ASTM F459-06
(Test Method)Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
SIGNIFICANCE AND USE
Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire bond. These methods can assist in maintaining control of the process of making wire bonds. They can be used to distinguish between weak, nonadherent wire bonds and acceptably strong wire bonds. The methods are destructive.
These test methods are appropriate for on-line use for process control, for purchase specifications, and for research in support of improved yield or reliability. The referee method should be used for quantitative comparison of pull strengths of wire bonds.
SCOPE
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 m). Note 1Common usage at the present time considers the term "wire bond" to include the entire interconnection: both welds and the intervening wire span.
1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see ) to be placed under the wire.
1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for aluminum ball bonds and gold wedge or ball bonds, as aluminum wedge bonds are the most sensitive to manufacturing variations (such as bond deformation) of any wire-bond type.
1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.
1.5 A nondestructive procedure is described in Practice F 458.
1.6 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Standards Content (Sample)
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Designation:F459 −06
StandardTest Methods for
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Measuring Pull Strength of Microelectronic Wire Bonds
ThisstandardisissuedunderthefixeddesignationF459;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope 2. Referenced Documents
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2.1 ASTM Standards:
1.1 These test methods cover tests to determine the pull
F458PracticeforNondestructivePullTestingofWireBonds
strength of a series of wire bonds. Instructions are provided to
modify the methods for use as a referee method. The methods
3. Terminology
can be used for wire bonds made with wire having a diameter
of from 0.0007 to 0.003 in. (18 to 76 µm).
3.1 Definitions of Terms Specific to This Standard:
3.1.1 For the purposes of these test methods the following
NOTE 1—Common usage at the present time considers the term “wire
failure points are defined:
bond” to include the entire interconnection: both welds and the interven-
ing wire span. 3.1.2 bond-wire junction failure—a rupture in the wire
within two wire diameters of the bond and in which more than
1.2 These test methods can be used only when the loop
25%ofthebondedareaisleftonthepadafterthepulltesthas
heightofthewirebondislargeenoughtoallowasuitablehook
been applied.
for pulling (see Fig. 1) to be placed under the wire.
3.1.3 weld interface failure—a rupture in which less than
1.3 The precision of these methods has been evaluated for
25%ofthebondedareaisleftonthepadafterthepulltesthas
aluminum ultra-sonic wedge bonds; however, these methods
been applied. See pad lifting in 6.6.
can be used for aluminum ball bonds and gold wedge or ball
3.1.4 wire span failure—a rupture in the wire other than (1)
bonds, as aluminum wedge bonds are the most sensitive to
atapointwithintwowirediametersofeitherbond,or (2)atthe
manufacturing variations (such as bond deformation) of any
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point at which the hook contacted the wire.
wire-bond type.
1.4 These methods are destructive.They are appropriate for
4. Summary of Test Methods
useinprocessdevelopmentor,withapropersamplingplan,for
4.1 The microelectronic device with the wire bond to be
process control or quality assurance.
tested is held firmly in an appropriate fixture. A hook is
1.5 A nondestructive procedure is described in Practice positionedunderthewiremidwaybetweenthetwobonds.The
F458.
hook is then raised until the wire bond breaks. The force
applied to the hook in order to cause failure of the wire bond
1.6 The values stated in inch-pound units are to be regarded
is recorded. The point of failure is observed and recorded. In
as the standard. The values given in parentheses are for
the referee method, the force in the wire on breaking is
information only.
calculated.
1.7 This standard does not purport to address all of the
safety concerns, if any, associated with its use. It is the
5. Significance and Use
responsibility of the user of this standard to establish appro-
5.1 Failureofmicroelectronicdevicesisoftenduetofailure
priate safety and health practices and determine the applica-
ofaninterconnectionbond.Acommontypeofinterconnection
bility of regulatory limitations prior to use.
bond is a wire bond. These methods can assist in maintaining
control of the process of making wire bonds.They can be used
to distinguish between weak, nonadherent wire bonds and
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These test methods are under the jurisdiction of ASTM Committee F01 on
acceptably strong wire bonds. The methods are destructive.
Electronics and are the direct responsibility of Subcommittee F01.07 on Wire
Bonding, Flip Chip, and Tape Automated Bonding.
Current edition approved Jan. 1, 2006. Published February 2006. Originally
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approved in 1976 as F459–76T. Last previous edition approved in 2001 as For referenced ASTM standards, visit the ASTM website, www.astm.org, or
F459–84(2001). DOI: 10.1520/F0459-06. contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
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“Wire Bonding in Microelectronics, Materials, Processes, Reliability, and Standards volume information, refer to the standard’s Document Summary page on
Yield,” Second Edition, George Harman, McGraw Hill, 1997, pp. 67–78. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
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F459−06
FIG. 1 Suggested Configuration for a Pulling Hook
5.2 These test methods are appropriate for on-line use for 7.1.2 Lifting-and-Gaging Mechanism —Mechanism for ap-
processcontrol,forpurchasespecifications,andforresearchin plying a measured vertical force to the hook. The m
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