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IEC/TC 52 - IEC_TC_52

1) To prepare international standards for: a) Metal-clad base materials used in printed circuits. b) Printed circuits (including printed wiring) produced from insulating materials covered with copper or other conducting layers. c) General conditions to be fulfilled by printed components in printed circuits. 2) To give guidance on the compatibility between the components and the printed board

IEC_TC_52

1) To prepare international standards for: a) Metal-clad base materials used in printed circuits. b) Printed circuits (including printed wiring) produced from insulating materials covered with copper or other conducting layers. c) General conditions to be fulfilled by printed components in printed circuits. 2) To give guidance on the compatibility between the components and the printed board

General Information

Status
Stagnation
Sector
V13 - PRINTED CIRCUITS
Parent
IEC - CLC IEC TC
Standardization Organization
ICS
Directive
Mandate
50
CLC
CECC 23 200-801:1998(Main)
Capability Detail Specification: Single and double-sided printed boards with plated-through holes
SIST CECC 23 200-801:2002

Supersedes EN 123200-800:1992 * D97/081: CECC/SC 52 disbanded

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    33 pages
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CLC
CECC 23 300-801:1998(Main)
Capability Detail Specification: Multi-layer printed boards
SIST CECC 23 300-801:2002

Supersedes EN 123300-800:1992 * D97/081: CECC/SC 52 disbanded

  • Standard
    33 pages
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CLC
CECC 23 700-801:1998(Main)
Capability Detail Specification: Flex-rigid double-sided printed boards with through connections
SIST CECC 23 700-801:2002

Flex-rigid double-sided printed boards with through connections made with materials and surface finishes

  • Standard
    18 pages
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CLC
CECC 23 100-801:1998(Main)
Capability Detail Specification: Single and double-sided printed boards with plain holes
SIST CECC 23 100-801:2002

Supersedes EN 123100-800:1992 * D97/081: CECC/SC 52 disbanded

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    26 pages
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CLC
CECC 23 600-801:1998(Main)
Capability Detail Specification: Flex-rigid multilayer printed boards with through connections
SIST CECC 23 600-801:2002

Flex-rigid multilayer printed boards with through connections made with materials and surface finishes

  • Standard
    21 pages
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CLC
CECC 23 800-801:1998(Main)
Capability Detail Specification: Flexible multilayer printed boards with through connections
SIST CECC 23 800-801:2002

Flexible multilayer printed boards with through connections, made with materials and surface finishes

  • Standard
    20 pages
    English language
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CLC
CECC 200 008:1995(Main)
Process Assessment Schedule: GaAs MMIC process approval
SIST CECC 200 008:2002

D97/081: CECC/SC 52 disbanded

  • Standard
    71 pages
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CLC
EN 160101:1998(Main)
Blank Detail Specification: Printed board assembly modular electronic units of assessed quality - Capability approval
SIST EN 160101:2001

Withdrawal confirmed

  • Standard
    20 pages
    English language
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CLC
EN 160200-2:1997(Main)
Sectional specification: Microwave modular electronic units of assessed quality - Part 2: Index of test methods
SIST EN 160200-2:2001

Withdrawal confirmed

  • Standard
    85 pages
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CLC
EN 160201:1997(Main)
Blank Detail Specification: Microwave modular electronic units of assessed quality - Capability Approval
SIST EN 160201:2001

Withdrawal confirmed

  • Standard
    13 pages
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CLC
EN 160200-1:1997(Main)
Sectional Specification: Microwave modular electronic units of assessed quality - Part 1: Capability approval procedure
SIST EN 160200-1:2001

Withdrawal confirmed

  • Standard
    47 pages
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CLC
EN 160100:1997(Main)
Sectional Specification: Capability approval of manufacturers of printed board assemblies of assessed quality
SIST EN 160100:2001

Withdrawal confirmed

  • Standard
    65 pages
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CLC
EN 160000:1993/A1:1995(Amendment)
Generic Specification: Modular electronic units
SIST EN 160000:1997/A1:1997

Withdrawal confirmed

  • Amendment
    2 pages
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CLC
EN 160000:1993(Main)
Generic Specification: Modular electronic units
SIST EN 160000:2001

Withdrawal confirmed

  • Standard
    2 pages
    English language
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    1 day
CLC
EN 123000:1991/A2:1996(Amendment)
Generic Specification: Printed boards
SIST EN 123000:2002/A2:2002

D97/081: CECC/SC 52 disbanded * D138/019: To be withdrawn as should have been superseded by EN 62326-1:1997

  • Amendment
    26 pages
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CLC
EN 123700:1996(Main)
Sectional Specification: Flex-rigid double sided printed board with through connections
SIST EN 123700:2001

This document is a Sectional Specification (SS) relating to flex-rigid double sided printed boards with through Connections irrespective of their method of manufacture, when they are ready for the mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval tesing and for quality conformance inspection (lot-by-lot and periodic inspection).

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    39 pages
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CLC
EN 123800:1996(Main)
Sectional Specification: Flexible multilayer printed boards with through connections
SIST EN 123800:2001

This document is a Sectional Specification (SS) relating to flexible multilayer printed boards with through connectors irrespective of their method of manufacture, when they are ready for the mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval tessting and for quality conformance inspection (lot-by-lot and periodic inspection).

  • Standard
    47 pages
    English language
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    1 day
CLC
EN 123600:1996(Main)
Sectional Specification: Flex-rigid multilayer printed boards with through connections
SIST EN 123600:2001

D97/081: CECC/SC 52 disbanded

  • Standard
    48 pages
    English language
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CLC
EN 123000:1991/A1:1995(Amendment)
Generic Specification: Printed boards
SIST EN 123000:2002/A1:2002

D97/081: CECC/SC 52 disbanded * D138/019: To be withdrawn as should have been superseded by EN 62326-1:1997

  • Amendment
    3 pages
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CLC
EN 123100:1992/A1:1995(Amendment)
Sectional Specification: Single and double-sided printed boards with plain holes
SIST EN 123100:2002/A1:2002

D97/081: CECC/SC 52 disbanded

  • Amendment
    5 pages
    English language
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    1 day
CLC
EN 123400:1992/A2:1995(Amendment)
Sectional Specification: Flexible printed boards without through connections
SIST EN 123400:2001/A2:1997

D97/081: CECC/SC 52 disbanded

  • Amendment
    5 pages
    English language
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CLC
EN 123200:1992/A1:1995(Amendment)
Sectional Specification: Single and double sided printed boards with plated-through holes
SIST EN 123200:2001/A1:1997

D97/081: CECC/SC 52 disbanded

  • Amendment
    5 pages
    English language
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CLC
EN 123300:1992/A1:1995(Amendment)
Sectional Specification: Multilayer printed boards
SIST EN 123300:2001/A1:1997

D97/081: CECC/SC 52 disbanded

  • Amendment
    5 pages
    English language
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CLC
EN 123500:1992/A2:1995(Amendment)
Sectional Specification: Flexible printed boards with through connections
SIST EN 123500:2001/A2:1997

D97/081: CECC/SC 52 disbanded

  • Amendment
    5 pages
    English language
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    1 day
CLC
EN 123500-800:1992(Main)
Capability Detail Specification: Flexible printed boards with through connections
SIST EN 123500-800:2002

Supersedes CECC 23 500-800 Issue 1:1990 * D97/081: CECC/SC 52 disbanded

  • Standard
    11 pages
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CLC
EN 123400-800:1992(Main)
Capability Detail Specification: Flexible printed boards without through connections
SIST EN 123400-800:2002

Supersedes CECC 23 400-800:1990 * D97/081: CECC/SC 52 disbanded

  • Standard
    10 pages
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CLC
EN 123200:1992(Main)
Sectional Specification: Single and double sided printed boards with plated-through holes
SIST EN 123200:2001

Supersedes CECC 23 200:1985 * D97/081: CECC/SC 52 disbanded

  • Standard
    24 pages
    English language
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CLC
EN 123400:1992(Main)
Sectional Specification: Flexible printed boards without through connections
SIST EN 123400:2001

This Cap DS is based on CECC 230400. It relates to flexible printed boards without through connections made with materials and surface finishes as specified in 2.

  • Standard
    88 pages
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CLC
EN 123500:1992(Main)
Sectional Specification: Flexible printed boards with through connections
SIST EN 123500:2001

This document is a Sectional Specification (SS) relating to flexible printed boards with through connections irrespective of their method of manufacture, when they are ready for mounting of the components. it defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).

  • Standard
    26 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 123300:1992(Main)
Sectional Specification: Multilayer printed boards
SIST EN 123300:2001

Supersedes CECC 23 300:1985 (with A1) * D97/081: CECC/SC 52 disbanded

  • Standard
    30 pages
    English language
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    1 day
CLC
EN 123100:1992(Main)
Sectional Specification: Single and double-sided printed boards with plain holes
SIST EN 123100:2002

This document is a Sectional Specification (SS) relating to single and double sided printed boards with plain holes irrespective of their method of manufacture, when they are ready for mounting of the components. it defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).

  • Standard
    19 pages
    English language
    sale 10% off
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    1 day
CLC
EN 123000:1991(Main)
Generic Specification: Printed boards
SIST EN 123000:2002

Supersedes CECC 23 000 Issue 1:1985 * D97/081: CECC/SC 52 disbanded * D138/019: To be withdrawn as superseded by EN 62326-1:1997

  • Standard
    23 pages
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