ASTM E2444-11e1
(Terminology)Terminology Relating to Measurements Taken on Thin, Reflecting Films
Terminology Relating to Measurements Taken on Thin, Reflecting Films
SCOPE
1.1 This standard consists of terms and definitions pertaining to measurements taken on thin, reflecting films, such as found in microelectromechanical systems (MEMS) materials. In particular, the terms are related to the standards in Section 2, which were generated by Committee E08 on Fatigue and Fracture. Terminology E1823 Relating to Fatigue and Fracture Testing is applicable to this standard.
1.2 The terms are listed in alphabetical order.
General Information
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Standards Content (Sample)
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Designation: E2444 −11
Standard Terminology Relating to
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Measurements Taken on Thin, Reflecting Films
This standard is issued under the fixed designation E2444; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
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ε NOTE—Additional sources for terms were added editorially in August 2012.
1. Scope anchor—in a surface-micromachining process, the portion of
the test structure where a structural layer is intentionally
1.1 This standard consists of terms and definitions pertain-
attached to its underlying layer. E2244, E2245, E2246
ing to measurements taken on thin, reflecting films, such as
found in microelectromechanical systems (MEMS) materials.
anchor lip—in a surface-micromachining process, the free-
In particular, the terms are related to the standards in Section 2,
standing extension of the structural layer of interest around
which were generated by Committee E08 on Fatigue and
the edges of the anchor to its underlying layer.
Fracture. Terminology E1823 Relating to Fatigue and Fracture
DISCUSSION—In some processes, the width of the anchor lip may be
Testing is applicable to this standard.
zero. E2244, E2245, E2246
1.2 The terms are listed in alphabetical order.
bulk micromachining—a MEMS fabrication process where
the substrate is removed at specified locations. E2244,
2. Referenced Documents
E2245, E2246
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2.1 ASTM Standards:
E1823 Terminology Relating to Fatigue and FractureTesting cantilever—a test structure that consists of a freestanding
E2244 Test Method for In-Plane Length Measurements of beam that is fixed at one end. E2244, E2245, E2246
Thin, Reflecting Films Using an Optical Interferometer
fixed-fixed beam —a test structure that consists of a freestand-
E2245 Test Method for Residual Strain Measurements of
ing beam that is fixed at both ends. E2244, E2245
Thin, Reflecting Films Using an Optical Interferometer
E2246 Test Method for Strain Gradient Measurements of
in-plane length (or deflection) measurement, L (or D)
Thin, Reflecting Films Using an Optical Interferometer
[L]—the experimental determination of the straight-line
distance between two transitional edges in a MEMS device.
3. Terminology
DISCUSSION—This length (or deflection) measurement is made paral-
lel to the underlying layer (or the xy-plane of the interferometric
3.1 Terms and Their Definitions:
microscope). E2244, E2245, E2246
2-D data trace—a two-dimensional group of points that is
extracted from a topographical 3-D data set and that is interferometer—a non-contact optical instrument used to
parallel to the xz-or yz-plane of the interferometric obtain topographical 3-D data sets.
microscope. E2244, E2245
DISCUSSION—The height of the sample is measured along the z-axis
of the interferometer. The x-axis is typically aligned parallel or
3-D data set—a three-dimensional group of points with a
perpendicular to the transitional edges to be measured. E2244,
topographical z-value for each (x, y) pixel location within the
E2245, E2246
interferometric microscope’s field of view. E2244, E2245,
MEMS—microelectromechanical systems. E2244, E2245,
E2246
E2246
microelectromechanical systems, MEMS—in general, this
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This test method is under the jurisdiction ofASTM Committee E08 on Fatigue
term is used to describe micron-scale structures, sensors,
and Fracture and is the direct responsibility of Subcommittee E08.02 on Standards
actuators, and technologies used for their manufacture (such
and Terminology.
Current edition approved Oct. 15, 2011. Published December 2011. Orginially
as, silicon process technologies), or combinations thereof.
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approved in 2005. Last previous edition approved in 2005 as E2444–05 . DOI:
E2244, E2245, E2246
10.1520/E2444-11E01.
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For referenced ASTM standards, visit the ASTM website, www.astm.org, or
residual strain, ε —in a MEMS process, the amount of
r
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
deformation (or displacement) per unit length constrained
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. within the structural layer of interest after fabrication yet
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E2444 − 11
before the constraint of the sacrificial layer (or substrate) is surface micromachining—a MEMS fabrication process
removed (in whole or in part) E2245, E2246 where micron-scale components are formed on a substrate
by the deposition (or addition) and removal (in whole or in
sacrificial layer—a single thick
...
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