ASTM F459-13
(Test Method)Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
SIGNIFICANCE AND USE
5.1 Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire bond. These methods can assist in maintaining control of the process of making wire bonds. They can be used to distinguish between weak, nonadherent wire bonds and acceptably strong wire bonds. The methods are destructive.
5.2 These test methods are appropriate for on-line use for process control, for purchase specifications, and for research in support of improved yield or reliability. The referee method should be used for quantitative comparison of pull strengths of wire bonds.
SCOPE
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm). Note 1—Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.
FIG. 1 Suggested Configuration for a Pulling Hook
1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2
1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.
1.5 A nondestructive procedure is described in Practice F458.
1.6 The values in SI units are to be regarded as standard.
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation:F459 −13
Standard Test Methods for
1
Measuring Pull Strength of Microelectronic Wire Bonds
ThisstandardisissuedunderthefixeddesignationF459;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope 2. Referenced Documents
3
1.1 These test methods cover tests to determine the pull 2.1 ASTM Standards:
strength of a series of wire bonds. Instructions are provided to F458PracticeforNondestructivePullTestingofWireBonds
modify the methods for use as a referee method. The methods
3. Terminology
can be used for wire bonds made with wire having a diameter
of from 0.0007 to 0.003 in. (18 to 76 µm). 3.1 Definitions of Terms Specific to This Standard:
3.1.1 For the purposes of these test methods the following
NOTE 1—Common usage at the present time considers the term “wire
failure points are defined:
bond” to include the entire interconnection: both welds and the interven-
3.1.2 bond-wire junction failure—a rupture in the wire
ing wire span.
within two wire diameters of the bond and in which more than
1.2 These test methods can be used only when the loop
25%ofthebondedareaisleftonthepadafterthepulltesthas
heightofthewirebondislargeenoughtoallowasuitablehook
been applied.
for pulling (see Fig. 1) to be placed under the wire.
3.1.3 weld interface failure—a rupture in which less than
1.3 The precision of these methods has been evaluated for
25%ofthebondedareaisleftonthepadafterthepulltesthas
aluminum ultra-sonic wedge bonds; however, these methods
been applied. See pad lifting in 6.6.
2
can be used for gold and copper wedge or ball bonds.
3.1.4 wire span failure—a rupture in the wire other than (1)
1.4 These methods are destructive.They are appropriate for
atapointwithintwowirediametersofeitherbond,or (2)atthe
useinprocessdevelopmentor,withapropersamplingplan,for
point at which the hook contacted the wire.
process control or quality assurance.
4. Summary of Test Methods
1.5 A nondestructive procedure is described in Practice
F458. 4.1 The microelectronic device with the wire bond to be
tested is held firmly in an appropriate fixture. A hook is
1.6 The values in SI units are to be regarded as standard.
positionedunderthewiremidwaybetweenthetwobonds.The
1.7 This standard does not purport to address all of the
hook is then raised until the wire bond breaks. The force
safety concerns, if any, associated with its use. It is the
applied to the hook in order to cause failure of the wire bond
responsibility of the user of this standard to establish appro-
is recorded. The point of failure is observed and recorded. In
priate safety and health practices and determine the applica-
the referee method, the force in the wire on breaking is
bility of regulatory limitations prior to use.
calculated.
5. Significance and Use
1
These test methods are under the jurisdiction of ASTM Committee F01 on
5.1 Failureofmicroelectronicdevicesisoftenduetofailure
Electronics and are the direct responsibility of Subcommittee F01.03 on Metallic
Materials, Wire Bonding, and Flip Chip. ofaninterconnectionbond.Acommontypeofinterconnection
Current edition approved Jan. 1, 2013. Published January 2013. Originally
bond is a wire bond. These methods can assist in maintaining
approved in 1976 as F459–76T. Last previous edition approved in 2006 as
F459–06. DOI: 10.1520/F0459-13.
2 3
Harman, G. G., ”Microelectronic Ultrasonic Bonding,” NBS Special Publica- For referenced ASTM standards, visit the ASTM website, www.astm.org, or
tion 400-2, pp. 94-95 and “Wire Bonding in Microelectronics,” Third Edition, contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
McGraw Hill, 2010. Also Microelectronics Reliability 51 (2011), Special Issue on Standards volume information, refer to the standard’s Document Summary page on
Copper bonding. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
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F459−13
FIG. 1 Suggested Configuration for a Pulling Hook
control of the process of making wire bonds.They can be used sharp edges in any part of the hook that contacts the wire loop.
to distinguish between weak, nonadherent wire bonds and The hook should be rigidly mounted in the pulling apparatus.
acceptably strong wire bonds. The methods are destructive. 7.1.2 Lifting-and-Gaging Mechanism —Mechanism for ap-
plying a measured vertical force to the hook. The mechanism
5.2 These test methods are appropriate for on-line use for
shall incorporate a means for recordi
...
This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: F459 − 06 F459 − 13
Standard Test Methods for
1
Measuring Pull Strength of Microelectronic Wire Bonds
This standard is issued under the fixed designation F459; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify
the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007
to 0.003 in. (18 to 76 μm).
NOTE 1—Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire
span.
1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for
pulling (see Fig. 1) to be placed under the wire.
1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be
used for aluminum ball bonds and goldgold and copper wedge or ball bonds, as aluminum wedge bonds are the most sensitive to
2
manufacturing variations (such as bond deformation) of any wire-bond type.bonds.
1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for
process control or quality assurance.
1.5 A nondestructive procedure is described in Practice F458.
1.6 The values stated in inch-poundSI units are to be regarded as the standard. The values given in parentheses are for
information only.standard.
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use.
2. Referenced Documents
3
2.1 ASTM Standards:
F458 Practice for Nondestructive Pull Testing of Wire Bonds
3. Terminology
3.1 Definitions of Terms Specific to This Standard:
3.1.1 For the purposes of these test methods the following failure points are defined:
3.1.2 bond-wire junction failure—a rupture in the wire within two wire diameters of the bond and in which more than 25 % of
the bonded area is left on the pad after the pull test has been applied.
3.1.3 weld interface failure—a rupture in which less than 25 % of the bonded area is left on the pad after the pull test has been
applied. See pad lifting in 6.6.
1
These test methods are under the jurisdiction of ASTM Committee F01 on Electronics and are the direct responsibility of Subcommittee F01.07 on Wire Bonding, Flip
Chip, and Tape Automated Bonding.
Current edition approved Jan. 1, 2006Jan. 1, 2013. Published February 2006January 2013. Originally approved in 1976 as F459 – 76 T. Last previous edition approved
in 20012006 as F459 – 84F459 – 06.(2001). DOI: 10.1520/F0459-06.10.1520/F0459-13.
2
Harman, G. G., ”Microelectronic Ultrasonic Bonding,” NBS Special Publication 400-2, pp. 94-95 and “Wire Bonding in Microelectronics, Materials, Processes,
Reliability, and Yield,” Second Edition, George Harman, McGraw Hill, 1997, pp. 67–78. Microelectronics,” Third Edition, McGraw Hill, 2010. Also Microelectronics
Reliability 51 (2011), Special Issue on Copper bonding.
3
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
---------------------- Page: 1 ----------------------
F459 − 13
FIG. 1 Suggested Configuration for a Pulling Hook
3.1.4 wire span failure—a rupture in the wire other than (1) at a point within two wire diameters of either bond, or (2) at the
point at which the hook contacted the wire.
4. Summary of Test Methods
4.1 The microelectronic device with the wire bond to be tested is held firmly in an appropriate fixture. A hook is positioned
under the wire midway between the two bonds. The hook is then raised until the wire bond breaks. The force applied to the hook
in order to cause failure of th
...
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