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CECC 23 800-801:1998

(Main)

Capability Detail Specification: Flexible multilayer printed boards with through connections

Capability Detail Specification: Flexible multilayer printed boards with through connections

Flexible multilayer printed boards with through connections, made with materials and surface finishes

Bauartspezifikation zur Anerkennung der Befähigung: Flexible Mehrlagen-Leiterplatten mit Durchverbindungen

Spécification particulière d'agrément: Cartes imprimées multicouches souples avec connexions transversales

Capability Detail Specification: Flexible multilayer printed boards with through connections

General Information

Status
Published
Publication Date
26-Feb-1998
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 52 - IEC_TC_52
Current Stage
6060 - Document made available - Publishing
Start Date
27-Feb-1998
Completion Date
27-Feb-1998
Ref Project
SIST CECC 23 800-801:2002 - Capability Detail Specification: Flexible multilayer printed boards with through connections
CECC 23 800-801:2002CECC 23 800-801:2002
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Standard
CECC 23 800-801:2002
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Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Capability Detail Specification: Flexible multilayer printed boards with through connectionsBauartspezifikation zur Anerkennung der Befähigung: Flexible Mehrlagen-Leiterplatten mit DurchverbindungenSpécification particulière d'agrément: Cartes imprimées multicouches souples avec connexions transversalesCapability Detail Specification: Flexible multilayer printed boards with through connections31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:CECC 23 800-801:1998SIST CECC 23 800-801:2002en01-maj-2002SIST
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