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ASTM F458-06

(Practice)

Standard Practice for Nondestructive Pull Testing of Wire Bonds

Standard Practice for Nondestructive Pull Testing of Wire Bonds

SIGNIFICANCE AND USE
The nondestructive wire-bond pull test provides a screen for evaluating wire-bond quality and is capable of detecting weak or nonadherent bonds.
The test is not destructive to acceptable wire bonds.
This practice provides a procedure for identifying a bonding situation that requires corrective action.
The purpose of this practice is to identify wire bonds that may fail during subsequent screening procedures or field operation.  
The procedure is to be applied after bonding and before any further treatment.
SCOPE
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is destructive to nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds. Note 1Common usage at the present time considers the term "wire bond" to include the entire interconnection: both welds and the intervening wire span.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-m)) wire of the type used in integrated circuits and hybrid microcircuits.
1.3 This practice can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and metallurgical state, criteria are given only for gold and aluminum wire.
1.5 A destructive pull test is used on wire bonds of the same type and geometry to provide the basis for the determination of the nondestructive pulling force to be used in this practice. This may only be used if the sample standard deviation, s, of the pulling forces required to destroy at least 25 of the same wire bonds tested by the destructive pull-test method is less than or equal to 0.25 of the sample average,  x. If  s > 0.25  x, this practice may not be used. Note 2If s > 0.25  x, some aspect of the bonding process is out of control. Following corrective action, the destructive pull-test measurements should be repeated to determine if the s 0.25  xcriterion is met.
1.6 The nondestructive wire-bond pull test is to be performed before any other treatment or screening following bonding and at the same point in processing as the accompanying destructive test. Preferably, this is done immediately after bonding.
1.7 The procedure does not ensure against wire-bond failure modes induced after the test has been performed.
1.8 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Historical
Publication Date
31-Dec-2005
ICS
29.120.20 - Connecting devices
Technical Committee
F01 - Electronics
Current Stage
Ref Project

Relations

Replaces
ASTM F458-84(2001) - Standard Practice for Nondestructive Pull Testing of Wire Bonds
Effective Date
01-Jan-2006
Replaced By
ASTM F458-13 - Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2
Effective Date
01-Jan-2013
Referred By
ASTM F1269-13(2018) - Standard Test Methods for Destructive Shear Testing of Ball Bonds (Withdrawn 2023)
Effective Date
01-Jan-2006
Referred By
ASTM F459-13(2018) - Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
Effective Date
01-Jan-2006

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ASTM F458-06 - Standard Practice for Nondestructive Pull Testing of Wire BondsASTM F458-06 - Standard Practice for Nondestructive Pull Testing of Wire Bonds
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ASTM F458-06 - Standard Practice for Nondestructive Pull Testing of Wire Bonds
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Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F458 − 06
StandardPractice for
1
Nondestructive Pull Testing of Wire Bonds
ThisstandardisissuedunderthefixeddesignationF458;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope 1.7 The procedure does not ensure against wire-bond failure
modes induced after the test has been performed.
1.1 This practice covers nondestructive testing of individual
wire bonds made by either ultrasonic, thermal compression or 1.8 The values stated in inch-pound units are to be regarded
thermosonic techniques. The test is destructive to nonaccept- as the standard. The values given in parentheses are for
able wire bonds but is designed to avoid damage to acceptable information only.
wire bonds.
1.9 This standard does not purport to address all of the
safety concerns, if any, associated with its use. It is the
NOTE 1—Common usage at the present time considers the term “wire
bond” to include the entire interconnection: both welds and the interven- responsibility of the user of this standard to establish appro-
ing wire span.
priate safety and health practices and determine the applica-
bility of regulatory limitations prior to use.
1.2 The practice covers wire bonds made with small-
diameter (from 0.0007 to 0.003-in. (18 to 76-µm)) wire of the
2. Referenced Documents
type used in integrated circuits and hybrid microcircuits.
2
2.1 ASTM Standards:
1.3 This practice can be used only when the loop height of
F459 Test Methods for Measuring Pull Strength of Micro-
the wire bond is large enough to allow a suitable hook for
electronic Wire Bonds
pulling to be placed under the wire.
3
2.2 Military Standard:
1.4 While the procedure is applicable to wire of any
MIL-STD-883 Method 2023
composition and metallurgical state, criteria are given only for
3. Summary of Practice
gold and aluminum wire.
3.1 The use of nondestructive wire-bond pull tests is predi-
1.5 Adestructive pull test is used on wire bonds of the same
cated on data obtained from destructive pull tests on typical
type and geometry to provide the basis for the determination of
samples selected from a lot.The maximum safe nondestructive
thenondestructivepullingforcetobeusedinthispractice.This
pull-force levels are determined as a function of the metallur-
may only be used if the sample standard deviation, s,ofthe
gical properties of the wire and from the calculated mean (xH)
pulling forces required to destroy at least 25 of the same wire
and standard deviation (s) of the destructive pull-test data
bonds tested by the destructive pull-test method is less than or
determined in accordance with Test Methods F459.
equal to 0.25 of the sample average, x¯.If s > 0.25 x¯, this
practice may not be used. 3.2 In some cases, rather than use a calculated nondestruc-
tive pull force, a fixed pull force may be agreed upon by test
NOTE 2—If s > 0.25 x¯, some aspect of the bonding process is out of
participants. This value may be based upon industry practice,
control. Following corrective action, the destructive pull-test measure-
or some other accepted value, such as that in MIL STD 883,
ments should be repeated to determine if the s ≤ 0.25 x¯ criterion is met.
Method 2023. All other parts of the present ASTM standard
1.6 The nondestructive wire-bond pull test is to be per-
will apply.
formed before any other treatment or screening following
bonding and at the same point in processing as the accompa- 3.3 The maximum safe nondestructive bond-pull force is
nying destructive test. Preferably, this is done immediately thenappliedasascreenforindividualwirebondstoidentifyall
after bonding. bonds with pull strength below the predetermined level of
acceptability.
1 2
This practice is under the jurisdiction ofASTM Committee F01 on Electronics For referenced ASTM standards, visit the ASTM website, www.astm.org, or
andisthedirectresponsibilityofSubcommitteeF01.07onWireBonding,FlipChip, contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
and Tape Automated Bonding. Standards volume information, refer to the standard’s Document Summary page on
Current edition approved Jan. 1, 2006. Published January 2006. Originally the ASTM website.
3
approved in 1976 as F458 – 76 T. Last previous edition approved in 2001 as AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
F458 – 84 (2001). DOI: 10.1520/F0458-06. Robbins Ave., Philadelphia, PA 19111–5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

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SCOPE
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SCOPE
1.1 The techniques described in this guide pertain to mixed flowing gas (MFG) tests containing species that are applied to evaluate devices containing electrical contacts such as slip rings, separable connectors, electromechanical relays or switch contacts. These techniques may be relevant to other devices, but it is the responsibility of the user to determine suitability prior to testing.  
1.2 The MFG tests described in this guide are designed to accelerate corrosive degradation processes. These accelerations are designed such that the degradation occurs in a much shorter time period than that expected for such processes in the intended application environment of the device being tested. Application environments can vary continuously from benign to aggressively corrosive. Connectors and contacts within closed electronic cabinets may be affected by an environment of different severity than the environment on the outside of such cabinets. In general, indoor environments are different than outdoor environments. The MFG tests described herein, being discrete embodiments of specific corrosive conditions, cannot be representative of all possible application environments. It is the responsibility of the test specifier to assure the pertinence of a given test condition to the specifier's application condition.  
1.3 The MFG tests described herein are not designed to duplicate the actual intended application environment of the device under test. An extended bibliography that provides information which is useful to test specifiers to assist them in selecting appropriate test methods is included in this guide. The bibliography covers the scope from application condition characterization, single and multiple gas effects, and material and product effects to key application and test variables as well as discussions of atmospheric corrosion processes.  
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5.1 The principal underlying the test is the sensitivity of the electrical contact interface to temperature and humidity cycling that electrical pressure connection systems experience as a result of usage and installation environment. The temperature cycling may cause micromotion at the mating electrical contact surfaces which can expose fresh metal to the local ambient atmosphere. The humidity exposure is known to facilitate corrosion on freshly exposed metal surfaces. Thus, for those connection systems that do not maintain stable metal-to-metal contact surfaces under the condition of thermal cycling and humidity exposure, repeated sequences of these exposures lead to degradation of the contacting surface indicated by potential drop increase.  
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5.3 Use—It is recommended that this test method be used in one of two ways. First, it may be used to evaluate and report the performance of a particular connection system. For such use, it is appropriate to report the results in a summary (or tabular) format such as shown in Section 17, together with the statement “The results shown in the summary (or table) were obtained for (insert description of connection) when tested in accordance with Test Method B812. Second, it may be used as the basis for specification of acceptability of product. For this use, the minimum test time and the maximum allowable increase in potential drop must be established by the specifier. Specification of connection systems in...
SCOPE
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1.3.4 This test method does not evaluate degradation which may occur in residential applications due to exposure of the electrical connection system to additional environmental constituents such as (but not limited to) the following examples:
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1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Safety Data Sheet (SDS) for this product...

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3.2 This guide should be adapted to site specific circumstance.
SCOPE
1.1 This guide covers the use of oil spill dispersants to assist in the control of oil spills. The guide is written with the goal of minimizing the environmental impacts of oil spills; this goal is the basis on which the recommendations are made. Aesthetic and socioeconomic factors are not considered, although these and other factors are often important in spill response.  
1.2 Spill responders have available several means to control or clean up spilled oil. Chemical dispersants should be given equal consideration with other spill countermeasures.  
1.3 This is a general guide only. Oil, as used in this guide, includes crude oils and refined petroleum products. Differences between individual dispersants or between different oil products are not considered. The dispersibility of the oil with the chosen dispersant should be evaluated.  
1.4 The guide is organized by habitat type, for example, small ponds and lakes, rivers and streams, and land. It considers the use of dispersants primarily to protect habitats from impact (or to minimize impacts).  
1.5 This guide applies only to freshwater and other inland environments. It does not consider the direct application of dispersants to subsurface waters.  
1.6 In making dispersant use decisions, appropriate government authorities should be consulted as required by law.  
1.7 This guide does not address getting regulatory approval.  
1.8 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.10 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

  • Guide
    3 pages
    English language
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  • Guide
    3 pages
    English language
    sale 15% off