ASTM F458-84(2001)
(Practice)Standard Practice for Nondestructive Pull Testing of Wire Bonds
Standard Practice for Nondestructive Pull Testing of Wire Bonds
SCOPE
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is destructive to nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds.
Note 1--Common usage at the present time considers the term "wire bond" to include the entire interconnection: both welds and the intervening wire span.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-m)) wire of the type used in integrated circuits and hybrid microcircuits.
1.3 This practice can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and metallurgical state, criteria are given only for gold and aluminum wire.
1.5 A destructive pull test is used on wire bonds of the same type and geometry to provide the basis for the determination of the nondestructive pulling force to be used in this practice. This may only be used if the sample standard deviation, s, of the pulling forces required to destroy at least 25 of the same wire bonds tested by the destructive pull-test method is less than or equal to 0.25 of the sample average, x. If s > 0.25 x, this practice may not be used.
Note 2--If s > 0.25 x, some aspect of the bonding process is out of control. Following corrective action, the destructive pull-test measurements should be repeated to determine if the s 0.25 xcriterion is met.
1.6 The nondestructive wire-bond pull test is to be performed before any other treatment or screening following bonding and at the same point in processing as the accompanying destructive test. Preferably, this is done immediately after bonding.
1.7 The procedure does not ensure against wire-bond failure modes induced after the test has been performed.
1.8 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Standards Content (Sample)
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn. Contact ASTM
International (www.astm.org) for the latest information.
Designation:F 458–84(Reapproved2001)
Standard Practice for
Nondestructive Pull Testing of Wire Bonds
This standard is issued under the fixed designation F 458; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope 1.8 The values stated in inch-pound units are to be regarded
as the standard. The values given in parentheses are for
1.1 This practice covers nondestructive testing of individual
information only.
wire bonds made by either ultrasonic, thermal compression or
1.9 This standard does not purport to address all of the
thermosonic techniques. The test is destructive to nonaccept-
safety concerns, if any, associated with its use. It is the
able wire bonds but is designed to avoid damage to acceptable
responsibility of the user of this standard to establish appro-
wire bonds.
priate safety and health practices and determine the applica-
NOTE 1—Common usage at the present time considers the term “wire
bility of regulatory limitations prior to use.
bond” to include the entire interconnection: both welds and the interven-
ing wire span.
2. Referenced Documents
1.2 The practice covers wire bonds made with small-
2.1 ASTM Standards:
diameter (from 0.0007 to 0.003-in. (18 to 76-µm)) wire of the
F 219 Methods of Testing Fine Round and Flat Wire for
type used in integrated circuits and hybrid microcircuits.
Electron Devices and Lamps
1.3 This practice can be used only when the loop height of
F 459 Test Methods for Measuring Pull Strength of Micro-
the wire bond is large enough to allow a suitable hook for
electronic Wire Bonds
pulling to be placed under the wire.
3. Summary of Practice
1.4 While the procedure is applicable to wire of any
composition and metallurgical state, criteria are given only for
3.1 The use of nondestructive wire-bond pull tests is predi-
gold and aluminum wire.
cated on data obtained from destructive pull tests on typical
1.5 Adestructive pull test is used on wire bonds of the same
samples selected from a lot.The maximum safe nondestructive
type and geometry to provide the basis for the determination of
pull-force levels are determined as a function of the metallur-
thenondestructivepullingforcetobeusedinthispractice.This
gical properties of the wire and from the calculated mean (x)
may only be used if the sample standard deviation, s,ofthe
and standard deviation (s) of the destructive pull-test data
pulling forces required to destroy at least 25 of the same wire
determined in accordance with Test Methods F 459.
bonds tested by the destructive pull-test method is less than or
3.2 The maximum safe nondestructive bond-pull force is
equal to 0.25 of the sample average, x¯.If s > 0.25 x¯, this
thenappliedasascreenforindividualwirebondstoidentifyall
practice may not be used.
bonds with pull strength below the predetermined level of
acceptability.
NOTE 2—If s > 0.25 x¯, some aspect of the bonding process is out of
control. Following corrective action, the destructive pull-test measure-
4. Significance and Use
ments should be repeated to determine if the s# 0.25 x¯ criterion is met.
4.1 Thenondestructivewire-bondpulltestprovidesascreen
1.6 The nondestructive wire-bond pull test is to be per-
for evaluating wire-bond quality and is capable of detecting
formed before any other treatment or screening following
weak or nonadherent bonds.
bonding and at the same point in processing as the accompa-
4.2 The test is not destructive to acceptable wire bonds.
nying destructive test. Preferably, this is done immediately
4.3 This practice provides a procedure for identifying a
after bonding.
bonding situation that requires corrective action.
1.7 The procedure does not ensure against wire-bond failure
4.4 The purpose of this practice is to identify wire bonds
modes induced after the test has been performed.
that may fail during subsequent screening procedures or field
operation.
This practice is under the jurisdiction ofASTM Committee F-1 on Electronics
and is the direct responsibility of Subcommittee F01.07 on Wire Bonding.
Current edition approved May 25, 1984. Published July 1984. Originally
published as F 458 – 76 T. Last previous edition F 458 – 78. Annual Book of ASTM Standards, Vol 10.04.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn. Contact ASTM
International (www.astm.org) for the latest information.
F 458–84 (2001)
n
4.5 The procedure is to be applied after bonding and before 1
2 1 2
/
s 5 ~x 2 x¯! ,
H ( J
i
n 2 1
any further treatment.
i 5 1
5. Interferences
or (equivalently)
5.1 As the force levels of the nondestructive wire-bond pull
n
2 2 1 2
test depend upon the correct, consistent application of the /
s 5 @ ~x 2nx¯! #
H ( J
i
n 2 1
i 5 1
destructive wire-bond pull test, the same interferences apply as
given in Test Methods F 459.
8.4 Using Table 1, select the wire composition and elonga-
tion (obtainable from the wire manufacturer), and the relation
6. Apparatus
between x¯ and s appropriate to the wire bond to be tested and
6.1 The apparatus used for the procedure is identical to that
determine the recommended maximum safe nondestructive
used in Test Methods F 459 except that the lifting mechanism
pull (NDP) forc
...
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