ASTM F72-06
(Specification)Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)
Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)
ABSTRACT
This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.
SCOPE
1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, ( 3) high-strength wire, and (4) special purpose wire. Note 1Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties or both. This practice is known variously as "modifying," "stabilizing," or "doping." The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, "high-strength" and "special purpose" wire, the identity of modifying additives is not restricted.
1.2 The values stated in SI units shall be regarded as the standard.
1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire. SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.
The following hazard caveat pertains only to the test method portion, Section , of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
WITHDRAWN RATIONALE
This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections.
Formerly under the jurisdiction of Committee F01 on Electronics, this specification was withdrawn in January 2015 in accordance with section 10.6.3 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.
General Information
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Standards Content (Sample)
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F72 −06
StandardSpecification for
1
Gold Wire for Semiconductor Lead Bonding
This standard is issued under the fixed designation F72; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope E16 Method of Free Bend Test for Ductility of Welds
3
(Withdrawn 1978)
1.1 This specification covers round drawn/extruded gold
F205 Test Method for Measuring Diameter of Fine Wire by
wire for internal semiconductor device electrical connections.
Weighing
Four classifications of wire are distinguished, (1) copper-
F219 Test Methods of Testing Fine Round and Flat Wire for
modified wire, (2) beryllium-modified wire, (3) high-strength
Electron Devices and Lamps
wire, and (4) special purpose wire.
F584 Practice for Visual Inspection of Semiconductor Lead-
Bonding Wire
NOTE 1—Trace metallic elements have a significant effect upon the
mechanical properties and thermal stability of high-purity gold wire. It is
customary in manufacturing to add controlled amounts of selected
3. Ordering Information
impurities to gold to modify or stabilize bonding wire properties or both.
3.1 Orders for material under this specification shall include
This practice is known variously as “modifying,” “stabilizing,” or
the following information:
“doping.” The first two wire classifications denoted in this specification
refer to wire made with either of two particular modifiers, copper or
3.1.1 Classification: copper-modified, beryllium-modified,
beryllium, in general use. In the third and fourth wire classifications,
high strength, or special purpose,
“high-strength” and “special purpose” wire, the identity of modifying
3.1.2 Quantity,
additives is not restricted.
3.1.3 Purity (Section 4),
1.2 The values stated in SI units shall be regarded as the
3.1.4 Type, hard, stress relieved, or annealed (Section 5),
standard.
3.1.5 Breaking load and percentage elongation range (Sec-
1.2.1 A mixed system of metric and inch-pound units is in
tion 5),
widespread use for specifying semiconductor lead-bonding
3.1.6 Wire diameter (Section 6),
wire. SI-equivalent values of other commonly used units are
3.1.7 Spool type, length of wire per spool, and type of wind
denoted by parentheses in text and tables.
(Section 11),
3.1.8 Despooling, left-handed unwind or right-handed un-
1.3 The following hazard caveat pertains only to the test
wind (Section 11), and,
method portion, Section 9, of this specification. This standard
3.1.9 Packaging and marking (Section 12).
does not purport to address all of the safety concerns, if any,
associatedwithitsuse.Itistheresponsibilityoftheuserofthis
4. Chemical Composition
standard to establish appropriate safety and health practices
and determine the applicability of regulatory limitations prior
4.1 Beryllium-modified material shall conform to the
to use.
chemical requirements specified in Table 1.
4.2 High-strength material shall conform to the chemical
2. Referenced Documents
requirements specified in Table 2.
2
2.1 ASTM Standards:
4.3 Special purpose material shall be in accordance with
Table 3.
NOTE 2—Copper-modified wire is used on thermocompression wire
1
This specification is under the jurisdiction of ASTM Committee F01 on
bonding machines. Beryllium-modified material is often preferred on
Electronics and is the direct responsibility of Subcommittee F01.07 on Wire
high-speed automated thermocompression or thermosonic bonding equip-
Bonding, Flip Chip, and Tape Automated Bonding.
ment. High-strength wire was developed for use on some very high speed
Current edition approved Jan. 1, 2006. Published March 2006. Originally
automated thermosonic bonders.
approved in 1966. Last previous edition approved in 2001 as F72 – 95 (2001). DOI:
10.1520/F0072-06.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
3
Standards volume information, refer to the standard’s Document Summary page on The last approved version of this historical standard is referenced on
the ASTM website. www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
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F72−06
TABLE 1 Chemical Requirements, Beryllium-Modified Gold TABLE 5 Breaking Load and Elongation of Stress Relieved/
A
Bonding Wire Annealed Wire—Beryllium-Modified Gold
Nominal Breaking Load, Elongation in 254 mm
Element Composition, Weight, %
Diameter, min, (10.0 in.), %
Gold, min 99.99
µm (in.) N(gf) B
Min Max Range
Beryllium 0.0003–0.0010
Other impurities, max each 0.003
13 (0.00050) 0.0
...
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