EN 16602-70-28:2014
(Main)Space product assurance - Repair and modification of printed circuit board assemblies for space use
Space product assurance - Repair and modification of printed circuit board assemblies for space use
The requirements and procedures for repair and modification detailed in this Standard are designed to maintain the rigorous standards set
by the customer for the manufacture and assembly of space-quality printed circuit boards.
This Standard is confined to the repair and modification of singlesided, doublesided and multilayer printed circuit board assemblies.
This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printed
circuits boards.
This standard may be tailored for the specific characteristics and constraints of a space project, in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen für den Einsatz im Weltraum
Assurance produit des projets spatiaux - Réparation et modification des ensembles de circuits imprimés pour utilisation spatiale
Zagotavljanje varnih proizvodov v vesoljski tehniki - Popravilo in spreminjanje plošč tiskanih vezij za vesoljsko uporabo
Zahteve in postopki za popravilo in spreminjanje iz tega standarda so namenjeni ohranjanju strogih standardov, ki jih določa odjemalec za proizvodnjo in sestavo plošč tiskanih vezij za vesoljsko uporabo. Ta standard je omejen na popravilo in spreminjanje enostranskih, dvostranskih in večslojnih plošč tiskanih vezij. Ta standard ne obravnava potencialne potrebe po predelavi, ki izhaja iz popravila ali spreminjanja, ter nesestavljenih (praznih) plošč tiskanih vezij. Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-januar-2015
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SORãþWLVNDQLKYH]LM]DYHVROMVNRXSRUDER
Space product assurance - Repair and modification of printed circuit board assemblies
for space use
Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen
für den Einsatz im Weltraum
Assurance produit des projets spatiaux - Réparation et modification des ensembles de
circuits imprimés pour utilisation spatiale
Ta slovenski standard je istoveten z: EN 16602-70-28:2014
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 16602-70-28
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2014
ICS 49.140
English version
Space product assurance - Repair and modification of printed
circuit board assemblies for space use
Assurance produit des projets spatiaux - Réparation et Raumfahrtproduktsicherung - Reparatur und Modifikation
modification des ensembles de circuits imprimés pour von Leiterplatten-Baugruppen für den Einsatz im Weltraum
utilisation spatiale
This European Standard was approved by CEN on 11 April 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-28:2014 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 9
1 Scope . 10
2 Normative references . 11
3 Terms, definitions and abbreviated terms . 12
3.1 Terms from other standards . 12
3.2 Terms specific to the present standard . 12
3.3 Abbreviated terms. 13
4 Requirements . 14
4.1 Basic requirements . 14
4.1.1 Hazard, health and safety precautions . 14
4.1.2 Materials . 14
4.1.3 Facilities . 14
4.1.4 General . 14
4.2 Repairs . 15
4.2.1 Repair criteria . 15
4.2.2 Number of repairs . 15
4.3 Modifications . 15
4.3.1 Modification criteria . 15
4.3.2 Number of modifications. 16
4.4 Rework . 16
4.4.1 Rework criteria . 16
4.4.2 Number of reworks . 16
4.5 Other requirements . 16
4.6 Removal of conformal coating . 17
4.6.1 Requirements . 17
4.6.2 Procedure . 17
4.6.3 Acceptance criteria. 17
4.7 Solder joint removal and unclinching . 18
4.7.1 Procedure . 18
4.7.2 Acceptance criteria. 18
4.8 Repair of damaged gold-plated areas . 18
4.8.1 Requirements . 18
4.8.2 Procedure . 18
4.8.3 Acceptance criteria. 19
4.9 Repair of damaged conductor tracks . 19
4.9.1 Requirements . 19
4.9.2 Procedure . 19
4.9.3 Acceptance criteria. 20
4.10 Repair of lifted conductors . 20
4.10.1 Requirements . 20
4.10.2 Procedure . 20
4.10.3 Acceptance criteria. 20
4.11 Repair of lifted terminal areas (pads) . 21
4.11.1 Requirements . 21
4.11.2 Procedure . 21
4.11.3 Acceptance criteria. 21
4.12 Terminal post replacement . 21
4.12.1 Requirements . 21
4.12.2 Procedure . 21
4.12.3 Acceptance criteria. 21
4.13 Wire-to-wire joints . 22
4.13.1 Requirements . 22
4.13.2 Procedure . 22
4.13.3 Acceptance criteria. 22
4.14 Addition of components . 22
4.14.1 Requirements . 22
4.14.2 Procedure . 23
4.14.3 Acceptance criteria. 23
4.15 Removal and replacement of axial and multi-lead components. 24
4.15.1 Requirements . 24
4.15.2 Procedure . 24
4.15.3 Acceptance criteria. 24
4.16 Removal and replacement of flat-pack components . 24
4.16.1 Requirements . 24
4.16.2 Procedure . 24
4.16.3 Acceptance criteria. 25
4.17 Modification of component connections . 25
4.17.1 Requirements . 25
4.17.2 Procedure . 25
4.17.3 Acceptance criteria. 26
4.18 Cutting of internal track of a multi-layer printed circuit board . 26
4.18.1 Procedure . 26
4.18.2 Acceptance criteria. 26
4.19 Quality assurance . 26
4.19.1 General . 26
4.19.2 Data . 26
4.19.3 Nonconformance . 27
4.19.4 Calibration . 27
4.19.5 Traceability . 27
4.19.6 Operator and inspector training and certification . 27
Annex A (informative) Removal of conformal coating . 28
A.1 Introduction . 28
A.2 Tools and materials . 28
A.3 Methods for the removal of conformal coating . 28
A.3.1 Method for the removal of polyurethane and silicone-type coating . 28
A.3.2 Method for the removal of epoxy-type coating . 29
Annex B (informative) Solder joint removal and unclinching . 31
B.1 Introduction . 31
B.2 Tools and materials . 31
B.3 Methods for solder joint removal and unclinching . 31
B.3.1 Method for solder extraction with continuous vacuum . 31
B.3.2 Method for solder extraction using sucker . 32
B.3.3 Method for hot jet extraction . 33
B.3.4 Method for the use of wicking braid . 33
B.3.5 Method for unclinching of leads . 34
Annex C (informative) Repair of damaged gold-plated areas . 35
C.1 Introduction . 35
C.2 Tools and materials . 35
C.3 Methods for the repair of damaged gold-plated areas . 35
C.3.1 Method for the removal of solder splatter on gold plating . 35
Annex D (informative) Repair of damaged conductor tr
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