16
6.9.1 General .16
6.9.2 Electrical modelling and simulation.16
6.9.3 Thermal data and modelling.16
7 Requirements for bare die and wafers with or without connection structures .17
7.1 General .17
7.2 Identity .17
7.2.1 General .17

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SIST EN 62258-1:2011
62258-1 © IEC:2009 – 3 –
7.2.2 Die name.17
7.2.3 Die version .17
7.3 Materials .17
7.3.1 Substrate material.17
7.3.2 Substrate connection .17
7.3.3 Backside detail .17
7.3.4 Passivation material.17
7.3.5 Metallisation .17
7.3.6 Terminal material.17
7.3.7 Terminal structure.18
7.3.8 Vias.18
7.4 Geometry .18
7.4.1 General .18
7.4.2 Units of measurement.18
7.4.3 Geometric view.18
7.4.4 Die size .18
7.4.5 Die thickness .18
7.4.6 Dimension tolerances .18
7.4.7 Geometric origin .18
7.4.8 Terminal shape and size .18
7.4.9 Die fiducials.19
7.4.10 Die picture .19
7.5 Wafer data .19
7.5.1 General .19
7.5.2 Wafer size .19
7.5.3 Wafer index .19
7.5.4 Wafer die count and step size .19
7.5.5 Wafer reticules .19
8 Minimally-packaged devices.19
8.1 General .19
8.2 Number of terminals .19
8.3 Terminal position .19
8.4 Terminal shape and size.20
8.5 Device size.20
8.6 Seated height .20
8.7 Encapsulation material.20
8.8 Moisture sensitivity .20
8.9 Package style code.20
8.10 Outline drawing.20
9 Quality, test and reliability .21
9.1 General .21
9.2 Outgoing quality level.21
9.2.1 Value.21
9.2.2 Description .21
9.3 Electrical parameters specified .21
9.4 Compliance to standards .21
9.5 Additional device screening .21
9.6 Product status .21
9.7 Testability features .21

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SIST EN 62258-1:2011
– 4 – 62258-1 © IEC:2009

9.8 Additional test requirements.21
9.9 Reliability.22
9.9.1 Reliability estimate.22
9.9.2 Reliability calculation .22
10 Handling and packing .22
10.1 General requirements for all devices.22
10.1.1 General .22
10.1.2 Customer part number .22
10.1.3 Type number .23
10.1.4 Supplier .23
10.1.5 Manufacturer .23
10.1.6 Traceability.23
10.1.7 Quantity.23
10.1.8 ESD sensitivity.23
10.1.9 Requirements for environmental protection .23
10.2 Specific requirement for bare die or wafers – mask version .23
10.3 Specific requirement for wafers – wafer map.23
10.4 Special item requirements .23
10.4.1 General .23
10.4.2 Special protection requirements .24
10.4.3 Unencapsulated die warning label .24
10.4.4 Toxic material warning .24
10.4.5 Fragile components warning .24
10.4.6 ESD sensitivity warning.24
11 Storage .24
11.1 General .24
11.2 Storage duration and conditions.24
11.3 Long-term storage .24
11.4 Storage limitations .24
12 Assembly.25
12.1 General .25
12.2 Attach methods and materials.25
12.3 Bonding method and materials.25
12.4 Attachment limitations.25
12.4.1 General .25
12.4.2 Temperature/time profile.25
12.5 Process limitations .25
Annex A (informative) Terminology.26
Annex B (informative) Acronyms.36
Bibliography .43

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SIST EN 62258-1:2011
62258-1 © IEC:2009 – 5 –


Part 1: Procurement and use

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62258-1 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2005, and constitutes a
technical revision.
The main changes that have been introduced in this issue have been to ensure consistency
across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has
been changed to be more logical and the text of some of the requirements has been amended
to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7
and IEC/TR 62258-8. New requirements include information on permutability of terminals and
functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).

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SIST EN 62258-1:2011
– 6 – 62258-1 © IEC:2009

The text of this standard is based on the following documents:
CDV Report on voting
47/1974/CDV 47/2004/RVC

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62258 series, under the general title Semiconductor die
products, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 62258-1:2011
62258-1 © IEC:2009 – 7 –
This standard is based on the work carried out in the ESPRIT 4 Framework project GOOD-
DIE which resulted in the publication of the ES59008 series of European specifications.
Organisations that helped prepare this document included the European IST ENCASIT project,
The structure of this International Standard as currently conceived is as follows:
Part 1: Procurement and use
Part 2:

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