ASTM B813-00
(Specification)Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
SCOPE
1.1 This specification establishes the requirements and test methods for liquid and paste fluxes for joining by soldering of copper and copper alloy tube and fittings in plumbing, heating, air conditioning, mechanical, fire sprinkler, and other similar systems.
Note 1--This specification does not apply to fluxes intended for electronic applications.
1.2 Solder fluxes are to be tested in accordance with the requirements of theis specification by an independent testing laboratory. Testing, measuring equipment, and inspection facilities shall be of sufficient accuracy and quality to comply with the requirement of this specification.
1.3 Units--The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.4 The following hazard caveat pertains to Sections 11-19.This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: B 813 – 00
Standard Specification for
Liquid and Paste Fluxes for Soldering of Copper and
Copper Alloy Tube
This standard is issued under the fixed designation B 813; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
INTRODUCTION
This specification covers a series of specific requirements for liquid and paste fluxes. It also
incorporates a series of test methods that establish the procedures on how to measure these properties.
The format of this specification initially defines the specification requirements followed by the specific
test methods in the order in which they are to be performed.
1. Scope B 88 Specification for Seamless Copper Water Tube
B 88M Specification for Seamless Copper Water Tube
1.1 This specification establishes the requirements and test
[Metric]
methods for liquid and paste fluxes for joining by soldering of
B 152 Specification for Copper Sheet, Strip, Plate, and
copper and copper alloy tube and fittings in plumbing, heating,
Rolled Bar
air conditioning, mechanical, fire sprinkler, and other similar
B 152M Specification for Copper Sheet, Strip, Plate and
systems.
Rolled Bar [Metric]
NOTE 1—This specification does not apply to fluxes intended for
B 280 Specification for Seamless Copper Tube for Air
electronic applications.
Conditioning and Refrigeration Field Service
1.2 Solder fluxes are to be tested in accordance with the
B 846 Terminology for Copper and Copper Alloys
requirements of this specification by an independent testing
D 130 Test Method for Detection of Copper Corrosion from
laboratory. Testing, measuring equipment, and inspection fa-
Petroleum Products by the Copper Strip Tarnish Test
cilities shall be of sufficient accuracy and quality to comply
D 1200 Test Method for Viscosity by Ford Viscosity Cup
with the requirements of this specification.
2.3 Other:
1.3 Units—The values stated in SI units are to be regarded
1986 Amendments to the Safe Drinking Water Act
as standard. No other units of measurement are included in this
3. General Requirements
standard.
1.4 The following hazard caveat pertains to Sections 11-19.
3.1 The flux shall be suitable for joining copper tube and
This standard does not purport to address the safety problems,
fittings by soldering in the size ranges shown in Table 1 of
if any, associated with its use. It is the responsibility of the user
Specifications B 88 and B 88M and Tables 4 and 5 of Speci-
of this standard to establish appropriate safety and health
fication B 280.
practices and determine the applicability of regulatory limita-
3.2 The flux shall remain active over the temperature range
tions prior to use.
of the soldering operation, removing and excluding oxides
from the metal surfaces in the joint.
2. Referenced Documents
3.3 The flux shall be suitable for use with all solders listed
2.1 The following documents of the issue in effect on the
in Table 5 of Specification B 32 as well as the more recently
date of materials purchase form a part of this specification to
developed solder alloys suitable for the applications in the
the extent referenced herein:
scope of this specification.
2.2 ASTM Standards:
3.4 The flux shall allow the solder to adequately wet and
B 32 Specification for Solder Metal
spread on the surfaces being soldered.
3.5 The flux residue shall be water flushable after soldering.
3.6 The flux residue shall not be corrosive after soldering.
This specification is under the jurisdiction of Committee B05 on Copper and
Copper Alloys and is the direct responsibility of Subcommittee B05.04 on Pipe and
Tube. Annual Book of ASTM Standards, Vol 02.01.
Current edition approved March 10, 2000. Published May 2000. Originally Annual Book of ASTM Standards, Vol 05.01.
published as B 813 – 91. Last previous edition B 813 – 93. Annual Book of ASTM Standards, Vol 06.01.
2 6
Annual Book of ASTM Standards, Vol 02.04. Available from the Superintendent of Documents, Government Printing Office,
Washington, DC 20402.
Copyright © ASTM, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, United States.
B 813
3.7 The flux shall not release toxic fumes during the 9. Residue Flushing Requirements
soldering operation or toxic substances into the water in the
9.1 Flushing of the residue shall be determined by weight
completed system.
loss.
3.8 The flux shall adhere to the copper and copper alloys
9.2 The loss of weight of each sheet shall be determined by
under anticipated temperature, joint geometry, joint position,
comparing the average weight before and after the test proce-
job site, and weather conditions.
dure. The weight loss of the flux residue shall be more than
3.9 The flux shall not contain more than 0.2 % lead in
99 % in accordance with Section 19.
accordance with the 1986 Amendments to the Safe Drinking
~c 2 a!
Water Act.
% Weight Loss ~d! 5 100 2 3 100 (2)
~b 2 a!
4. Terminology
where:
a 5 weight of degreased, flushing-test sheet, g;
4.1 For terms related to copper and copper alloys, refer to
b 5 weight of degreased, flushing-test sheet plus the
Terminology B 846 for terms specific to this standard.
weight of applied flux, g; and
4.2 Definition:
c 5 weight of dried, flushing-test sheet after flushing, g.
4.2.1 flux, n—a chemically active substance that is used to
remove and exclude oxides from the joint area during heating
10. Sampling
and that ensures that the melted solder will wet the surfaces to
10.1 Samples of flux taken for the purpose of the tests listed
be joined.
in this specification shall be selected from the stock of the
manufacturer and shall be representative of the material being
5. Spreading Factor
evaluated.
5.1 Spreading of the solder is determined by measuring the
height (h) of a solder bead on a standard test sheet following
11. Specimen Preparation
the specified heating cycle. Spread factor (SF) is calculated as
11.1 Standard Quantity of Solder Metal—A standard quan-
follows:
tity of solder metal shall be a sample of 60:40 tin-lead (Alloy
SF 5 100 ~1.0 2 h! (1)
Grade Sn60), measuring 6.0 mm in diameter by 0.86 mm in
thickness, weighing approximately 0.21 g, that has been
where:
degreased with trichloroethylene.
h 5 the maximum height of the solder bead, mm.
11.2 Standard Quantity of Flux—A standard quantity of flux
5.2 A flux is considered to have acceptably influenced the
shall be 0.003 mL as measured by a precision pipet or other
spreading of solder on the copper surfaces when the average
volumetric measuring devices with equivalent precision.
spreading factor is at least 50 (see Section 13).
11.3 Standard Test Sheet—A standard test sheet shall be a
5.3 The spreading test shall show a balanced action by
piece of copper 35 by 35 by 1 mm thick of Copper UNS No.
forming a regular and even solder layer.
C12200 (deoxidized high residual phosphorus) produced in
accordance with Specifications B 152 or B 152M.
6. Aggressiveness Requirements
11.3.1 Preparation:
6.1 From a standard test sheet on which a specimen has
11.3.1.1 The sheet is abraded three times with a waterproof
been prepared with solder (see Section 15), the resistivity of
sand or emery paper (Grit No. 360), each time perpendicular to
the aqueous solution shall be more than 100 000 V cm.
the previous direction. One corner of each test sheet shall be
6.2 From a standard test sheet on which a specimen has
bent upwards to permit handling. It is degreased with calcium
been prepared without solder (see Section 16), the resistivity of
carbonate mixed with water to a paste consistency with which
the aqueous solution shall be more than 85 000 V cm.
the test sheet is rubbed using a wad of cotton. The residue is
flushed off by a strong jet of tap water. The test sheet is
7. Corrosiveness Requirements
considered to be degreased when it is completely moistened by
7.1 There shall be a clear indication that in the areas of flux
water when flushed.
reaction, the sheets shall show a corrosion and residue-free
11.3.1.2 In any of the following steps in which the test
surface comparable with the unwetted areas as determined by
sheets must be handled, use forceps or laboratory tongs. The
visual inspection in accordance with Section 17.
sheet is then etched for 15 s in an etching solution formulated
7.2 Corrosiveness shall be reported in accordance with one
as follows:
of the classifications listed as follows (see Test Method D 130):
(a) Etching Solution—(1-L etching solution contains 200-g
Classification Description chromic acid anhydride (CrO ) and 125-mL sulfuric acid
(specific gravity 1.84) reagent grade, balance distilled water,
1 Slight tarnish
diluted to 1 L.)
2 Moderate tarnish
3 Dark tarnish
(b) Finally, the sheet is rinsed thoroughly with distilled water
(60 to 70°C), immersed in ethanol (ACS Grade), and allowed
8. Viscosity Requirements
to dry.
8.1 The viscosity of liquid fluxes shall be less than 180 s as 11.4 Resistivity Test Specimen—The resistivity test speci-
determined using a No. 2 Ford flow cup in accordance with men is the condition of the standard test sheet on which have
Section 18. been deposited standard quantities of flux and solder metal
B 813
before they are placed in the oven. the assembly for 3 min at a temperature of 275°C in the oven.
11.4.1 Preparation: 13.3.5 After the test specimen has cooled to room tempera-
11.4.1.1 Remove test sheet from the liquid ethanol, allow to ture and been cleaned, measure the solder height by means of
dry, and apply a standard quantity of flux. With a standard a flat micrometer three times, average the values, and calculate
quantity of solder metal, spread the flux to an area of about 15 the spreading factor as in 5.1.
mm in diameter. 13.4 Calculation—After five tests, the highest and lowest
11.4.1.2 Place the test sheet with flux and solder metal in the figures are excluded. Calculate the average of the remaining
oven where it remains for 3 min at a temperature of 275°C three.
from the time the solder melts. Remove the specimen and
14. Aggressiveness Test
allow to cool to room temperature.
14.1 Scope—The aggressiveness of the flux is determined
11.5 Flushing-Test Sheet—The flushing-test sheet is a piece
by means of a resistivity test by measuring the resistivity in V
of copper 10 by 10 by 1.0 mm thick of Copper UNS No.
cm of an aqueous solution of the flux residue. The conductivity
C12200 (deoxidized high residual phosphorus) produced in
cell to be used shall be kept immersed in distilled water at
accordance with Specifications B 152 or B 152M.
ambient temperature for a minimum of 24 h before use.
11.5.1 Prep
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