ASTM F459-13(2018)
(Test Method)Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
SIGNIFICANCE AND USE
5.1 Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire bond. These methods can assist in maintaining control of the process of making wire bonds. They can be used to distinguish between weak, nonadherent wire bonds and acceptably strong wire bonds. The methods are destructive.
5.2 These test methods are appropriate for on-line use for process control, for purchase specifications, and for research in support of improved yield or reliability. The referee method should be used for quantitative comparison of pull strengths of wire bonds.
SCOPE
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).
Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.
FIG. 1 Suggested Configuration for a Pulling Hook
1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2
1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.
1.5 A nondestructive procedure is described in Practice F458.
1.6 The values in SI units are to be regarded as standard.
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.8 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
WITHDRAWN RATIONALE
These test methods covered tests to determine the pull strength of a series of wire bonds. Instructions were provided to modify the methods for use as a referee method. The methods could be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 µm).
Formerly under the jurisdiction of F01 on Electronics, these test methods were withdrawn in November 2023. This standard is being withdrawn without replacement because Committee F01 was disbanded.
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This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation:F459 −13 (Reapproved 2018)
Standard Test Methods for
Measuring Pull Strength of Microelectronic Wire Bonds
ThisstandardisissuedunderthefixeddesignationF459;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope mendations issued by the World Trade Organization Technical
Barriers to Trade (TBT) Committee.
1.1 These test methods cover tests to determine the pull
strength of a series of wire bonds. Instructions are provided to
2. Referenced Documents
modify the methods for use as a referee method. The methods
2.1 ASTM Standards:
can be used for wire bonds made with wire having a diameter
F458PracticeforNondestructivePullTestingofWireBonds
of from 0.0007 to 0.003 in. (18 to 76 µm).
NOTE 1—Common usage at the present time considers the term “wire
3. Terminology
bond” to include the entire interconnection: both welds and the interven-
3.1 Definitions of Terms Specific to This Standard:
ing wire span.
3.1.1 For the purposes of these test methods the following
1.2 These test methods can be used only when the loop
failure points are defined:
heightofthewirebondislargeenoughtoallowasuitablehook
3.1.2 bond-wire junction failure—a rupture in the wire
for pulling (see Fig. 1) to be placed under the wire.
within two wire diameters of the bond and in which more than
1.3 The precision of these methods has been evaluated for
25%ofthebondedareaisleftonthepadafterthepulltesthas
aluminum ultra-sonic wedge bonds; however, these methods
been applied.
can be used for gold and copper wedge or ball bonds.
3.1.3 weld interface failure—a rupture in which less than
1.4 These methods are destructive.They are appropriate for 25%ofthebondedareaisleftonthepadafterthepulltesthas
useinprocessdevelopmentor,withapropersamplingplan,for been applied. See pad lifting in 6.6.
process control or quality assurance.
3.1.4 wire span failure—a rupture in the wire other than (1)
atapointwithintwowirediametersofeitherbond,or (2)atthe
1.5 A nondestructive procedure is described in Practice
point at which the hook contacted the wire.
F458.
1.6 The values in SI units are to be regarded as standard.
4. Summary of Test Methods
1.7 This standard does not purport to address all of the
4.1 The microelectronic device with the wire bond to be
safety concerns, if any, associated with its use. It is the
tested is held firmly in an appropriate fixture. A hook is
responsibility of the user of this standard to establish appro-
positionedunderthewiremidwaybetweenthetwobonds.The
priate safety, health, and environmental practices and deter-
hook is then raised until the wire bond breaks. The force
mine the applicability of regulatory limitations prior to use.
applied to the hook in order to cause failure of the wire bond
1.8 This international standard was developed in accor-
is recorded. The point of failure is observed and recorded. In
dance with internationally recognized principles on standard-
the referee method, the force in the wire on breaking is
ization established in the Decision on Principles for the
calculated.
Development of International Standards, Guides and Recom-
5. Significance and Use
5.1 Failureofmicroelectronicdevicesisoftenduetofailure
These test methods are under the jurisdiction of ASTM Committee F01 on
ofaninterconnectionbond.Acommontypeofinterconnection
Electronics and are the direct responsibility of Subcommittee F01.03 on Metallic
bond is a wire bond. These methods can assist in maintaining
Materials, Wire Bonding, and Flip Chip.
control of the process of making wire bonds.They can be used
Current edition approved March 1, 2018. Published April 2018. Originally
approved in 1976 as F459–76T. Last previous edition approved in 2013 as
F459–13. DOI: 10.1520/F0459-13R18.
2 3
Harman, G. G., ”Microelectronic Ultrasonic Bonding,” NBS Special Publica- For referenced ASTM standards, visit the ASTM website, www.astm.org, or
tion 400-2, pp. 94-95 and “Wire Bonding in Microelectronics,” Third Edition, contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
McGraw Hill, 2010. Also Microelectronics Reliability 51 (2011), Special Issue on Standards volume information, refer to the standard’s Document Summary page on
Copper bonding. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F459−13 (2018)
FIG. 1 Suggested Configuration for a Pulling Hook
to distinguish between weak, nonadherent wire bonds and sharp edges in any part of the hook that contacts the wire loop.
acceptably strong wire bonds. The methods are destructive. The hook should be rigidly mounted in the pulling apparatus.
7.1.2 Lifting-and-Gaging Mechanism —Mechanism for ap-
5.2 These test methods are appropriate for on-line use for
plying a measured vertical force to the hook. The mechanism
processcontrol,forpurchasespecifications,andforresearchin
shall incorporate a means for recording the maximum force
support of improved yield or reliability. The referee method
appliedandshallbecapableofapplyingforceatarateconstant
should be used for quantitative comparison of pull strengths of
to within 2 gf/s (20 mN/s) in the range from 1 to 30 gf/s (10 to
wire bonds.
290 mN/s) inclusive. A mechanism with a single fixed scale
shallhaveamaximumscalereadingnogreaterthanthreetimes
6. Interferences
the nominal bond pull strength anticipated.
6.1 Failure to center the hook along the loop between the
NOTE 2—Mechanisms of the dynamometer type known as “gram
two bonds or pulling in a direction not lying in the plane
gages” have been found satisfactory, but currently, electronic gauges
containingtheundisturbedloopmayinvalidatethetestsincean
(properly calibrated using the manufacturers’ procedures) are more
unbalanced distribution of forces between the two bonds may
common.
result.
7.1.3 Microscope with Light Source —Zoom microscope
6.2 Slippage of the hook along the wire span during pulling
with light source with a magnification range of approximately
may invalidate the test because an unbalanced distribution of
14× to 60× with the eyepiece not to exceed 10×, for viewing
forces between the two bonds may result.
the device under test.
7.1.4 Device Holder— Mechanism for holding the device
6.3 Careless insertion of the hook may damage either bond
under test (1) in a horizontal position, for MethodA, or (2) in
or wire and thus invalidate the test.
either a horizontal or a tipped position so that both bonds are
6.4 The presence of vibration or mechanical shock may
in the same horizontal plane, for Method B. For the referee
causetheapplicationofanextraneousforceandthusinvalidate
MethodC,thedeviceholdershouldprovideameasurement,to
the test.
within2°,oftheanglefromthehorizontal(whichmaybezero)
6.5 Measured bond-pull force is strongly dependent on the
through which the device has been tipped.
height of the loop (H+h, as defined in 11.1.1) and the
7.1.5 Calibration Masses—At least five masses (weights)
bond-to-bond spacing ( d, as defined in 11.1.1).
with mass values known to within 0.5% sized to cover the
lifting-and-gaging mechanism range of force measurement,
6.6 For fine pitch ball bonds (<60 µm pitch), the bond pad
and suitably configured so that they may be supported by the
may tear and lift during pull testing. Current practice is to
pulling mechanism for calibration.
accept this if the pull force is acceptably high under agreed
upon requirements, but note it as appropriate. In some cases of
8. Sampling
bad peeling, it is necessary to move the pulling hook directly
8.1 Since the pull-test method is destructive, it shall be
over the top of the ball bond. This should be noted.
performed on a sampling basis.The sample selected should be
7. Apparatus representative of the wire bonds of interest. The size of the
sampleandthemethodofselectionshallbeagreeduponbythe
7.1 Bond-Pulling Machine—Apparatus for measuring wire-
parties to the test.
bond pull strength with the following components:
7.1.1 Hook—Pulling hook made from a rigid wire such as
9. Calibration
tungsten.Thediameterofthatpartofthehookthatcontactsthe
9.1 Calibrate the bond-pulling machine at the beginning of
wire loop should be approximately 2.5 times the diameter of
eachseriesoftests,ordailyifaseriesspansmorethanoneday.
the wire used to make the wire bond. A suggested hook
configurationisshowninFig.1.Thehookshouldappearunder 9.2 Assemble the bond-pulling machine in the same con-
visual inspection to have a smooth polished surface with no figuration to be used to perform the wire-bond pull test.
F459−13 (2018)
9.3 Calibrate the lifting-and-gaging mechanism. 10.1.7 Measure and re
...
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F459 − 13 (Reapproved 2018)
Standard Test Methods for
Measuring Pull Strength of Microelectronic Wire Bonds
This standard is issued under the fixed designation F459; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope mendations issued by the World Trade Organization Technical
Barriers to Trade (TBT) Committee.
1.1 These test methods cover tests to determine the pull
strength of a series of wire bonds. Instructions are provided to
2. Referenced Documents
modify the methods for use as a referee method. The methods
2.1 ASTM Standards:
can be used for wire bonds made with wire having a diameter
F458 Practice for Nondestructive Pull Testing of Wire Bonds
of from 0.0007 to 0.003 in. (18 to 76 µm).
NOTE 1—Common usage at the present time considers the term “wire
3. Terminology
bond” to include the entire interconnection: both welds and the interven-
3.1 Definitions of Terms Specific to This Standard:
ing wire span.
3.1.1 For the purposes of these test methods the following
1.2 These test methods can be used only when the loop
failure points are defined:
height of the wire bond is large enough to allow a suitable hook
3.1.2 bond-wire junction failure—a rupture in the wire
for pulling (see Fig. 1) to be placed under the wire.
within two wire diameters of the bond and in which more than
1.3 The precision of these methods has been evaluated for
25 % of the bonded area is left on the pad after the pull test has
aluminum ultra-sonic wedge bonds; however, these methods
been applied.
can be used for gold and copper wedge or ball bonds.
3.1.3 weld interface failure—a rupture in which less than
1.4 These methods are destructive. They are appropriate for 25 % of the bonded area is left on the pad after the pull test has
use in process development or, with a proper sampling plan, for been applied. See pad lifting in 6.6.
process control or quality assurance.
3.1.4 wire span failure—a rupture in the wire other than (1)
at a point within two wire diameters of either bond, or (2) at the
1.5 A nondestructive procedure is described in Practice
point at which the hook contacted the wire.
F458.
1.6 The values in SI units are to be regarded as standard.
4. Summary of Test Methods
1.7 This standard does not purport to address all of the
4.1 The microelectronic device with the wire bond to be
safety concerns, if any, associated with its use. It is the
tested is held firmly in an appropriate fixture. A hook is
responsibility of the user of this standard to establish appro-
positioned under the wire midway between the two bonds. The
priate safety, health, and environmental practices and deter-
hook is then raised until the wire bond breaks. The force
mine the applicability of regulatory limitations prior to use.
applied to the hook in order to cause failure of the wire bond
1.8 This international standard was developed in accor-
is recorded. The point of failure is observed and recorded. In
dance with internationally recognized principles on standard-
the referee method, the force in the wire on breaking is
ization established in the Decision on Principles for the
calculated.
Development of International Standards, Guides and Recom-
5. Significance and Use
5.1 Failure of microelectronic devices is often due to failure
These test methods are under the jurisdiction of ASTM Committee F01 on
of an interconnection bond. A common type of interconnection
Electronics and are the direct responsibility of Subcommittee F01.03 on Metallic
bond is a wire bond. These methods can assist in maintaining
Materials, Wire Bonding, and Flip Chip.
control of the process of making wire bonds. They can be used
Current edition approved March 1, 2018. Published April 2018. Originally
approved in 1976 as F459 – 76 T. Last previous edition approved in 2013 as
F459 – 13. DOI: 10.1520/F0459-13R18.
2 3
Harman, G. G., ”Microelectronic Ultrasonic Bonding,” NBS Special Publica- For referenced ASTM standards, visit the ASTM website, www.astm.org, or
tion 400-2, pp. 94-95 and “Wire Bonding in Microelectronics,” Third Edition, contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
McGraw Hill, 2010. Also Microelectronics Reliability 51 (2011), Special Issue on Standards volume information, refer to the standard’s Document Summary page on
Copper bonding. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F459 − 13 (2018)
FIG. 1 Suggested Configuration for a Pulling Hook
to distinguish between weak, nonadherent wire bonds and sharp edges in any part of the hook that contacts the wire loop.
acceptably strong wire bonds. The methods are destructive. The hook should be rigidly mounted in the pulling apparatus.
7.1.2 Lifting-and-Gaging Mechanism —Mechanism for ap-
5.2 These test methods are appropriate for on-line use for
plying a measured vertical force to the hook. The mechanism
process control, for purchase specifications, and for research in
shall incorporate a means for recording the maximum force
support of improved yield or reliability. The referee method
applied and shall be capable of applying force at a rate constant
should be used for quantitative comparison of pull strengths of
to within 2 gf/s (20 mN/s) in the range from 1 to 30 gf/s (10 to
wire bonds.
290 mN/s) inclusive. A mechanism with a single fixed scale
shall have a maximum scale reading no greater than three times
6. Interferences
the nominal bond pull strength anticipated.
6.1 Failure to center the hook along the loop between the
NOTE 2—Mechanisms of the dynamometer type known as “gram
two bonds or pulling in a direction not lying in the plane
gages” have been found satisfactory, but currently, electronic gauges
containing the undisturbed loop may invalidate the test since an
(properly calibrated using the manufacturers’ procedures) are more
unbalanced distribution of forces between the two bonds may
common.
result.
7.1.3 Microscope with Light Source —Zoom microscope
6.2 Slippage of the hook along the wire span during pulling
with light source with a magnification range of approximately
may invalidate the test because an unbalanced distribution of
14× to 60× with the eyepiece not to exceed 10×, for viewing
forces between the two bonds may result.
the device under test.
7.1.4 Device Holder— Mechanism for holding the device
6.3 Careless insertion of the hook may damage either bond
under test (1) in a horizontal position, for Method A, or (2) in
or wire and thus invalidate the test.
either a horizontal or a tipped position so that both bonds are
6.4 The presence of vibration or mechanical shock may
in the same horizontal plane, for Method B. For the referee
cause the application of an extraneous force and thus invalidate
Method C, the device holder should provide a measurement, to
the test.
within 2°, of the angle from the horizontal (which may be zero)
6.5 Measured bond-pull force is strongly dependent on the
through which the device has been tipped.
height of the loop (H + h, as defined in 11.1.1) and the
7.1.5 Calibration Masses—At least five masses (weights)
bond-to-bond spacing ( d, as defined in 11.1.1).
with mass values known to within 0.5 % sized to cover the
lifting-and-gaging mechanism range of force measurement,
6.6 For fine pitch ball bonds (<60 µm pitch), the bond pad
and suitably configured so that they may be supported by the
may tear and lift during pull testing. Current practice is to
pulling mechanism for calibration.
accept this if the pull force is acceptably high under agreed
upon requirements, but note it as appropriate. In some cases of
8. Sampling
bad peeling, it is necessary to move the pulling hook directly
8.1 Since the pull-test method is destructive, it shall be
over the top of the ball bond. This should be noted.
performed on a sampling basis. The sample selected should be
representative of the wire bonds of interest. The size of the
7. Apparatus
sample and the method of selection shall be agreed upon by the
7.1 Bond-Pulling Machine—Apparatus for measuring wire-
parties to the test.
bond pull strength with the following components:
7.1.1 Hook—Pulling hook made from a rigid wire such as
9. Calibration
tungsten. The diameter of that part of the hook that contacts the
9.1 Calibrate the bond-pulling machine at the beginning of
wire loop should be approximately 2.5 times the diameter of
each series of tests, or daily if a series spans more than one day.
the wire used to make the wire bond. A suggested hook
configuration is shown in Fig. 1. The hook should appear under 9.2 Assemble the bond-pulling machine in the same con-
visual inspection to have a smooth polished surface with no figuration to be used to perform the wire-bond pull test.
F459 − 13 (2018)
9.3 Calibrate the lifting-and-gaging mechanism. 10.1.7 Measure and record the for
...
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