ASTM F1513-99(2003)

Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

ABSTRACT
This specification sets purity grade levels, physical attributes, analytical methods, and packaging of three grades of pure unalloyed aluminum source materials for electronic thin film applications such as evaporation sources and sputtering targets. The impurity levels should be analyzed using the proposed method and should be within the specified range for each grade.
SCOPE
1.1 This specification covers pure aluminum metal (unalloyed) for use in evaporation sources and sputtering targets. This material is intended as a raw material for electronic applications. The material is used as-supplied in some cases (for example, as e-beam evaporation sources). In other instances it may be remelted, alloyed, cast and processed by the purchaser to make finished products (for example, sputtering targets).  
1.2 This specification sets purity grade levels, physical attributes, analytical methods, and packaging.  
1.3 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

General Information

• Status: Historical
• Publication Date: 09-Dec-1999
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.17 - Sputter Metallization

Relations

• Replaces: ASTM F1513-99 - Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
• Effective Date: 10-Dec-1999
• Replaced By: ASTM F1513-99(2011) - Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications (Withdrawn 2020)
• Effective Date: 01-Jun-2011

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F1513 – 99 (Reapproved 2003)
Standard Specification for
Pure Aluminum (Unalloyed) Source Material for Electronic
Thin Film Applications
This standard is issued under the fixed designation F1513; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
TABLE 1 Aluminum Grades
1. Scope
Maximum Metallic Impurity
1.1 This specification covers pure aluminum metal (unal-
Grade Purity, %
Content (by weight), ppm
loyed) for use in evaporation sources and sputtering targets.
6N 99.9999 1
This material is intended as a raw material for electronic
5N5 99.9995 5
applications. The material is used as-supplied in some cases
5N 99.999 10
(for example, as e-beam evaporation sources). In other in-
stances it may be remelted, alloyed, cast and processed by the
5. Ordering Information
purchaser to make finished products (for example, sputtering
targets).
5.1 Orders for pure aluminum source material shall include
1.2 This specification sets purity grade levels, physical
the following:
attributes, analytical methods, and packaging.
5.1.1 Grade (4.1),
1.3 The values stated in SI units are to be regarded as the
5.1.2 Configuration (8.1 and 8.2),
standard. The values given in parentheses are for information
5.1.3 Whether or not certification is required (12.1), and
only.
5.1.4 Whether or not a sample representative of the finished
product is required to be provided by the supplier to the
2. Referenced Documents
purchaser.
2.1 ASTM Standards:
6. Impurities
D1971 Practices for Digestion of Water Samples for Deter-
mination of Metals by FlameAtomicAbsorption, Graphite
6.1 The minimum suite of metallic impurity elements to be
Furnace Atomic Absorption, Plasma Emission Spectros-
analyzed is defined in Table 2. Acceptable analysis methods
copy, or Plasma Mass Spectrometry
and detection limits are specified in Section 11. Elements not
detected will be counted and reported as present at the
3. Terminology
detection limit. Additional elements may be analyzed and
3.1 material lot—material melted and cast from one cru-
reported, as agreed upon between the supplier and the pur-
cible charge.
chaser, but these shall not be counted in defining the grade
designation.
4. Classification
6.2 Nonmetalic elements to be analyzed and reported are C,
4.1 Grades of aluminum are defined in Table 1. Impurity
H, O, N, and S.
contents are reported in parts per million by weight (wt ppm).
6.3 Acceptable limits and analytical techniques for particu-
4.2 Purity and total metallic impurity levels are based upon
lar elements in critical applications shall be as agreed upon
elements listed in Table 2.
between the supplier and the purchaser.
TABLE 2 Minimum Suite of Metallic Elements to be Analyzed
This specification is under the jurisdiction of ASTM Committee F01 on
Antimony Gold Silver
Electronics and is the direct responsibility of Subcommittee F01.17 on Sputter
Arsenic Iron Sodium
Metallization.
Beryllium Lithium Thorium
Current edition approved Dec. 10, 1999. Published February 2000. Originally
Boron Magnesium Tin
published as F1513–94. Last previous edition F1513–94. DOI: 10.1520/F1513-
Calcium Manganese Titanium
99R03.
Cerium Nickel Uranium
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Cesium Phosphorus Vanadium
contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
Chromium Potassium Zinc
Standards volume information, refer to the standard’s Document Summary page on
Copper Silicon Zirconium
the ASTM website.
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F1513 – 99 (2003)
6.4 Fluorine and chlorine may be important impurities in 11.1.3 Nitrogen—Fusion and gas extraction/thermal con-
some applications.Acceptable limits and analytical techniques ductivity analysis; mdl 5 wt. ppm.
shall be agreed upon between the supplier and the purchaser. 11.1.4 Hydrogen
...