ASTM B32-20
(Specification)Standard Specification for Solder Metal
Standard Specification for Solder Metal
ABSTRACT
This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solder alloys shall adhere to chemical composition requirements specified for the following flux types: Types R, RMA, and RA, which are composed of Grade WW or WG gum rosin; Type OA, which is composed of water-soluble organic materials; Type OS, which is composed of water-insoluble organic materials; and Type IS, which is composed of inorganic saltsor acids. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection. Other properties to which the alloys should conform to are dimensions and unit weights, spread factor, and resistivity of water extract.
SCOPE
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Safety Data Sheet (SDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
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This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation:B32 −20
Standard Specification for
1
Solder Metal
ThisstandardisissuedunderthefixeddesignationB32;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope* 2. Referenced Documents
2
1.1 Thisspecificationcoverssoldermetalalloys(commonly 2.1 ASTM Standards:
known as soft solders) used in non-electronic applications, D269Test Method for Insoluble Matter in Rosin and Rosin
including but not limited to, tin-lead, tin-antimony, tin- Derivatives
antimony-copper-silver,tin-antimony-copper-silver-nickel,tin- D464Test Methods for Saponification Number of Pine
silver, tin-copper-silver, and lead-tin-silver, used for the pur- Chemical Products Including Tall Oil and Other Related
pose of joining together two or more metals at temperatures Products
below their melting points. Electronic grade solder alloys and D465Test Methods for Acid Number of Pine Chemical
fluxed and non-fluxed solid solders for electronic soldering Products Including Tall Oil and Other Related Products
applications are not covered by this specification as they are D509Test Methods of Sampling and Grading Rosin
undertheauspicesofIPC–AssociationConnectingElectronic E28Test Methods for Softening Point of Resins Derived
Industries. from Pine Chemicals and Hydrocarbons, by Ring-and-
1.1.1 These solders include those alloys having a liquidus Ball Apparatus
temperature not exceeding 800°F (430°C). E29Practice for Using Significant Digits in Test Data to
Determine Conformance with Specifications
1.1.2 Thisspecificationincludessoldersintheformofsolid
bars,ingots,powderandspecialforms,andintheformofsolid E46Test Methods for Chemical Analysis of Lead- and
3
Tin-Base Solder (Withdrawn 1994)
and flux-core ribbon, wire, and solder paste.
E51Method for Spectrographic Analysis of Tin Alloys by
1.2 The values stated in inch-pound units are to be regarded
3
the Powder Technique (Withdrawn 1983)
as standard. The values given in parentheses are mathematical
E55Practice for Sampling Wrought Nonferrous Metals and
conversions to SI units that are provided for information only
Alloys for Determination of Chemical Composition
and are not considered standard.
E87MethodsforChemicalAnalysisofLead,Tin,Antimony
1.3 This standard does not purport to address all of the
and Their Alloys (Photometric Method) (Withdrawn
safety concerns, if any, associated with its use. It is the 3
1983)
responsibility of the user of this standard to become familiar
E88Practice for Sampling Nonferrous Metals andAlloys in
with all hazards including those identified in the appropriate
Cast Form for Determination of Chemical Composition
Safety Data Sheet (SDS) for this product/material as provided 4
2.2 Federal Standard:
by the manufacturer, to establish appropriate safety, health,
Fed. Std. No. 123Marking for Shipment (Civil Agencies)
and environmental practices, and determine the applicability 5
2.3 Military Standard:
of regulatory limitations prior to use.
MIL-STD-129Marking for Shipment and Storage
1.4 This international standard was developed in accor-
3. Terminology
dance with internationally recognized principles on standard-
ization established in the Decision on Principles for the
3.1 Definitions:
Development of International Standards, Guides and Recom-
mendations issued by the World Trade Organization Technical 2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Barriers to Trade (TBT) Committee. contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website.
3
The last approved version of this historical standard is referenced on
1
This specification is under the jurisdiction of ASTM Committee B02 on www.astm.org.
4
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee Available from Global Engineering Documents, 15 Inverness Way, East
B02.02 on Refined Lead, Tin, Antimony, and Their Alloys. Englewood, CO 80112-5704, http://global.ihs.com.
5
Current edition approved Oct. 1, 2020. Published October 2020. Originally Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,
approvedin1919.Lastpreviouseditionapprovedin2014asB32–08(2014).DOI: Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://
10.1520/B0032-20. www.dodssp.daps.mil.
*A Summary of Changes section appears at the end of this standard
Copyright
...
This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: B32 − 08 (Reapproved 2014) B32 − 20
Standard Specification for
1
Solder Metal
This standard is issued under the fixed designation B32; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope Scope*
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including
but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-
silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points.
Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this
specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and
flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical
conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data
Sheet (MSDS)(SDS) for this product/material as provided by the manufacturer, to establish appropriate safety safety, health, and
healthenvironmental practices, and determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization
established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued
by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
2. Referenced Documents
2
2.1 ASTM Standards:
D269 Test Method for Insoluble Matter in Rosin and Rosin Derivatives
D464 Test Methods for Saponification Number of Pine Chemical Products Including Tall Oil and Other Related Products
D465 Test Methods for Acid Number of Pine Chemical Products Including Tall Oil and Other Related Products
D509 Test Methods of Sampling and Grading Rosin
E28 Test Methods for Softening Point of Resins Derived from Pine Chemicals and Hydrocarbons, by Ring-and-Ball Apparatus
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
1
This specification is under the jurisdiction of ASTM Committee B02 on Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee B02.02 on Refined
Lead, Tin, Antimony, and Their Alloys.
Current edition approved Oct. 1, 2014Oct. 1, 2020. Published October 2014October 2020. Originally approved in 1919. Last previous edition approved in 20082014 as
B32B32 – 08 (2014).– 08. DOI: 10.1520/B0032-08R14.10.1520/B0032-20.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
*A Summary of Changes section appears at the end of this standard
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
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B32 − 20
3
E46 Test Methods for Chemical Analysis of Lead- and Tin-Base Solder (Withdrawn 1994)
3
E51 Method for Spectrographic Analysis of Tin Alloys by the Powder Technique (Withdrawn 1983)
E55 Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
3
E87 Methods for Chemical Analysis of Lead, Tin, Antimony and Their Alloys (Photometric Method) (Withdrawn 1983)
E88 Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition
4
2.2 Federal Standard:
Fed.
...
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