ASTM F692-97

Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates

SCOPE
1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films.  
1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder.  
1.3 This test method applies to all films that can be soldered.  
1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux.  
1.5 This test method is destructive.  
1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 31-Dec-1990
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.03 - Metallic Materials, Wire Bonding, and Flip Chip

Relations

• Replaced By: ASTM F692-97(2002) - Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)
• Effective Date: 10-Dec-2002

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn. Contact
ASTM International (www.astm.org) for the latest information.
Designation: F 692 – 97
AMERICAN SOCIETY FOR TESTING AND MATERIALS
100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Copyright ASTM
Standard Test Method for Measuring
1
Adhesion Strength of Solderable Films to Substrates
This standard is issued under the fixed designation F 692; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope and shall be agreed upon by the parties to the test.
3.3 The flux used is not specified by the test method, and
1.1 This test method covers the determination of the adhe-
shall be agreed upon by the parties to the test.
sion strength of films to substrates by pulling wires soldered to
the films.
4. Significance and Use
1.2 This test method is intended to measure the adhesion of
4.1 Failure of hybrid microcircuits is often due to failure of
metallization to substrates, and not the strength of the solder.
a solder bond. The limiting strength that can be obtained for a
1.3 This test method applies to all films that can be soldered.
solder bond is often the adhesion of the soldered film to the
1.4 The maximum melting point of solder used with this test
substrate.
method is determined by the characteristics of the solder flux.
4.2 This test method can be used for material selection,
1.5 This test method is destructive.
process development, research in support of improved yield or
1.6 This standard does not purport to address the safety
reliability, and specification for material procurement.
concerns, if any, associated with its use. It is the responsibility
4.3 It is not recommended that this test method be used in
of whoever uses this standard to consult and establish appro-
deciding questions between buyers and sellers until the preci-
priate safety and health practices and determine the applica-
sion of the method has been determined by interlaboratory
bility of regulatory limitations prior to use.
comparison.
2. Terminology
5. Interferences
2.1 Definitions of Terms Specific to This Standard:
5.1 If the angle between the direction of the lifting force and
2.1.1 solder interface failure—in microelectronics, a failure
the top surface of the substrate differs from a right angle by
mode in which most of the solder is removed from the film and
more than 5°, the force measured may differ significantly from
no detectable amount of film is removed from the substrate.
that required to achieve operation with a perpendicular con-
2.1.2 solder failure—in microelectronics, a failure mode in
figuration.
which the wire tears through the solder.
5.2 Visible irregularities in the motion of the lifting mecha-
nism may introduce extraneous forces and thus invalidate the
3. Summary of Test Method
test.
3.1 Test specimens, each consisting of a substrate upon
5.3 The presence of vibration or mechanical shock may
which a pattern of square test films, are prepared using
cause the application of an extraneous force and thus invalidate
equipment, materials, and procedures typical of the process to
the test.
be evaluated. Specimens are pre-tinned; wires are centered
5.4 Each specimen presents a thermal mass to the heating
over test pads and held in place with a fixture of low thermal
apparatus. Changes in substrate thickness will require a rede-
mass. Specimens and wires are then soldered using controlled
termination of the time temperature profile.
amounts of solder and flux and controlled heating followed by
5.5 Changes in melting points when using different solder
a 24-h period for stress relaxation. A soldered wire is bent at a
alloys also require a redetermination of the time temperature
right angle from each substrate. The substrate is then restrained
profile.
and supported in an appropriate fixture, and the wire is attached
6. Apparatus
to a lifting mechanism by a grip. The grip and substrate holder
6.1 Bond-Pulling Machine—Apparatus for measuring the
are moved apart until the wire is pulled off the substrate. The
adhesion pull strength, incorporating the following compo-
force applied in order to cause separation is recorded. The
nents:
mode of failure is observed and recorded.
6.1.1 Gripping Means to attach the wire to the lifting
3.2 The solder alloy used is not specified by the test method,
mechanism.
6.1.2 Lifting and Gaging Mechanism for applying a mea-
1
This test method is under the jurisdiction of ASTM Committee F-1 on
sured vertical force to the gripping means with respect to the
Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic
substrate holder. The mechanism shall incorporate a means for
Materials.
recording the maximu
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