ASTM B32-08(2014)

Standard Specification for Solder Metal

ABSTRACT
This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solder alloys shall adhere to chemical composition requirements specified for the following flux types: Types R, RMA, and RA, which are composed of Grade WW or WG gum rosin; Type OA, which is composed of water-soluble organic materials; Type OS, which is composed of water-insoluble organic materials; and Type IS, which is composed of inorganic saltsor acids. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection. Other properties to which the alloys should conform to are dimensions and unit weights, spread factor, and resistivity of water extract.
SCOPE
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.  
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).  
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.  
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.  
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 30-Sep-2014
• ICS: 25.160.50 - Brazing and soldering
• ICS: 77.150.60 - Lead, zinc and tin products
• Technical Committee: B02 - Nonferrous Metals and Alloys
• Drafting Committee: B02.02 - Refined Lead, Tin, Antimony, and Their Alloys

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:B32 −08 (Reapproved 2014)
Standard Specification for
Solder Metal
ThisstandardisissuedunderthefixeddesignationB32;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope D269Test Method for Insoluble Matter in Rosin and Rosin
Derivatives
1.1 Thisspecificationcoverssoldermetalalloys(commonly
D464Test Methods for Saponification Number of Naval
known as soft solders) used in non-electronic applications,
Store Products Including Tall Oil and Other Related
including but not limited to, tin-lead, tin-antimony, tin-
Products
antimony-copper-silver,tin-antimony-copper-silver-nickel,tin-
D465Test Methods for Acid Number of Naval Stores
silver, tin-copper-silver, and lead-tin-silver, used for the pur-
Products Including Tall Oil and Other Related Products
pose of joining together two or more metals at temperatures
D509Test Methods of Sampling and Grading Rosin
below their melting points. Electronic grade solder alloys and
E28Test Methods for Softening Point of Resins Derived
fluxed and non-fluxed solid solders for electronic soldering
from Pine Chemicals and Hydrocarbons, by Ring-and-
applications are not covered by this specification as they are
Ball Apparatus
undertheauspicesofIPC–AssociationConnectingElectronic
E29Practice for Using Significant Digits in Test Data to
Industries.
Determine Conformance with Specifications
1.1.1 These solders include those alloys having a liquidus
E46Test Methods for Chemical Analysis of Lead- and
temperature not exceeding 800°F (430°C).
Tin-Base Solder (Withdrawn 1994)
1.1.2 Thisspecificationincludessoldersintheformofsolid
E51Method for Spectrographic Analysis of Tin Alloys by
bars,ingots,powderandspecialforms,andintheformofsolid
the Powder Technique (Withdrawn 1983)
and flux-core ribbon, wire, and solder paste.
E55Practice for Sampling Wrought Nonferrous Metals and
1.2 The values stated in inch-pound units are to be regarded
Alloys for Determination of Chemical Composition
as standard. The values given in parentheses are mathematical
E87MethodsforChemicalAnalysisofLead,Tin,Antimony
conversions to SI units that are provided for information only
and Their Alloys (Photometric Method) (Withdrawn
and are not considered standard. 3
1983)
1.3 This standard does not purport to address all of the E88Practice for Sampling Nonferrous Metals andAlloys in
safety concerns, if any, associated with its use. It is the
Cast Form for Determination of Chemical Composition
responsibility of the user of this standard to become familiar
2.2 Federal Standard:
with all hazards including those identified in the appropriate
Fed. Std. No. 123Marking for Shipment (Civil Agencies)
Material Safety Data Sheet (MSDS) for this product/material
2.3 Military Standard:
as provided by the manufacturer, to establish appropriate
MIL-STD-129Marking for Shipment and Storage
safety and health practices, and determine the applicability of
regulatory limitations prior to use.
3. Terminology
2. Referenced Documents 3.1 Definitions:
2 3.1.1 producer, n—the primary manufacturer of the mate-
2.1 ASTM Standards:
rial.
3.2 Definitions of Terms Specific to This Standard:
This specification is under the jurisdiction of ASTM Committee B02 on
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee
B02.02 on Refined Lead, Tin, Antimony, and Their Alloys.
Current edition approved Oct. 1, 2014. Published October 2014. Originally The last approved version of this historical standard is referenced on
approved in 1919. Last previous edition approved in 2008 as B32– 08. DOI: www.astm.org.
10.1520/B0032-08R14. Available from Global Engineering Documents, 15 Inverness Way, East
For referenced ASTM standards, visit the ASTM website, www.astm.org, or Englewood, CO 80112-5704, http://global.ihs.com.
contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,
Standards volume information, refer to the standard’s Document Summary page on Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://
the ASTM website. www.dodssp.daps.mil.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
B32−08 (2014)
3.2.1 lot, n—The term “lot” as used in this specification is 7. Chemical Composition
defined as follows:
7.1 Solder Alloy—The solder alloy composition is as speci-
3.2.1.1 Discussion—For solid solder metal, a lot consists of
fied in Table 1.
all solder of the same type designation, produced from the
same batch of raw materials under essentially the same NOTE 1—By mutual agreement between supplier and purchaser, analy-
sis may be required and limits established for elements or compounds not
conditions, and offered for inspection at one time.
specified in Table 1.
3.2.1.2 Discussion—For flux–core solder, a lot consists of
7.2 Flux (applicable to flux-core ribbon, wire, and solder
all solder of the same core mixture, produced from the same
batch of raw materials under essentially the same conditions paste):
and offered for inspection at one time. 7.2.1 Type R—The flux is composed of Grade WW or WG
gum rosin of Test Methods D509. The rosin shall have a
3.2.2 lot number,, n—The term “lot number” as used in this
toluene–insoluble matter content of not more than 0.05
specification refers to an alphanumeric or numerical designa-
weight% in accordance with Test Method D269, a minimum
tion for a lot which is traceable to a date of manufacture.
acid number of 160 mg KOH/1 g sample in accordance with
4. Classification Test Methods D465, a minimum softening point of 70°C in
accordance with Test Methods E28, and a minimum saponifi-
4.1 Type Designation—The type designation uses the fol-
cation number of 166 in accordance with Test Methods D464.
lowing symbols to properly identify the material:
Whensolventsorplasticizersareadded,theymustbenonchlo-
4.1.1 Alloy Composition—The composition is identified by
rinated.
atwo-lettersymbolandanumber.Theletterstypicallyindicate
7.2.2 Type RMA—Thefluxiscomposedofrosinconforming
the chemical symbol for the critical element in the solder and
to 7.2.1. Incorporated additives provide a material meeting the
thenumberindicatesthenominalpercentage,byweight,ofthe
requirements of 8.1.2 for type RMA. When solvents or
critical element in the solder. The designation followed by the
plasticizers are added, they must be nonchlorinated.
letters A or B distinguishes between different alloy grades of
7.2.3 Type RA—The flux is composed of rosin conforming
similar composition (see Table 1).
to 7.2.1. Incorporated additives provide a material meeting the
4.1.2 Form—The form is indicated by a single letter in
requirements of 8.1.2 for Type RA. When solvents or plasti-
accordance with Table 2.
cizers are added, they must be nonchlorinated.
4.1.3 Flux Type—The flux type is indicated by a letter or
7.2.4 Type OA—The flux is composed of one or more
combination of letters in accordance with Table 3.
water-soluble organic materials.
4.1.4 Core Condition and Flux Percentage (applicable only
to flux-cored solder)—The core condition and flux percentage
7.2.5 Type OS—The flux is composed of one or more
is identified by a single letter and a number in accordance with water-insoluble organic materials, other than Types R, RMA,
Table 4.
and RA, which are soluble in organic solvents.
4.1.5 Powder Mesh Size and Flux Percentage (applicable
7.2.6 Type IS—The flux is composed of one or more
only to solder paste)—The powder mesh size and flux percent-
inorganic salts or acids with or without an organic binder and
age is identified by a single letter and a number in accordance
solvents.
with Table 5.
8. Physical Properties and Performance Requirements
5. Ordering Information
8.1 Solder Paste—Solder paste must exhibit smoothness of
5.1 Orders for material under this specification indicate the
texture (no lumps) and the absence of caking and drying.
following information, as required, to adequately describe the
8.1.1 Powder Mesh Size—The solder powder mesh size
desired material.
shall be as specified (see 5.1.1 and 4.1.5) when the extracted
5.1.1 Type designation (see 4.1),
solder powder is tested as specified in 13.4.
5.1.2 Detailed requirements for special forms,
8.1.2 Viscosity—The viscosity of solder paste and the
5.1.3 Dimensions of ribbon and wire solder (see 9.2),
method used to determine the viscosity must be agreed upon
5.1.4 Unit weight,
between the supplier and purchaser. The following variables
5.1.5 Packaging (see Section 18),
must be taken into account when relating one viscosity
5.1.6 Marking (see Section 17),
measurement to another type of viscometer used, spindle size
5.1.7 ASTM specification number and issue, marked on (a)
andshape,speed(r/min),temperatureofsample,andtheuseor
purchase order and (b) package or spool, and
non-use of a helipath.
5.1.8 Special requirements, as agreed upon between sup-
plier and purchaser.
8.2 Requirements for Flux—Thefluxmustmeetthephysical
and performance requirements specified in Table 6 as appli-
6. Materials and Manufacture
cable.
6.1 The producer must have each lot of solder metal as 8.2.1 Solder Pool—When solder is tested as specified in
uniforminqualityaspracticableandofsatisfactoryappearance 13.3.2, there must be no spattering, as indicated by the
in accordance with best industrial practices. Each bar, ingot, or presenceoffluxparticlesoutsidethemainpoolofresidue.The
other form in which the solder is sold must be uniform in flux must promote spreading of the molten solder over the
composition with the entire lot. coupon to form integrally thereon a coat of solder that shall
B32−08 (2014)
TABLE 1 Solder Compositions - wt% (range or maximum)
A B
Composition, % Melting Range
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Ce Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14
°F °C °F °C
C
Section 1: Solder Alloys Containing Less than 0.2 % Lead
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 max 0.02 0.005 . . . 430 221 430 221 L13965
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 473 245 L13967
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 536 280 L13969
Sb5 94.0 min 0.20 4.5-5.5 0.015 0.08 0.005 0.005 0.15 0.05 0.04 0.005 . . . 450 233 464 240 L13950
D
E Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 349 L13935
D
HA Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 . . . 420 216 440 227 L13955
D
HB Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 . . 460 238 660 349 L13952
D
HN Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 0.15-0.25 . . 440 225 660 350 L13933
D
PT Rem 0.2 0.25–4.0 0.05–0.50 0.25–4.0 0.005 0.005 0.15 0.01 0.02 0.005 0.005 0.01-0.25 . 430 221 435 224
D
AC Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75-3.75 0.05 0.02 0.005 0.001 . . 403 206 453 234 L13964
D
OA Rem 0.2 0.05 0.05–0.3 2.0–4.0 0.005 0.005 0.5–1.5 0.05 0.04† 0.05 . . . 420 216 460 238 L13937
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 220 446 230 L13938
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 . 0.04-0.20 419 215 660 350 L13931
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 350 L13939
A
For purposes of determining conformance to these limits, an observed value or calculated value obtained from analysis shall be rounded to the nearest unit in the last right-hand place of figures used in expressing
the specified limit, in accordance with the rounding method of Practice E29.
B
Temperatures given are approximations and for information only.
C
For alloys not identified, named elements shall conform to the following tolerances (wt%): >5% ±0.5%, >=5%± 0.25 %; Impurity elements (maximum): Sn-0.2, Pb-0.2, Sb-0.5, Ag-0.015, Cu-0.08, Cd-0.005, Al-0.05,
Bi-0.15, As-0.02, Fe-0.02, Zn-0.005.
D
Grades E and OA are covered by U.S. patents held by Engelhard Corp, Mansfield, MA, and Oatey Co. Cleveland, OH respectively. Federated Fry Metals, Altoona, PA and Taracorp Inc., Atlanta, GA have applied for
patents on grades AC and TC respectively. Grades HA, HB, and HN are covered by patents assigned to J. W. Harris Co., Cincinnati, OH. Grade PT is covered by a patent issued to Precise Alloys Corporation, Bronx,
NY. Interested parties are invited to submit information regarding identification of acceptable alternatives to these patented items to the Committee on Standards, ASTM International Headquarters, 100 Barr Harbor Drive,
West Conshohocken, PA 19428. Your comments will receive careful consideration at a meeting of the responsible technical committee, which you may attend.
† OA value for FE 10 was corrected editorially.

B32−08 (2014)
TABLE 1 Solder Compositions - wt% (range or maximum) (continued)
A B
Composition, % Melting Range
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Ce Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14
°F °C °F °C
Section 2: Solder Alloys Containing Lead
Sn70 69.5–71.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 377 193 L13700
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 361 183 L13630
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 354 179 372 189 L13620
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 374 190 L13600
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 421 216 L55031
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 441 227 L54951
Sn40A 39.5–41.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 460 238 L54916
Sn40B 39.5–41.5 Rem 1.8–2.4 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 448 231 L54918
Sn35A 34.5–36.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 447 247 L54851
Sn35B 34.5–36.5 Rem 1.6–2.0 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 470 243 L54852
Sn30A 29.5–31.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 491 255 L54821
Sn30B 29.5–31.5 Rem 1.4–1.8 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 482 250
...

This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: B32 − 08 B32 − 08 (Reapproved 2014)
Standard Specification for
Solder Metal
This standard is issued under the fixed designation B32; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications,
including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver,
tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their
melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not
covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid
and flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical
conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data
Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and
determine the applicability of regulatory limitations prior to use.
2. Referenced Documents
2.1 ASTM Standards:
D269 Test Method for Insoluble Matter in Rosin and Rosin Derivatives
D464 Test Methods for Saponification Number of Naval Store Products Including Tall Oil and Other Related Products
D465 Test Methods for Acid Number of Naval Stores Products Including Tall Oil and Other Related Products
D509 Test Methods of Sampling and Grading Rosin
E28 Test Methods for Softening Point of Resins Derived from Pine Chemicals and Hydrocarbons, by Ring-and-Ball Apparatus
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
E46 Test Methods for Chemical Analysis of Lead- and Tin-Base Solder (Withdrawn 1994)
E51 Method for Spectrographic Analysis of Tin Alloys by the Powder Technique (Withdrawn 1983)
E55 Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
E87 Methods for Chemical Analysis of Lead, Tin, Antimony and Their Alloys (Photometric Method) (Withdrawn 1983)
E88 Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition
2.2 Federal Standard:
Fed. Std. No. 123 Marking for Shipment (Civil Agencies)
2.3 Military Standard:
MIL-STD-129 Marking for Shipment and Storage
This specification is under the jurisdiction of ASTM Committee B02 on Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee B02.02 on Refined
Lead, Tin, Antimony, and Their Alloys.
Current edition approved May 1, 2008Oct. 1, 2014. Published May 2008October 2014. Originally approved in 1919. Last previous edition approved in 20042008 as
B32 - 04.B32– 08. DOI: 10.1520/B0032-08.10.1520/B0032-08R14.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM Standards
volume information, refer to the standard’sstandard’s Document Summary page on the ASTM website.
The last approved version of this historical standard is referenced on www.astm.org.
Available from Global Engineering Documents, 15 Inverness Way, East Englewood, CO 80112-5704, http://global.ihs.com.
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4, Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://www.dodssp.daps.mil.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
B32 − 08 (2014)
3. Terminology
3.1 Definitions:
3.1.1 producer, n—the primary manufacturer of the material.
3.2 Definitions of Terms Specific to This Standard:
3.2.1 lot, n—The term “lot” as used in this specification is defined as follows:
3.2.1.1 Discussion—
For solid solder metal, a lot consists of all solder of the same type designation, produced from the same batch of raw materials
under essentially the same conditions, and offered for inspection at one time.
3.2.1.2 Discussion—
For flux–core solder, a lot consists of all solder of the same core mixture, produced from the same batch of raw materials under
essentially the same conditions and offered for inspection at one time.
3.2.2 lot number,, n—The term “lot number” as used in this specification refers to an alphanumeric or numerical designation
for a lot which is traceable to a date of manufacture.
4. Classification
4.1 Type Designation—The type designation uses the following symbols to properly identify the material:
4.1.1 Alloy Composition—The composition is identified by a two-letter symbol and a number. The letters typically indicate the
chemical symbol for the critical element in the solder and the number indicates the nominal percentage, by weight, of the critical
element in the solder. The designation followed by the letters A or B distinguishes between different alloy grades of similar
composition (see Table 1).
4.1.2 Form—The form is indicated by a single letter in accordance with Table 2.
4.1.3 Flux Type—The flux type is indicated by a letter or combination of letters in accordance with Table 3.
4.1.4 Core Condition and Flux Percentage (applicable only to flux-cored solder)—The core condition and flux percentage is
identified by a single letter and a number in accordance with Table 4.
4.1.5 Powder Mesh Size and Flux Percentage (applicable only to solder paste)—The powder mesh size and flux percentage is
identified by a single letter and a number in accordance with Table 5.
5. Ordering Information
5.1 Orders for material under this specification indicate the following information, as required, to adequately describe the
desired material.
5.1.1 Type designation (see 4.1),
5.1.2 Detailed requirements for special forms,
5.1.3 Dimensions of ribbon and wire solder (see 9.2),
5.1.4 Unit weight,
5.1.5 Packaging (see Section 18),
5.1.6 Marking (see Section 17),
5.1.7 ASTM specification number and issue, marked on (a) purchase order and (b) package or spool, and
5.1.8 Special requirements, as agreed upon between supplier and purchaser.
6. Materials and Manufacture
6.1 The producer must have each lot of solder metal as uniform in quality as practicable and of satisfactory appearance in
accordance with best industrial practices. Each bar, ingot, or other form in which the solder is sold must be uniform in composition
with the entire lot.
7. Chemical Composition
7.1 Solder Alloy—The solder alloy composition is as specified in Table 1.
NOTE 1—By mutual agreement between supplier and purchaser, analysis may be required and limits established for elements or compounds not
specified in Table 1.
7.2 Flux (applicable to flux-core ribbon, wire, and solder paste):
7.2.1 Type R—The flux is composed of Grade WW or WG gum rosin of Test Methods D509. The rosin shall have a
toluene–insoluble matter content of not more than 0.05 weight % in accordance with Test Method D269, a minimum acid number
B32 − 08 (2014)
TABLE 1 Solder Compositions - wt% (range or maximum)
A B
Composition, % Melting Range
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Ce Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14
°F °C °F °C
C
Section 1: Solder Alloys Containing Less than 0.2 % Lead
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 max 0.02 0.005 . . . 430 221 430 221 L13965
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 473 245 L13967
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 536 280 L13969
Sb5 94.0 min 0.20 4.5-5.5 0.015 0.08 0.005 0.005 0.15 0.05 0.04 0.005 . . . 450 233 464 240 L13950
D
E Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 349 L13935
D
HA Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 . . . 420 216 440 227 L13955
D
HB Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 . . 460 238 660 349 L13952
D
HN Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 0.15-0.25 . . 440 225 660 350 L13933
D
PT Rem 0.2 0.25–4.0 0.05–0.50 0.25–4.0 0.005 0.005 0.15 0.01 0.02 0.005 0.005 0.01-0.25 . 430 221 435 224
D
AC Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75-3.75 0.05 0.02 0.005 0.001 . . 403 206 453 234 L13964
D
OA Rem 0.2 0.05 0.05–0.3 2.0–4.0 0.005 0.005 0.5–1.5 0.05 0.04† 0.05 . . . 420 216 460 238 L13937
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 220 446 230 L13938
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 . 0.04-0.20 419 215 660 350 L13931
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 350 L13939
A
For purposes of determining conformance to these limits, an observed value or calculated value obtained from analysis shall be rounded to the nearest unit in the last right-hand place of figures used in expressing
the specified limit, in accordance with the rounding method of Practice E29.
B
Temperatures given are approximations and for information only.
C
For alloys not identified, named elements shall conform to the following tolerances (wt%): >5% ±0.5%, >=5%± 0.25 %; Impurity elements (maximum): Sn-0.2, Pb-0.2, Sb-0.5, Ag-0.015, Cu-0.08, Cd-0.005, Al-0.05,
Bi-0.15, As-0.02, Fe-0.02, Zn-0.005.
D
Grades E and OA are covered by U.S. patents held by Engelhard Corp, Mansfield, MA, and Oatey Co. Cleveland, OH respectively. Federated Fry Metals, Altoona, PA and Taracorp Inc., Atlanta, GA have applied for
patents on grades AC and TC respectively. Grades HA, HB, and HN are covered by patents assigned to J. W. Harris Co., Cincinnati, OH. Grade PT is covered by a patent issued to Precise Alloys Corporation, Bronx,
NY. Interested parties are invited to submit information regarding identification of acceptable alternatives to these patented items to the Committee on Standards, ASTM International Headquarters, 100 Barr Harbor Drive,
West Conshohocken, PA 19428. Your comments will receive careful consideration at a meeting of the responsible technical committee, which you may attend.
† OA value for FE 10 was corrected editorially.

B32 − 08 (2014)
TABLE 1 Solder Compositions - wt% (range or maximum) (continued)
colwidth="7.26*"/COLSPECcolwidth="6.81*"/COLSPECcolwidth="6.20*"/COLSPECcolwidth="5.44*"/
A B
Composition, % Melting Range
COLSPECcolwidth="5.86*"/COLSPECcolwidth="3.38*"/COLSPECcolwidth="3.41*"/COLSPECcolwidth="6.50*"/COLSPEC
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Ce Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14
°F °C °F °C
C
Section 1: Solder Alloys Containing Less than 0.2 % Lead
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 430 221 L13965
max
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 473 245 L13967
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 536 280 L13969
Sb5 94.0 min 0.20 4.5-5.5 0.015 0.08 0.005 0.005 0.15 0.05 0.04 0.005 . . . 450 233 464 240 L13950
D
E Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 349 L13935
D
HA Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 . . . 420 216 440 227 L13955
D
HB Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 . . 460 238 660 349 L13952
D
HN Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 0.15-0.25 . . 440 225 660 350 L13933
D
PT Rem 0.2 0.25–4.0 0.05–0.50 0.25–4.0 0.005 0.005 0.15 0.01 0.02 0.005 0.005 0.01– . 430 221 435 224
0.25
D
AC Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75– 0.05 0.02 0.005 0.001 . . 403 206 453 234 L13964
3.75
D
OA Rem 0.2 0.05 0.05–0.3 2.0–4.0 0.005 0.005 0.5–1.5 0.05 0.04† 0.05 . . . 420 216 460 238 L13937
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 220 446 230 L13938
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 . 0.04– 419 215 660 350 L13931
0.20
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 350 L13939
Section 2: Solder Alloys Containing Lead
Section 2: Solder Alloys Containing Lead
Sn70 69.5–71.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 377 193 L13700
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 361 183 L13630
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 361 183 L13630
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 354 179 372 189 L13620
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 354 179 372 189 L13620
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 374 190 L13600
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 374 190 L13600
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 421 216 L55031
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 421 216 L55031
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 441 227 L54951
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 441 227 L54951
Sn40A 39.5–41.5 Rem 0.50 0.015 0.08 0
...