ASTM F458-13(2018)
(Practice)Standard Practice for Nondestructive Pull Testing of Wire Bonds (Withdrawn 2023)
Standard Practice for Nondestructive Pull Testing of Wire Bonds (Withdrawn 2023)
SIGNIFICANCE AND USE
4.1 The nondestructive wire-bond pull test provides a screen for evaluating wire-bond quality and is capable of detecting weak or nonadherent bonds.
4.2 The test is not destructive and does not damage acceptable wire bonds.
4.3 This practice provides a procedure for identifying a bonding situation that requires corrective action.
4.4 The purpose of this practice is to identify wire bonds that may fail during subsequent screening procedures or field operation.
4.5 The procedure is to be applied after bonding and before any further treatment.
SCOPE
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds.
Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-μm)) wire such as the type used in integrated circuits and hybrid microcircuits, system in package, and so forth.
1.3 This practice can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and metallurgical state, criteria are given only for gold and aluminum wire.
1.5 A destructive pull test is used on wire bonds of the same type and geometry to provide the basis for the determination of the nondestructive pulling force to be used in this practice. This may only be used if the sample standard deviation, s, of the pulling forces required to destroy at least 25 of the same wire bonds tested by the destructive pull-test method is less than or equal to 0.25 of the sample average, x. If s > 0.25 x, this practice may not be used.
Note 2: If s > 0.25 x, some aspect of the bonding process is out of control. Following corrective action, the destructive pull-test measurements should be repeated to determine if the s ≤ 0.25 x criterion is met.
1.6 The nondestructive wire-bond pull test is to be performed before any other treatment or screening following bonding and at the same point in processing as the accompanying destructive test. Preferably, this is done immediately after bonding.
1.7 The procedure does not ensure against wire-bond failure modes induced after the test has been performed.
1.8 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.10 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
WITHDRAWN RATIONALE
This practice covered nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test was intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds.
Formerly under the jurisdiction of F01 on Electronics, this practice was withdrawn in November 2023. This standard is being withdrawn without replacement because Committee F01 was disbanded.
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Standards Content (Sample)
This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: F458 − 13 (Reapproved 2018)
Standard Practice for
1,2
Nondestructive Pull Testing of Wire Bonds
ThisstandardisissuedunderthefixeddesignationF458;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope bonding and at the same point in processing as the accompa-
nying destructive test. Preferably, this is done immediately
1.1 Thispracticecoversnondestructivetestingofindividual
after bonding.
wire bonds made by either ultrasonic, thermal compression or
thermosonic techniques. The test is intended to reveal (by 1.7 Theproceduredoesnotensureagainstwire-bondfailure
breaking) nonacceptable wire bonds but is designed to avoid modes induced after the test has been performed.
damage to acceptable wire bonds.
1.8 The values stated in inch-pound units are to be regarded
as standard. The values given in parentheses are mathematical
NOTE 1—Common usage at the present time considers the term “wire
bond” to include the entire interconnection: both welds and the interven-
conversions to SI units that are provided for information only
ing wire span.
and are not considered standard.
1.2 The practice covers wire bonds made with small-
1.9 This standard does not purport to address all of the
diameter(from0.0007to0.003-in.(18to76-µm))wiresuchas
safety concerns, if any, associated with its use. It is the
the type used in integrated circuits and hybrid microcircuits,
responsibility of the user of this standard to establish appro-
system in package, and so forth.
priate safety, health, and environmental practices and deter-
mine the applicability of regulatory limitations prior to use.
1.3 This practice can be used only when the loop height of
1.10 This international standard was developed in accor-
the wire bond is large enough to allow a suitable hook for
dance with internationally recognized principles on standard-
pulling to be placed under the wire.
ization established in the Decision on Principles for the
1.4 While the procedure is applicable to wire of any
Development of International Standards, Guides and Recom-
composition and metallurgical state, criteria are given only for
mendations issued by the World Trade Organization Technical
gold and aluminum wire.
Barriers to Trade (TBT) Committee.
1.5 Adestructivepulltestisusedonwirebondsofthesame
typeandgeometrytoprovidethebasisforthedeterminationof
2. Referenced Documents
thenondestructivepullingforcetobeusedinthispractice.This
2.1 ASTM Standards:
may only be used if the sample standard deviation, s,ofthe
F459Test Methods for Measuring Pull Strength of Micro-
pulling forces required to destroy at least 25 of the same wire
electronic Wire Bonds
bonds tested by the destructive pull-test method is less than or
2.2 Military Standard:
equal to 0.25 of the sample average, x¯.If s > 0.25 x¯, this
MIL-STD-883Method 2023
practice may not be used.
NOTE 2—If s > 0.25 x¯, some aspect of the bonding process is out of
3. Summary of Practice
control. Following corrective action, the destructive pull-test measure-
ments should be repeated to determine if the s ≤ 0.25 x¯ criterion is met.
3.1 The use of nondestructive wire-bond pull tests is predi-
cated on data obtained from destructive pull tests on typical
1.6 The nondestructive wire-bond pull test is to be per-
samplesselectedfromalot.Themaximumsafenondestructive
formed before any other treatment or screening following
pull-force levels are determined as a function of the metallur-
gical properties of the wire and from the calculated mean (x¯)
This practice is under the jurisdiction ofASTM Committee F01 on Electronics
andisthedirectresponsibilityofSubcommitteeF01.03onMetallicMaterials,Wire
Bonding, and Flip Chip.
Current edition approved March 1, 2018. Published April 2018. Originally For referenced ASTM standards, visit the ASTM website, www.astm.org, or
approvedin1976asF458–76T.Lastpreviouseditionapprovedin2013asF458– contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
13. DOI: 10.1520/F0458-13R18. Standards volume information, refer to the standard’s Document Summary page on
This procedure, with current status and limitations, was published in: Harman, the ASTM website.
G. G., Wire Bonding in Microelectronics, 3rd Edition, McGraw Hill, 2010, AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
Appendix 4B.2. Robbins Ave., Philadelphia, PA 19111–5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F458 − 13 (2018)
and standard deviation (s) of the destructive pull-test data tested. Use a rate of force application within the range from 1
determined in accordance with Test Methods F459. to30gf/s(10to290mN/s)inclusive.Recordtheforcerequired
tobreakthewirebond,aswellasidentifyingthewirebond,the
3.2 In some cases, rather than use a calculated nondestruc-
device, and whether Method A or B was used.
tive pull force, a fixed pull force may be agreed upon by test
8.2.1 For noncontinuous use of a particular bonding
participants. This value may be based upon industry practice,
machine, apply either Method A or Method B (whichever is
or some other accepted value, such as that in MIL STD 883,
appropriate) of Test Methods F459 to a minimum sample of at
Method 2023. All other parts of the present ASTM standard
least 25 of the same wire bonds once the bonding machine has
will apply.
been turned on, thermally stabilized, and set up by the
3.3 The maximum safe nondestructive bond-pull force is
manufacturers’ procedure.
thenappliedasascreenforindividualwirebondstoidentifyall
8.2.2 For continuous use of a particular bonding machine,
bonds with pull strength below the predetermined level of
apply either MethodAor B (whichever is appropriate) of Test
acceptability.
Methods F459 to a sample of approximately 0.1% (at le
...
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F458 − 13 (Reapproved 2018)
Standard Practice for
1,2
Nondestructive Pull Testing of Wire Bonds
This standard is issued under the fixed designation F458; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope bonding and at the same point in processing as the accompa-
nying destructive test. Preferably, this is done immediately
1.1 This practice covers nondestructive testing of individual
after bonding.
wire bonds made by either ultrasonic, thermal compression or
thermosonic techniques. The test is intended to reveal (by 1.7 The procedure does not ensure against wire-bond failure
breaking) nonacceptable wire bonds but is designed to avoid modes induced after the test has been performed.
damage to acceptable wire bonds.
1.8 The values stated in inch-pound units are to be regarded
as standard. The values given in parentheses are mathematical
NOTE 1—Common usage at the present time considers the term “wire
bond” to include the entire interconnection: both welds and the interven-
conversions to SI units that are provided for information only
ing wire span.
and are not considered standard.
1.2 The practice covers wire bonds made with small-
1.9 This standard does not purport to address all of the
diameter (from 0.0007 to 0.003-in. (18 to 76-µm)) wire such as
safety concerns, if any, associated with its use. It is the
the type used in integrated circuits and hybrid microcircuits,
responsibility of the user of this standard to establish appro-
system in package, and so forth.
priate safety, health, and environmental practices and deter-
mine the applicability of regulatory limitations prior to use.
1.3 This practice can be used only when the loop height of
1.10 This international standard was developed in accor-
the wire bond is large enough to allow a suitable hook for
dance with internationally recognized principles on standard-
pulling to be placed under the wire.
ization established in the Decision on Principles for the
1.4 While the procedure is applicable to wire of any
Development of International Standards, Guides and Recom-
composition and metallurgical state, criteria are given only for
mendations issued by the World Trade Organization Technical
gold and aluminum wire.
Barriers to Trade (TBT) Committee.
1.5 A destructive pull test is used on wire bonds of the same
type and geometry to provide the basis for the determination of
2. Referenced Documents
the nondestructive pulling force to be used in this practice. This
2.1 ASTM Standards:
may only be used if the sample standard deviation, s, of the
F459 Test Methods for Measuring Pull Strength of Micro-
pulling forces required to destroy at least 25 of the same wire
electronic Wire Bonds
bonds tested by the destructive pull-test method is less than or
2.2 Military Standard:
equal to 0.25 of the sample average, x¯. If s > 0.25 x¯, this
MIL-STD-883 Method 2023
practice may not be used.
NOTE 2—If s > 0.25 x¯, some aspect of the bonding process is out of
3. Summary of Practice
control. Following corrective action, the destructive pull-test measure-
ments should be repeated to determine if the s ≤ 0.25 x¯ criterion is met.
3.1 The use of nondestructive wire-bond pull tests is predi-
cated on data obtained from destructive pull tests on typical
1.6 The nondestructive wire-bond pull test is to be per-
samples selected from a lot. The maximum safe nondestructive
formed before any other treatment or screening following
pull-force levels are determined as a function of the metallur-
gical properties of the wire and from the calculated mean (x¯)
This practice is under the jurisdiction of ASTM Committee F01 on Electronics
and is the direct responsibility of Subcommittee F01.03 on Metallic Materials, Wire
Bonding, and Flip Chip.
Current edition approved March 1, 2018. Published April 2018. Originally For referenced ASTM standards, visit the ASTM website, www.astm.org, or
approved in 1976 as F458 – 76 T. Last previous edition approved in 2013 as F458 – contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
13. DOI: 10.1520/F0458-13R18. Standards volume information, refer to the standard’s Document Summary page on
This procedure, with current status and limitations, was published in: Harman, the ASTM website.
G. G., Wire Bonding in Microelectronics, 3rd Edition, McGraw Hill, 2010, Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Appendix 4B.2. Robbins Ave., Philadelphia, PA 19111–5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F458 − 13 (2018)
and standard deviation (s) of the destructive pull-test data tested. Use a rate of force application within the range from 1
determined in accordance with Test Methods F459. to 30 gf/s (10 to 290 mN/s) inclusive. Record the force required
to break the wire bond, as well as identifying the wire bond, the
3.2 In some cases, rather than use a calculated nondestruc-
device, and whether Method A or B was used.
tive pull force, a fixed pull force may be agreed upon by test
8.2.1 For noncontinuous use of a particular bonding
participants. This value may be based upon industry practice,
machine, apply either Method A or Method B (whichever is
or some other accepted value, such as that in MIL STD 883,
appropriate) of Test Methods F459 to a minimum sample of at
Method 2023. All other parts of the present ASTM standard
least 25 of the same wire bonds once the bonding machine has
will apply.
been turned on, thermally stabilized, and set up by the
3.3 The maximum safe nondestructive bond-pull force is
manufacturers’ procedure.
then applied as a screen for individual wire bonds to identify all
8.2.2 For continuous use of a particular bonding machine,
bonds with pull strength below the predetermined level of
apply either Method A or B (whichever is appropriate) of Test
acceptability.
Methods F459 to a sample of approximately 0.1 % (at least 25
bonds) of the p
...
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